Questions tagged [microfabrication]
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On different well processes (fabrication process)
My textbook (Weste and Harris's CMOS VLSI Design) is trying to explain to me the nature of fabricating wells in the twin-well and triple-well processes. My question here is about how we can use so few ...
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Why do we use LDD technique in IC fabrication technology?
Why do we use LDD(lightly doped drain) in IC fabrication technology?
In the "silicon VLSI technology" book, was mentioned that this is in order to create a voltage drop in drain region. So ...
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Difference between arsenic and phosphorus in IC fabrication technology
What is the difference between arsenic and phosphorus in IC fabrication technology? When do we prefer one of them over the other?
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Is a cylindrical GAAfet fabricated with lithography and etching?
The GAAfet, aka the surrounding gate transistor (SGT), is basically a FinFET that surrounds the channel on all 4 sides instead of 3. However, a lot of examples show a cylinder instead of a rectangle.
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What is the "dangling transistor" in this operational amplifier equivalent schematic?
I was comparing the datasheets for the three related CMOS Op Amps from TI: TLC2252, TLC2262, and TLC2272. TLC2252 is the micropower version; TLC2272 is the high-performance version; TLC2262 is ...
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Is there any specific application for an indirect band gap semiconductor?
I know that direct band gap semiconductors are very attractive for optical emission, and even though indirect band gap are used as well, I keep wondering: is there any technology that specifically ...
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Shared IC tape out
I have a IC design about 300*300 micrometers. Due to the high cost of IC tape out, is it possible to fabricate the IC jointly with other people?
Does the company have such a service?
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Dry or wet etching in fabrication cmos chip?
What types of etching are used in conventional chip fabrication technologies such as TSMC 0.18, dry or wet?
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What is the pad-etching process in standard CMOS fabrication process
What is the pad etching process?
Is it possible to etch to the bottom metal layers or vias in standard CMOS fabrication?
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What's the use of bonding pad assignments?
This is not the first time that I've seen a bonding pad diagram like this on chip data sheets:-
But this is inside the chip, so why do we care? And is it of interest that the chip die is 15 mils ...
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Does melting microwires cause internal shorts
If you overheat a chip, you can melt the microwires attaching the wafer to the package. When this happens, can the melted microwires cause shorts between the pins of the chip, inside the package of ...
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Decreasing phase noise of natural oscillators by passive resonant filter on-chip in the MHz regime
I was doing a literature research on microwave filters and to me it looks like passive SAW filters/resonators have the highest quality factor below 1.5 GHz, but with a high power loss. Coupled planar ...
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How are integrated circuit photomasks fabricated with such high resolution?
I understand that photomasks / photoreticles are used for the fabrication of integrated circuits, CPUs, and such. I also have read that CAD software and languages like VHDL are used to describe the ...
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How do we extract the etchant after it is stopped at the boron layer in MEMs fabrication process?
Dopant-Selective etch stop method is where we create a layer of highly doped boron in the substrate to stop the etching process at that exact layer, but when that cavity is created the etchants are ...
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Can you approximately detect the closure of up to 100,000 switches using a resistor chain?
Consider the following outline circuit:-
It is a series of switch controllers that can short out parts of a chain of serially connected resistors. The short is accomplished with a BJT or MOSFET. A ...
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