I would like to open a TO-18 can to look at die-bonding/heatsinking and do some electrical experiments with increased airflow. Is there a non-destructive way to do this?
My only thought is to drill a hole into the side of the can and then use my smallest shears to cut around the perimeter of the can, but I worry that the vibration and debris caused by this will degrade the NPN transistor inside the can. I would like the electrical characteristics of the transistor to still be in-spec after this decapping.