Questions tagged [bga]
Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.
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Flux residue under BGA - How to remove?
Is there any way to properly remove Flux residue under a BGA package?
Isopropanol won't work here.
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Can the BGA package be centered much better if there are vias in pad for the BGA?
Can the BGA package be centered much better if there are vias in pad for the BGA?
If I have vias like this, should I fill them with solder first?
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Building a DIY BGA Rework Machine
simulate this circuit – Schematic created using CircuitLab
I am trying to build a DIY BGA reflow machine. I have a very crude schematic, but the idea is run each of the 6 heating elements in ...
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How do I select a correct BGA underfill?
Several products we manufacture use fine (0.4mm) pitch BGA devices. In order to improve reliability, we are (by hand) applying BGA underfill to these devices. This is a type of adhesive which flows ...
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How to tune in the right DRC rule for BGA footprint - Altium CircuitMaker
According to JLCPCB, they write that their capability for the clearance between SMD pad and track is 0.2mm.
0.2mm is 7.87401575mil.
If we look at a GBA processor with 0.8mm pitch.
Due to the 0.2mm ...
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Does a BGA connector usually have bigger solder paste than the solder mask opening?
I'm designing a breakout (debug) card for the FPGA Evaluation Board VC707. For this I'm using two FMC connectors (MC-HPC-10), for footprint and design of the connector I got help from the website (...
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Ascertaining that a BGA's decoupling capacitance is good enough
BGA parts often have a large number of power pins in the middle of the package. It is of course important to ensure that the power rail has been sufficiently capacitively decoupled. How can one go ...
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STM32G031Y8Y6TR BGA issue
I want to use STM32G031Y8Y6TR WLCSP(1.86x2.14) package, but I have a problem with routing and I'm looking for your advice.
First, I can not use track width less than 0.09mm, also I can not use via ...
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Off-center via-in-pad
I am designing a board for a 0.8 mm pitch large BGA component. I will be using via-in-pad. There are some differential pairs that need to escape the pin field. The smallest my board house can do (...
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Why is there a difference between pad-to-trace and trace-to-trace clearance?
I am looking to have a PCB produced for a personal project of mine. I have to use very thin traces and tight clearances to escape pads on a BGA chip on my board. I was looking at the capabilities of ...
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How old is too old for BGA chips soldering
I need to buy a batch of UFGBA100 STM32 MCUs from a Chinese broker. I'm concerned that in the quote they specified that the chips will have a date code 19+ (4 years old). How can this affect ...
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Using blind vias for fanouts in GND and power planes
I am designing high density board with high pins count BGA, and hundreds of decoupling capacitors, in that what are the recommendations for using blind vias for fanouts to connect power and GND planes....
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How to escape 0.5mm ball grid array pins?
I have a small hobby project in which I want to include the Kingston EMMC04G-M657 eMMC chip. This chip comes in BGA packaging with 0.5mm pitch between balls. I want my board to be cheap, so I'm laying ...
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Does the AM625 (425-pin FCCSP) have collapsing or non-collapsing BGA balls?
Does the AM6254ATCGGAALW have collapsing or non-collapsing BGA balls?
I've checked the Technical Documentation section, but couldn't find the answer. I guess I'm looking for the wrong term, or not ...
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Can I make BGA pads slightly larger to fit within fab tolerances?
I have a BGA part (specifically, IS61WV51216EDBLL-10BLI from ISSI) that uses 0.24mm pads. Is it possible to resize these pads to 0.3mm without making it impossible to manufacture? The reason I want to ...
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