The GAAfet, aka the surrounding gate transistor (SGT), is basically a FinFET that surrounds the channel on all 4 sides instead of 3. However, a lot of examples show a cylinder instead of a rectangle.
I've been searching for info about them for days, but cannot find any overview of the manufacturing process. The only ones I can find that are being built in bulk appear to be rectangular. Example Samsung's MBCFET.
So basically my question is, how are cylindrical GAAfets manufactured? Is there a lithography and etching process? If so I don't understand how it reaches all around the cylinder. Light can only come from one direction at a time, and you need to be able to build/etch the entire wafer at once.
Note: I'm not asking for a full course on device physics and semiconductor fabs. I have spent some time reading about them, and I can find tons of info about traditional manufacturing process. But I cannot find anything, or hardly anything, about manufacture process for cylindrical GAAfet.
One more thing. I have heard of silicon nanowires. My understanding is that they're manufactured in bulk as discreet objects. To then take those and mechanically place them onto a wafer seems...infeasible. It would take an eternity to set and "solder" 10 billion of them.