All Questions
Tagged with packages semiconductors
11
questions
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How to calculate the creepage distance of a package through package outline?
How do I calculate the creepage distance of a package which is not specified by the manufacturer?
By looking at the drawing of the package, could I calculate it? If yes then how?
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1
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54
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What does the interface between lead(s) and the silicon chip look like inside a semiconductor package?
For a leaded semiconductor, like a diode or a transistor, one of the leads is usually the same piece of metal as the copper pad/heat spreader on the back, which is also shorted to one of the junctions ...
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120
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What is the type of material used for the casing of semiconductors?
I am trying to build some thermal models for leaded and surface-mount diodes and transistors.
Below is a picture of the TO-220 outline I got from the internet. What kind of material is the black part ...
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Clarification of 'case' in junction to case thermal resistance
Junction to case thermal resistance (Rjc) is a key parameter when characterizing a package. It can be expressed as the temperature difference between the two locations over the heat dissipation.
I am ...
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11
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3
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What does the 'junction' of a silicon semiconductor look like in real-life?
The P-N junction is a small area within a package where heating is most prominent. Junction temperature is a key parameter we try to track when operating a diode or a transistor.
I am wondering what ...
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2
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1
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What are wettable flanks in semiconductor packages?
What are wettable flanks? Is there any difference between packages with wettable flanks and other leadless packages?
Can we say the package given above has wettable flanks?
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Has any implementation succeeded to have shared key inside chipset and protect it from exploits?
Since there is a lot of demonstration like using SEM (Scanning Electron Microscope) to read bits from ROM through the scanned image of chipset, is there any implementation that has managed to succeed ...
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Is it a bug in the design of a low side UCC27524A, and 2EDN7424 gate driver if it doesn't use VDD capacitor?
I am using low-side TI and Infineon gate drivers.
If I don't use a VDD capacitor, then there is a glitch in the output waveform as shown in the figures. It seems it's the designer's or layout problem ...
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2
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Is there any research for chemical/structural method to prevent observing beneath chip packaging? [closed]
I want to prevent others from reverse-engineering the on-die ROM, using X-ray, microscope, etc..
I think it's best to inject some substance between chip and packag and when the chip package is ...
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What is the significance of numbers (2,3) mentioned in SOT23?
Small outline transistor (SOT) packages have certain numbers which tell the package size, for example, SOT23 or SOT323. But what is the meaning of suffix 23 or 323?
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How do I know how many dies are contained in a certain package?
For example, an IL485E that has a 16 SO(W) package -- how many dies are in the device?
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