Questions tagged [packages]
In electronics packages refer to the physical encapsulation of a device. Most package names are standardized, so for example a TO-92 package will have similar dimensions and pin spacing between manufacturers so the same PCB footprint may be used. Be aware however many packages have subtle variations, for example TO-206AA, TO-206AB and TO-206AC.
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What's the purpose of these copper tracks on the bottom of BGA package?
These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
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Why do some exposed pads have small tabs, and does my PCB footprint need them?
I've noticed a few component packages now that have small "tabs" on the sides of their exposed pad (thermal pad). One example is the Analog Devices ADM7154 LDO:
Note the 0.356 x 0.457 mm ...
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Why are some SMD components cylindrical?
Outside of fuses or similar socketed parts, why are there cylindrical SMD components - such as this Zener (package DO-213AA):
I feel like this would be a pain in assembly in general, and a nightmare ...
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What are the known ambiguous SMD IC package names?
I just recently discovered (the hard way...) that VSSOP-8 is an ambiguous IC package name. Some manufacturers use this name to describe a 0.65mm pitch device, whereas others use VSSOP-8 to describe a ...
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LM53603 capacitors package size
in my project Im using the LM53603 voltage regulator.
In the datasheet's typical application I see 3 capacitors on both the VIN and ...
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SMT PCBA production
I am interested in setting up an SMT factory for producing PCBA. I have researched and know the whole assembly process such as solder paste application, reflow oven, etc. Regarding the packaging of ...
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Why do many old ceramic packages have a gold line?
I noticed a lot (but not all) of ceramic packages seem to have a gold line.
What is the function of this line? (I'm not talking about the soldered cap that the die will be placed under, but the gold ...
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What can I do about using incorrect P-FET package?
I just got a PCB in I designed from fab, and I quickly discovered I made a mistake in the design. I'm using a P-channel MOSFET, D2PAK, as a high-side switch.
Its pinout is (1) gate, (2) drain, (3) ...
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TQFP socket for QFP package
I'm trying to get data off of this IC, and I'm having trouble finding a suitable package. In addition, I need to test ~5 of these on the same PCB, so I need to use a socket.
The problem is, I need ...
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Three different dimensions shown in package drawing, what do they mean?
I have an IC that uses this package from analog devices: https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_5.pdf.
Most of the dimensions are shown in three numbers:
I ...
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How can I get a full guide to choosing the right IC package?
I often find a variety of IC packages options for one chip.
I select among them randomly according to the availability, despite my concern about the vibration and shock reliability
I googled ...
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How to identify pin 1 from mechanical design
Looking at 10142048 datasheet from TE I'm not sure how to identify pin 1 from top side.
At page 9 there are the pin assignments from bottom side only.
Now, I guess:
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RF Amplifier GND/VCC Connector [duplicate]
Is there a standard connector used to connect the ground/supply pins on an RF amplifier to a power supply? For example, many RF amplifiers (also attenuators) I've seen use two pins like this:
But I ...
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Is it a bug in the design of a low side UCC27524A, and 2EDN7424 gate driver if it doesn't use VDD capacitor?
I am using low-side TI and Infineon gate drivers.
If I don't use a VDD capacitor, then there is a glitch in the output waveform as shown in the figures. It seems it's the designer's or layout problem ...
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