All Questions
Tagged with packages integrated-circuit
42
questions
0
votes
2
answers
108
views
Is VSSOP-8 packaging any different from SOP-8?
Are these two packaging titles similar with different names or is there actually a difference?
(please provide both sizes in mils if different)
The device in question is a INA821
- 9
1
vote
1
answer
100
views
What kind of package is this? Expected a tsop flash but I don't know
I'm a beginner in the electronics world. I opened this Chinese bootleg Sega genesis cartridge and in the place I expected to find a tsop flash chip I found this kind of adapter board with a package ...
- 13
5
votes
3
answers
2k
views
Question on "Parts should be used within 5 days after opening." statement on component shipping package
I've been given the task of verifying a batch of ICs from a chinese broker, to see that the chips the company has bought are what the broker claims they are. The package we've received looks like this,...
- 607
5
votes
2
answers
627
views
Why do some exposed pads have small tabs, and does my PCB footprint need them?
I've noticed a few component packages now that have small "tabs" on the sides of their exposed pad (thermal pad). One example is the Analog Devices ADM7154 LDO:
Note the 0.356 x 0.457 mm ...
- 2,426
0
votes
0
answers
241
views
TQFP socket for QFP package
I'm trying to get data off of this IC, and I'm having trouble finding a suitable package. In addition, I need to test ~5 of these on the same PCB, so I need to use a socket.
The problem is, I need ...
-2
votes
1
answer
378
views
0
votes
1
answer
108
views
How can I get a full guide to choosing the right IC package?
I often find a variety of IC packages options for one chip.
I select among them randomly according to the availability, despite my concern about the vibration and shock reliability
I googled ...
0
votes
1
answer
63
views
Is it a bug in the design of a low side UCC27524A, and 2EDN7424 gate driver if it doesn't use VDD capacitor?
I am using low-side TI and Infineon gate drivers.
If I don't use a VDD capacitor, then there is a glitch in the output waveform as shown in the figures. It seems it's the designer's or layout problem ...
- 7
0
votes
1
answer
976
views
SSOP package differences
I want to buy an SMD IC.
More specifically, this one:
https://www.ti.com/product/SN74CBT3251#order-quality
I looked at the page and it offers:
SSOP (DB)
SSOP (DBQ)
TSSOP (PW)
I have this IC and i ...
- 1,369
1
vote
1
answer
283
views
Dual Inline Package and Chip
I am checking out for dual-inline packages for my chip (which I want to insert in DIP) and I came across some products from Analog Devices, Texas Instruments and NTK Ceramics. However, NTK Ceramics ...
- 59
1
vote
1
answer
375
views
Why have the same chip in the same package, but with a different number of pins?
STMicroelectronics offers the following two accelerometer chips.
The LIS2DW in a 14 pin LGA package
The LIS2DW12 in a 12 pin LGA package
These two chips are functionally equivalent and have the same ...
- 113
0
votes
2
answers
109
views
Is integrated circuit packaging copyrighted/patented? [closed]
A friend of mine is interested in manufacturing ICs. He wants to know whether the different form types of packages (DIP, LGA, BGA) have intellectual property obstacles to using them. If so, who owns ...
- 103
3
votes
3
answers
854
views
Identifying pin 1 of Analog Devices REF195
I have the Analog Devices REF195GSZ, and it doesn't have a circle on either the top or bottom by a pin to indicate pin 1.
Looks like this:
Which is pin 1? The datasheet didn't seem to help either: ...
- 284
2
votes
2
answers
424
views
Have SO(P)X components 2.54mm, 1.27mm or smaller pin spacings?
I'm a bit confused about the pin spacings of SO8/SOP8.
Example: in Detail 2.54 SOP8, pin spacing is 2.54mm.
However, according to Small_Outline_Integrated_Circuit, fragment:
Small-outline package ...
- 14k
25
votes
2
answers
6k
views
