Questions tagged [packages]
In electronics packages refer to the physical encapsulation of a device. Most package names are standardized, so for example a TO-92 package will have similar dimensions and pin spacing between manufacturers so the same PCB footprint may be used. Be aware however many packages have subtle variations, for example TO-206AA, TO-206AB and TO-206AC.
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Is VSSOP-8 packaging any different from SOP-8?
Are these two packaging titles similar with different names or is there actually a difference?
(please provide both sizes in mils if different)
The device in question is a INA821
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I need to identify a component package and, if possible, the component
I need to know haw the package and/or the component of the picture. It is between the VCC supply voltage and the voltage that goes to the rest of the circuit. Apparently it does not behave like a ...
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Are these old graphic controllers all the same die packaged by different manufacturers? [closed]
I am looking at old ISA graphic adapters that would provide a simple black and white text mode. I am trying to make the design as simple as possible and I would like to make the PCB as small as ...
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decoding the symbols of the Abracon series ASTMLP marking
I purchased the ASTMLPE-100,000MHZ-L JET component. I would like to figure out what is encrypted in the component labeling.
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Pins in standard part supporting multiple packages not connected
I have two parts on my board that each support multiple packakes so that it easier to find a fitting part. Both are taken from the libraries that came with eagle
a potentiometer: TRIM_1234-S64YW (...
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How does a "high" current switching regulator/converter handle such high current with such a small package?
The package of this converter is very small but it aparently can handle 24A.
Vishay SiC431 3 V to 24 V Input, 24 A microBUCK ® DC/DC Converter
It does not make sense to me with a pin width of 0.3mm. ...
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Is IC power pin position (V+ / V-) for a package mostly standardized for opamps, comparators, INAs etc.?
Is the power pin position for certain types of ICs standardized or practically, mostly standard? I assume there are rare exceptions and manufacturers could do what they want, but the general answer to ...
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What is this DFN 8-pin package?
Can anyone identify this 8-pin DFN SMD component?
Marking is:
LAAS
N819
417
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Looking for a solution to tape and reeling 01005 components
Current tape and reel causes 01005 size components to move around. How can I have them packaged so they can retain their original orientation?
I've spoken to many reeling houses, any feedback is ...
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Why do some through-hole LEDs have flared leads? [duplicate]
I have worked with many through-hole LEDs over the years. I ordered a bunch for a personal project. I did not notice until I went to solder them onto a PCB that the leads could not be inserted the ...
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How to open hermetic TO packages?
I would like to open a TO-18 can to look at die-bonding/heatsinking and do some electrical experiments with increased airflow. Is there a non-destructive way to do this?
My only thought is to drill a ...
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Off-center parting line?
Older Micron TSOP packages advertise a feature, “off-center parting line.” What does this refer to? Is this a feature of the lead frame? I have heard that OCPL has some vague mechanical reliability or ...
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What kind of package is this? Expected a tsop flash but I don't know
I'm a beginner in the electronics world. I opened this Chinese bootleg Sega genesis cartridge and in the place I expected to find a tsop flash chip I found this kind of adapter board with a package ...
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Can I use LQFP on same TQFP footprint?
I need to order a 32 pin LQFP chip and replace it with another 32 pin TQFP chip so is it ok to replace it or it won't be compatible?
The chip is an STM8S003K3 MCU
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Choosing SMD size for passive components
The passive components like resistors, capacitors, inductors are made up of a multitude of materials and come in a very wide range of package sizes. We could get the same value of resistor, capacitor ...
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MOSFET SOA: Isn't the package current limit-line ambient temperature dependent?
Ref 1 says "The package limit-line will not change in case application conditions such as ambient
temperature vary"
As explained in Ref2, this limit is due to bond wire heating/melting.
If ...
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How to calculate the creepage distance of a package through package outline?
How do I calculate the creepage distance of a package which is not specified by the manufacturer?
By looking at the drawing of the package, could I calculate it? If yes then how?
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Kicad - 0805 Hand soldered package
When I try to select a footprint for an 0805 resistor in Kicad, there are two options.
What is the difference between them and which one do I choose?
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SOIC-8 package in KiCAD
I want to incorporate a chip in my design.
This is the datasheet:
https://datasheet.lcsc.com/lcsc/1809251831_Diodes-Incorporated-AZ34063UMTR-G1_C99659.pdf
It is an 8 pin SOIC package.
When I try to ...
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Package and footprint - Are they correct
In this device, on page 208, the page has the Package outline drawing. 8-pin package. SOIC.
"8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)"
I want the footprint of this ...
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Op-amp packages for PCB
I recently started to PCB design my circuit. Since I am new to PCB design I have some difficulties. I want to know if I can use different op-amp packages for my design. I selected components but they ...
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Can a vertical multiwatt package be bent to lie horizontal after it is installed?
I am working on a project with a multiwatt package audio amplifier IC.
Can this component be bent over to lie horizontal, flush with the PCB, after it is soldered into place?
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Question on "Parts should be used within 5 days after opening." statement on component shipping package
I've been given the task of verifying a batch of ICs from a chinese broker, to see that the chips the company has bought are what the broker claims they are. The package we've received looks like this,...
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Why are there no single logic gates in through-hole packages?
If I'm not mistaken, single logic gates (i.e. a single NOT, OR, NOR, AND, NAND, XOR, etc.) do not exist (anymore?) in through-hole packages.
At least, on Digikey, when searching for active in-stock ...
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Is the larger package better for SMD capacitors?
Is a capacitor with a greater package number better than a smaller package number capacitor with the same voltage and obviously same capacity?
For example, is it true that a 50 V, 100 nF X7R ±10% 1812 ...
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Does the electrical parameters of a packaged transistor change from bare die transistors?
When comparing the electrical parameters of the MOSFET/Transistors, do they change when the package type changes? Are the parasitic parameters of the packaged MOSFET and bare die MOSFET change.
It is ...
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What does the interface between lead(s) and the silicon chip look like inside a semiconductor package?
For a leaded semiconductor, like a diode or a transistor, one of the leads is usually the same piece of metal as the copper pad/heat spreader on the back, which is also shorted to one of the junctions ...
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What is the type of material used for the casing of semiconductors?
I am trying to build some thermal models for leaded and surface-mount diodes and transistors.
Below is a picture of the TO-220 outline I got from the internet. What kind of material is the black part ...
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Identify high-voltage power board component by its packaging and internal structure
A component (perhaps a MOSFET) on a generator inverter board blew up. All that's left are the legs and the heat sink. Is it possible to make a good guess as to the model and the manufacturer, given ...
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Socket or Surface Mount Adapter? (SOP16 to DIP16)
I'm looking to use a HX711 chip (which says it's a SOP-16L package,) and attach it to a circuit on a breadboard.
I've found two ways to do so: a socket or just the adapter.
Is there any difference ...
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Clarification of 'case' in junction to case thermal resistance
Junction to case thermal resistance (Rjc) is a key parameter when characterizing a package. It can be expressed as the temperature difference between the two locations over the heat dissipation.
I am ...
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What does the 'junction' of a silicon semiconductor look like in real-life?
The P-N junction is a small area within a package where heating is most prominent. Junction temperature is a key parameter we try to track when operating a diode or a transistor.
I am wondering what ...
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What does "end stackable" package mean for a MOSFET?
What is the manufacturer trying to say when they say "end stackable" here? They don't seriously mean vertically stacking the DIPs on top of each other in a tower and soldering the leads do ...
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Space-grade flat package SMT
I wonder about space-grade ICs in flat packages.
Space-grade flat package ICs have very long leads compared to the commercial versions.
If I use a flat package IC on my CubeSAT board, can I modify the ...
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What are wettable flanks in semiconductor packages?
What are wettable flanks? Is there any difference between packages with wettable flanks and other leadless packages?
Can we say the package given above has wettable flanks?
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Why do some transistor packages have multiple leads for the emitter?
I want to use a BJT transistor (edit: BFU768F, https://www.nxp.com/docs/en/data-sheet/BFU768F.pdf) that looks like this:
I think I get why lead 1 is bigger than the rest. It's because both collector ...
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I don't know what this dimension means for a diode package drawing
I came across this case number and dimension for a diode, a D1NK60, that I would like to use:
AX057: 3.0 × φ 2.6(mm)
The data sheet is here (document page 31, PDF page 18).
I don't know what phi ...
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Grid size for package creation in Eagle
I am creating a package for the first time, using Eagle for the first time.
I took measurements of the component and these are the dimensions from the center:
How exactly can I achieve these ...
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How is the CQFP64 package supposed to be soldered?
I am currently designing a PCB containing an ATmegaS128 with the CQFP64 package (see picture below and page 460 of its datasheet), but I do not know how it can be soldered. Can the golden frame and ...
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How to ship LQFP 48 chips?
I have a bunch of STM MCUs (LQFP48 package) in hard plastic trays. I need to mail small quantities of them but it is impractical to cut up the trays.
Looking for any suggestions on how to properly ...
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What are the CRYSTAL package types?
Or, you can point me in the right direction :)
I've found HC49 and variants, but no explanation of what the standard is or what the differences are between the different codes [ex. HC49/US, HC49/S, ...
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Can a CPU heatsink be used to cool a TO-3P or a TO-220?
I want to know if my thermal design is appropriate for dissipating 72W of heat while keeping the junction temperature below 150 °C (I am trying to cool an SFH154 that comes in a TO-3P package). My ...
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Has any implementation succeeded to have shared key inside chipset and protect it from exploits?
Since there is a lot of demonstration like using SEM (Scanning Electron Microscope) to read bits from ROM through the scanned image of chipset, is there any implementation that has managed to succeed ...
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Missing row 'I' in package numbering convention: why?
So, I recently discovered a quite painful mistake in my PCB regarding the PGA socket numbering. I have used a row numbered I in my footprint, while the package has ...
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UDFN Package, exposed thermal pad - to ground?
So I've got a design in which I would like to use the AT25SF321B-MHB-T chip by Dialog Semiconductors, but its datasheet does not mention whether the exposed thermal pad should be connected to ground ...
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What's the purpose of these copper tracks on the bottom of BGA package?
These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
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Why do some exposed pads have small tabs, and does my PCB footprint need them?
I've noticed a few component packages now that have small "tabs" on the sides of their exposed pad (thermal pad). One example is the Analog Devices ADM7154 LDO:
Note the 0.356 x 0.457 mm ...
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Why are some SMD components cylindrical?
Outside of fuses or similar socketed parts, why are there cylindrical SMD components - such as this Zener (package DO-213AA):
I feel like this would be a pain in assembly in general, and a nightmare ...
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What are the known ambiguous SMD IC package names?
I just recently discovered (the hard way...) that VSSOP-8 is an ambiguous IC package name. Some manufacturers use this name to describe a 0.65mm pitch device, whereas others use VSSOP-8 to describe a ...
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LM53603 capacitors package size
in my project Im using the LM53603 voltage regulator.
In the datasheet's typical application I see 3 capacitors on both the VIN and ...
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