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Questions tagged [dfm]

Design For Manufacturing - Principles and techniques that are used to ensure that a product is more easily manufactured, has higher yield during manufacture and/or exhibits lower cost of manufacturing. May be accomplished through choice of components, extra circuits for testing through to mundane issues like space for fixturing and labeling amongst many other techniques.

2 votes
3 answers
610 views

Is there a rule of thumb or an IPC standard for reducing (windowing) solder paste deposition on exposed pads?

I am creating a footprint for a 24-pin QFN package with exposed thermal pad. Sometimes manufacturers will provide solder paste mask guidelines in addition to metallization for the landing pattern, but ...
JYelton's user avatar
  • 34.3k
2 votes
1 answer
234 views

What determines the choice of maximum material condition (MMC) versus least material condition (LMC) when designing a BGA footprint?

I am evaluating the IPC-compliant footprint wizard in Altium Designer. One of the steps is to determine the pad size relative to the nominal ball diameter: Related to this topic, an answer provides a ...
JYelton's user avatar
  • 34.3k
4 votes
1 answer
245 views

What is the purpose of these unusual IC footprint features?

I am working on creating a footprint for the MAX25254 buck regulator and am puzzled by several inconsistencies which are proving annoying: Inconsistent pad sizes Seemingly unnecessarily complicated ...
JYelton's user avatar
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2 votes
2 answers
165 views

Are my tracks too close?

I'm working on a digital circuit that I plan to run at ~1MHz. After finishing the PCB I looked back at my work and saw that my tracks are quite close. For a size reference, the tracks are 0.254mm ...
Matthew's user avatar
  • 21
0 votes
0 answers
77 views

TQFP fanout for DFM / AOI

I've often heard a couple of "good practices" for TQFP/QFN ICs fanout: Do not route corner pins at 90°, instead the track must come straight to the pin: Do not short the signals directly ...
romain145's user avatar
  • 131
0 votes
1 answer
189 views

Surface Treatment choice for edge connector

So I have an edge connector that according to Alibaba Chinese salesman has tin-plated terminals (datasheet a bit unclear). I am making a product where I am inserting a PCB into an edge connector and I ...
mannen's user avatar
  • 29
11 votes
5 answers
3k views

Does the PCB have to be thinner than through-hole pin length?

If I have a part that has pins that are 1.2mm long. Can I use a PCB that is 1.2mm thick or does it need to be even thinner than that?
the five states's user avatar
0 votes
2 answers
822 views

Best way to heat sink many resistors

I have a PCB design with a long row of 1206 power resistors. Although only a few of them will be active at a time, they can dissipate up to 1 watt each, so I would like to heat sink them. If they get ...
Drew's user avatar
  • 7,119
0 votes
1 answer
96 views

Local fiducial placement

I'm working on a prototype that has a few fine pitch (0.5mm) components. I'm thinking about adding local fiducial marks for these components as an afterthought. My idea was to place them close to the ...
Lars Hankeln's user avatar
  • 2,782
3 votes
1 answer
2k views

Best practice for ICT test point locations

While I have found a few resources (here here here) describing the coverage (strive for 100 %!), distribution (avoid clustering, at least 100 mil apart, away from tall components), and size (40 mil if ...
calcium3000's user avatar
  • 2,516
0 votes
1 answer
253 views

Understanding Transition faults

I learned that the transition faults model checks whether data transition meets the clock or not Transition Faults : Assumes large delay defect concentrated at one logical node, such that any ...
user avatar
0 votes
2 answers
127 views

How to automatically assemble lithium polymer battery?

I'm redesigning a product for automatic assembly (DFA / DFX). The current product includes a lithium polymer battery with solderable leads, very similar to this: Right now the leads are hand-...
Alex I's user avatar
  • 3,491
3 votes
1 answer
238 views

How close can BGA packages be placed to each other? [closed]

I'm wondering if there is some rule of thumb about how close different BGA packages can be placed to each other. What limits that besides pick and place accuracy? I'll ask a few board assembly ...
Alex I's user avatar
  • 3,491
1 vote
3 answers
7k views

SMD LED Orientation From Top

Is there a way to determine the orientation of the LED in the image below? The blue squares in the corners seem like they are denoting the orientation however it's not marked in the datasheet. This ...
MattCochrane's user avatar
0 votes
1 answer
880 views

Do 0402 chip component need solder mask web between the pads?

In my board, all 0402 parts are using gang solder mask. The pad to pad distance is 10 mils. Is there any risk of solder short? Do I need to suggest applying solder mask web between the pads for all ...
fatjay's user avatar
  • 53

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