All Questions
6
questions
2
votes
1
answer
121
views
What's the purpose of these copper tracks on the bottom of BGA package?
These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
- 1,430
3
votes
1
answer
239
views
What are my options for packaging a WLCSP IC as a DIP?
Hypothetically, let's say I have a chip in a super small WLCSP or BGA package that I want to have packaged as a plastic or ceramic DIP. No extra components; just the pads brought out to pins.
Are ...
- 341
2
votes
1
answer
1k
views
When should bare die be used instead of QFN/BGA packages?
I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC.
Searching the internet, I have not really found much ...
2
votes
1
answer
2k
views
Pros and Cons of QFN and BGA packages
As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages?
Here is the list I have discovered (please correct me if they are incorrect):
BGA
Pros:
Smaller ...
3
votes
2
answers
3k
views
How to properly define BGA footprint in Eagle?
This question is somewhat relevant to this one. However I am sure it well deserves to be separate.
I created a custom device/symbol/footprint for an ARM MCU. However I am doubtful whether I created a ...
- 535
4
votes
2
answers
4k
views
How are BGA dies constructed?
Are the dies made for a BGA package any different from the dies for a QFN or a DIP Package? Do BGA dies have connections on the lower side of the die? In the substrate?
How are terminals put in the ...
- 1,171