Questions tagged [manufacturing]
The manufacturing tag has no usage guidance.
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Need help understanding how motors, sensors and other components of a prototype design factor into certifications for industry sale [closed]
I have built a prototype and I now need to create a production prototype that I can use as my template for a small 10-15 product unit batch order. I am in the United States where I plan to market ...
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Do Professional Manufacturers Violate IPC Standards?
I lay out simple boards using BGA packages and often ignore my EDA tool's courtyards. I know these courtyards are set by IPC standards to allow for good design, but then I look at boards like the ...
user167743
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Accuracy of manufactured photocells (LDR) with respect to light intensity
I was looking through photocell (photoresistors) datasheets, like for instance the NORPS-12, especially the graphic on resistance value versus light intensity.
In no datasheet could I find information ...
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How to bond PCB and metal for high power RF boards
I want to bond a PCB (2 layer & 0.6mm thickness) to a metal (copper & 4mm thickness.) Could anyone help me with the process of bonding it? There is a power amplifier that has to be soldered ...
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What exactly makes small quantity PCB production costly compared to large quantity PCB production?
The per-PCB cost of manufacturing a small number of PCB is 10 times or more compared to the per-PCB cost of manufacturing a large number of PCBs.
So what is it exactly that adds to the cost?
People ...
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Bed-of-nails testing of ethernet signals
I'm designing a BON testing fixture for a complex board (multiple processors, fpga, memory, etc).
One of the items to test is an external ethernet connection (1Gb). In the current design, the ethernet ...
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Why are the heatproof composites used for semiconductor packages never used for coil formers, connectors and switches?
It is very hard to destroy the material normally used for "plastic" IC and transistor packages with IR or hot air soldering tools, unless you apply a measure of heat that would reliably ...
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How to Design method to Program & Calibrate a Panel of PCBs
I'm designing a sensor-package PCB which needs to be programmed and calibrated while still in a panel of 10.
I'd like to avoid a large bed-of-nails type setup for this step so that the panel can ...
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Quintic QN8007B RoHS information?
We are planning to use the Quintic QN8007B FM transmitter in our new design because it is quite cheap and has I2S interface. I believe this chip is no longer produced, but it is possible to get hold ...
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Reducing Thermal Pad Size Below Official Footprint - Can It Create Manufacturability Problems?
I'm using a DP83867 Ethernet chip by Texas Instruments in an S-PQFP-G64, 10 x 10 mm package, the mechanical dimension and its recommended footprint are shown at the end of the question. As shown, the ...
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Is it hard to do 2 sided SMD PCB in oven?
As far as I am aware, and please correct me. If we have a 2-sided PCB with SMD components on the top and also bottom, first we shall put components on the top side and solder them and then on the ...
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How does manufacturer determine initial tolerance for capacitors?
Short version: I understand resistor initial tolerance is commonly obtained through sorting process where manufacturer only picks resistor that has resistance within the advertised initial tolerance. ...
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Why don't we make CPUs with 1000s of layers to make use of space in the third dimension?
I am wondering why don't we make processors such as CPUs with 1000s of stacked layers to make use of space in the third dimension now that we have three-dimensional transistors. To be clear I'm ...
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Finding manufacturer of product based on certifications
I really do not know where to ask this question so I am starting here. If you believe there is a better place let me know and I will gladly move post.
I bought an induction cooktop from amazon and ...
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Why have the same chip in the same package, but with a different number of pins?
STMicroelectronics offers the following two accelerometer chips.
The LIS2DW in a 14 pin LGA package
The LIS2DW12 in a 12 pin LGA package
These two chips are functionally equivalent and have the same ...
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Do I need to Reduce the Width of a Power Trace for Thermal Relief When it's Passing Through a Pin on the Chip?
I'm routing a PCB. Currently, all power traces are 20 mils. A QFP chip on the board requires multiple voltage rails to operate, I found the easiest solution is passing a power trace through a pin on ...
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Unknown logo on FGS25N120ANTD IGBTs. Which semiconductor manufacturer is this?
I bought 5 FGS25N120ANTD IGBTs from my local vendor a while back.
I was unable to identify the manufacturer, based on the logo.
Can somebody help me out?
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Thermal reliefs for via-in-pad under BGA?
I'm doing the layout of a high-speed (Multi gigabit) system based on an FPGA with more than a thousand BGA pads and 0.8mm pitch on a 10-layer board. I'm using via in pads that will be copper-filled ...
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Is infrared photoemission from silicon used in IC manufacturing diagnostics?
In the video Why all solar panels are secretly LEDs (and all LEDs are secretly solar panels) a silicon photovoltaic cell from a calculator is purposefully damaged and then a 36 V bias is applied. When ...
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How do you make custom THT (through-hole) connectors?
I have a project that requires a connector that is no longer manufactured which would interface with an old device. For prototyping, I have been salvaging this connector from old peripherals that used ...
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What is the minimum die area of a chip?
Silicon chips are made by slicing up wafers; in general, the fewer transistors a design needs, the smaller the area it needs, so the more chips you get out of a wafer, and the lower the cost per chip.
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Which is better - components on both sides or components on one side of the PCB?
I am working on a PCB design. 50k PCBs will be produced.
SMD components: 100
Through-hole components: 25
I need to minimize PCB size. There are no high-speed signals or sensitive signals in the ...
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Creating random PCB ID via manufacturing process
I often purchase prototype PCBAs on the order of five to twenty pieces and need to uniquely identify them sans software. I usually just whip out a permanent marker and label ...
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Hi Pot / Dielectric Pass/Fail Recording
I just graduated last year with an Electrical Engineering degree. Currently pursuing a Masters's Degree, so I am fairly new to design.
We have several HiPot Testers we use on the manufacturing line. ...
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Providing Schematics to a Contract Manufacturer?
A contract manufacturer mentioned the types of the files that they need in order to build and assemble boards. He indicated that they need the schematics along with gerbers, drill files, bom etc..
Is ...
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Specifying BOM substitutions / alternatives with Contract Manufacturer (CM)
I fear this question may be opinion based but I think it has some value to the general community - because this falls into the end of the design phase.
When working with a CM, they may have better ...
- 12k
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Is it possible to manufactrure a stencil for this paste-mask using the usual stencil making methods?
I have this footprint from the KI-CAD footprint library (LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias).
The paste-mask shows several circular paste areas under the thermal pad. The separation ...
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LoRa and Manufacturing Technology
Which manufacturing technology do the LoRa (Semtech SX1276) belong to? Is it a CMOS based chip?
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Decreasing manufacturing variance in analogue designs
I'm designing some modular sensors for my company's internal testing. Most are analogue, with a sensor (PT100, current shunt, pressure transducer etc), some interfacing (REF200 based PT100 circuit for ...
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PCB Thickness Variability
How much variability is there in the thickness of a standard PCB?
Let's say I order a 1.6mm FR-4 board. Will the actual thickness range 1.5mm-1.7mm? 1.4mm-1.8mm? 1.59mm-1.61mm? What is the (...
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