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1 vote
0 answers
50 views

MOSFET SOA: Isn't the package current limit-line ambient temperature dependent?

Ref 1 says "The package limit-line will not change in case application conditions such as ambient temperature vary" As explained in Ref2, this limit is due to bond wire heating/melting. If ...
Dynamic_equilibrium's user avatar
0 votes
0 answers
49 views

How to calculate the creepage distance of a package through package outline?

How do I calculate the creepage distance of a package which is not specified by the manufacturer? By looking at the drawing of the package, could I calculate it? If yes then how?
Alison's user avatar
  • 347
0 votes
2 answers
86 views

Does the electrical parameters of a packaged transistor change from bare die transistors?

When comparing the electrical parameters of the MOSFET/Transistors, do they change when the package type changes? Are the parasitic parameters of the packaged MOSFET and bare die MOSFET change. It is ...
Ishani Engineeŕ's user avatar
1 vote
1 answer
65 views

Identify high-voltage power board component by its packaging and internal structure

A component (perhaps a MOSFET) on a generator inverter board blew up. All that's left are the legs and the heat sink. Is it possible to make a good guess as to the model and the manufacturer, given ...
tavr's user avatar
  • 53
10 votes
2 answers
1k views

What does "end stackable" package mean for a MOSFET?

What is the manufacturer trying to say when they say "end stackable" here? They don't seriously mean vertically stacking the DIPs on top of each other in a tower and soldering the leads do ...
DKNguyen's user avatar
  • 56.9k
4 votes
3 answers
1k views

What can I do about using incorrect P-FET package?

I just got a PCB in I designed from fab, and I quickly discovered I made a mistake in the design. I'm using a P-channel MOSFET, D2PAK, as a high-side switch. Its pinout is (1) gate, (2) drain, (3) ...
matth's user avatar
  • 127
1 vote
2 answers
1k views

MOSfet thermal design: die-to-package always DRAIN?

All the MOSfet chips seem to have substrate = DRAIN, which means that the heat-dissipation path goes that way. It is assumed that the package DRAIN pin would conduct away most heat from the package to ...
glen_geek's user avatar
  • 26.7k
3 votes
1 answer
3k views

N Mosfet with 8 pinout

I was wondering why some MOSFET transistors like This one has 8 pinout instead of 3 ?
joe billy's user avatar
  • 325
0 votes
1 answer
229 views

decapsulating a MOSFET to create a bulk terminal

In my project, I would be using NMOS' and it would be very handy for me to have a bulk terminal. Since my choices of NMOS parts don't have bulk terminal, I was wondering if I could somehow decapsulate ...
Majin_Boo's user avatar
  • 187
5 votes
2 answers
649 views

MOSFET package with lower thermal resistance than D2PAK

As far as PCB surface mount MOSFET packages go, does D2PAK generally have the lowest thermal (junction to ambient) resistance? Are there other packages with lower \$R_{jc}\$? This question is based ...
hassan789's user avatar
  • 2,116