This brochure gives introduction of MYIR Electronics company and MYIR's products and services.
MYIR Electronics Limited (MYIR for short), established in 2011, is a global provider of embedded System-On-Modules (SOMs) and
comprehensive solutions based on various architectures such as ARM, FPGA, RISC-V, and AI. We cater to customers' needs for large-scale production, offering customized design, industry-specific application solutions, and one-stop OEM services.
MYIR, recognized as a national high-tech enterprise, is also listed among the "Specialized
and Special new" Enterprises in Shenzhen, China. Our core belief is that "Our success stems from our customers' success" and embraces the philosophy
of "Make Your Idea Real, then My Idea Realizing!"
HCFA is a Chinese company established in 2011 that focuses on industrial automation products including controllers, drives, sensors, electromechanical devices, and information systems. It has over 1000 employees, 4 R&D centers, and provides products to over 5000 customers in industries like electronics, lithium batteries, robotics, and machine tools. HCFA emphasizes innovation, integrity, and service.
Black Box India_Corporate_Deck_May23-Slideshare.pdf
Black Box® is a trusted IT solutions provider delivering cutting-edge technology solutions and world-class consulting services to businesses around the globe. The breadth of our global reach and the depth of our expertise accelerate customer success by bringing people, ideas, and technology together to solve real-world business problems. Our IT infrastructure solutions, services, and products enable secure, flawless connectivity and meaningful collaboration for businesses in every major market sector on six continents.
For more information please visit - https://www.blackbox.com/en-us/discover-bb/about-blackbox
Littelfuse is the number one global provider of circuit protection solutions. They have grown from a small company with one fuse product into a leader in circuit protection through a customer-focused approach of developing innovative solutions to meet unique customer needs. Littelfuse has built the broadest circuit protection portfolio in the industry and a global footprint that allows them to work closely with customers. Their expertise, portfolio of products, and partnership approach position them to be a single-source provider of circuit protection solutions for customers around the world.
This document proposes a CCTV surveillance system for Tranter IT that includes outdoor and indoor cameras, a 32-channel DVR, power supplies, cables, TVs, an inverter, UPS, and installation. The system will provide remote monitoring, motion detection, daily recording storage and backup. Cameras will be strategically placed around the premises for comprehensive coverage. Implementation will take 2 weeks. A quotation for N1,005,585 is provided for the necessary equipment and installation. Approval from Tranter IT is requested to proceed.
The document lists the top 10 VLSI companies in India. Some of the top companies include Texas Instruments, which develops analog and digital signal processing technologies; SiliconMentor, which strives to empower engineering students with VLSI and embedded systems knowledge; and Analog Devices, a global leader in analog design and manufacturing. Other top companies are Cypress Semiconductor, Broadcom Corporation, Cisco Systems, Horizon Semiconductors, Einfochips, HCL Technologies, and Trident Tech Labs.
Cisco Tech Advantage Webinar. June 4th, 2014
Video: http://youtu.be/RkmMi9qea5Y
IoT is everywhere, from smart meters on houses to parking sensors in the ground – all devices are connected to the Internet. Internet engineers are helping traditional industries solve new industrial world challenges by connecting billions of new devices. An exciting part of the IoT journey is the integration between both worlds: Information Technology (IT) and Operation Technology (OT). For that a systems approach is required to scale the existing Internet infrastructure to accommodate IoT use cases, while making IT technology easy to adopt for OT operators.
In this session you will learn:
IoT infrastructure challenges and the need for open standards and partner ecosystem
Key elements to build large-scale IoT systems as IPv6, access control, plug and play, distributed intelligence and contextual awareness
Introduction to fog computing and advantages of extending cloud computing and services
Looking ahead to the future
Micro Machine Company is a precision machining company that has served customers for over 40 years. They blend technology with high craftsmanship and attention to detail from trained professionals. All employees, from engineers to shipping, are committed to zero defects. Micro Machine offers medical devices, components, and assemblies to exacting standards at competitive costs.
Micro Machine Company is a precision machining company that has served customers for over 40 years. They blend technology with high craftsmanship and attention to detail from experienced machinists. The company culture emphasizes zero defects from beginning to end of the manufacturing process. Micro Machine can offer precision components at competitive costs while meeting customers' exacting quality standards and specifications.
T-tel Communications is an emerging technology distributor of network infrastructure solutions, audio/video products, and telecommunications products based in Bangalore, India. It has been in business for over 6 years and has over 50 employees across multiple branch offices. T-tel specializes in supplying communications infrastructure products for IT, broadcasting, audio/visual, and telecommunications industries. It represents several global technology brands and aims to provide customers with world-class, cost-effective solutions and support.
Enterprise World 2014 - Manufacturing Industry Breakout Session
This presentation discusses the latest digital disruption related trends across the manufacturing industry and how OpenText's Enterprise Information Management solutions can help manage this digital disruption in the future. This presentation formed the basis of the manufacturing industry keynote session at Enterprise World 2014 in Orlando.
Vtech cms divisonal presentation may 2014 represented by htcs
Following VTech's Press Release, covering their Annual Financial Report for FY 2014, the new CMS Divisional Presentation has been published as well. Contact HTCS, LLC for further details, send us an email:
Rolf.Seichter@HTConsultingServices.com
This document provides an overview of Eternity Group, a professional electronics manufacturing services company. Some key details include:
- It was established in 2003 and has grown to 1200 employees with over 20,000 square meters of plant and office space.
- It provides integrated OEM/ODM services for mobile terminals and has certification in quality management and medical device standards.
- Core services include design for manufacturing, procurement, assembly, quality assurance, and after-sales support.
- It has strong production capabilities for mass production and stable quality control processes.
ConnectM is a leading, global Machine-to-Machine (M2M) Technology Solutions, Business Intelligence (BI) and Services Company headquartered in Bangalore, India. With over 70,000 assets connected, ConnectM's Solution Delivery Platform(SDP) is a robust and proven technology. Our Pre-built applications are leveraged by over 40 customers to manage their assets/machines. ConnectM SDP and applications along with devices from its eco-system partners offer the customer a one-stop-shop for M2M needs.
ConnectM has delivered M2M solutions to various domains including Telecom, Energy, Utilities, Industrial, Construction, IT/ITES Enterprises and Transportation market segments.
ConnectM's solutions are powered by cutting edge M2M technology, and are designed to make significant, sustained and measurable business impact. ConnectM also offers services to its client to build complete solutions. ConnectM's strength is in its ability to offer domain specific analytics on the data collected and deliver actionable business intelligence.
Efficient Solutions For The Courier Express And Postal Industry
SICK provides sensor solutions for various stages of the courier, express, and postal process including unloading/inbound, safety, induction, identification, dimensioning/weighing, sorting, outbound/loading, and building surveillance. Key applications include safety scanners to protect workers during unloading, handheld and automated scanners for identification, dimensioning systems for measuring parcels, and sensors to ensure safe and efficient sorting. SICK offers a wide range of products and services to help courier companies meet challenges in efficiency, security, sustainability and more.
The solar energy is the best energy as it does not release any type of the harmful gases that affect the green house. The solar panels are the environmental friendly when compared to the other devices for generating energy. If you are living in Pakistan and want to install the solar in Pakistan, then there is plenty of solar panel available over the market from where you can search the best one according to voltage need. The solar panel is less expensive and easy to use for longer time.
Here are some of the steps to buy the solar panel
<a>Solar IN PAKISTAN </a>
The solar energy is the best energy as it does not release any type of the harmful gases that affect the green house. The solar panels are the environmental friendly when compared to the other devices for generating energy. If you are living in Pakistan and want to install the solar in Pakistan, then there is plenty of solar panel available over the market from where you can search the best one according to voltage need. The solar panel is less expensive and easy to use for longer time.
Here are some of the steps to buy the solar panel
<a>Solar IN PAKISTAN </a>
The MYC-YF13X CPU Module Overview gives introduction of the STM32MP135 processor based System-on-Module from MYIR, a Chinese company focused on providing SoM solutions for embedded appilcations. Measuring only 37mm by 39mm, the MYC-YF13X module has integrated the STM32MP135DAF7 processor, DDR3L, external memory and carried out a variety of peripheral and IO signals through the 1.0 mm pitch 148-pin Castellated-Hole expansion interface. It is capable of running Linux and provided with software resources including kernel and driver source code, together with detailed user manual and documentations to help customer start their development rapidly. It is particularly suitable for applications such as entry-level industrial human-machine interfaces (HMI) and embedded devices for energy and power management.
MYIR also provides the MYD-YF13X Development Board as a starter kit for evaluating the MYC-YF13X CPU Module. It has a versatile base board to facilitate the expansion from the MYC-YF13X through the 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) interface, a rich set of peripherals and interfaces have been brought out such as RS232, RS485, two USB 2.0 HOST and one USB 2.0 OTG, two Gigabit Ethernet, CAN, one Micro SD card slot, one USB based Mini-PCIe 4G Module interface with one SIM card holder, LCD interface, Camera interface, Audio input and output as well as two extension headers.
More information about the MYC-YF13X CPU Module can be found at:
https://www.myirtech.com/list.asp?id=726
The MYD-YT507H Development Board consists of a compact CPU Module MYC-YT507H and a base board to provide a complete evaluation platform for ALLWINNER T507-H Processor which among Allwinner T5 series with a 1.5GHz quad-core Cortex-A53 CPU and a Mali-G31 MP2 GPU. The processor is AEC-Q100 certified and targets the new generation of automotive markets. Typical applications are power IoT, automotive electronics, commercial display, industrial control, medical devices, intelligent terminals and more others.
The MYD-YT507H has a base board which installed MYC-YT507H CPU Module through 1.0mm pitch 222-pin stamp-hole (Castellated-Hole) interface. The MYC-YT507H CPU Module is a highly-integrated SoM which combines the ALLWINNER T507-H processor, 1GB/2GB DDR4, 8GB eMMC, 32Kbit EEPROM and PMIC. The base board is explored with Serial ports, one Gigabit Ethernet and one 10/100M bps Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one TF card slot as well as a USB based 4G Mini PCIE interface. It has a DVP camera interface and a MIPI-CSI interface to allow connecting with camera modules. It also supports multi video output interfaces such as dual LVDS, HDMI and CVBS OUT, to achieve different display in dual screens.
The MYD-YT507H Development Board is delivered with one Quick Start Guide, one USB cable, one 12V/2A power adapter and one DC power jack adapter to provide user a complete platform for evaluating and prototyping based on T507 processor. MYIR also offers MY-CAM002U USB Camera Module, MY-CAM011B DVP Camera Module, MY-CAM003M MIPI Camera Module, MY-WIREDCOM RPI Module (RS232/RS485), MY-WF005S WiFi/BT Module and MY-LVDS070C LCD Module as options for the board which have greatly enhanced the functionality of the board.
The MYD-YT507H is running Linux OS. MYIR provides abundant software resources for Linux 4.9 based MYIR MEasy HMI V2.0 system with QT5.12.5, Ubuntu 18.04.5 system, including kernel, driver source codes and compilation tools to enable users to start their development rapidly and easily.
Measuring only 43mm by 45mm, the MYC-YT507H CPU Module is a compact System-on Module (SoM) based on Allwinner T507-H industrial processor which among Allwinner T5 series with a 1.5GHz quad-core Cortex-A53 CPU and a Mali-G31 MP2 GPU. The processor is AEC-Q100 certified and targets the new generation of automotive markets. Additionally, it has onboard 1GB/2GB LPDDR4, 8GB eMMC, 32Kbit EEPROM and Power management IC (PMIC). SMD packaging is adopted to save connector cost. A variety of peripheral and IO signals are accessible via the 1.0 mm pitch 222-pin stamp-hole (Castellated-Hole) expansion interface. With strong performance, extensive peripheral resources and low cost, the MYC-YT507H can be used in a wide range of applications such as power IOT, automotive electronics, commercial display, industrial control, medical devices, intelligent terminals, and more others.
The MYC-YT507H is running Linux 4.9 with ported Ubuntu 18.04.5 and MYIR MEasy HMI V2.0 system with QT5.12.5, supporting systems with XFCE graphics function. MYIR has provided the software development resources with kernel and drivers all in source code.
MYIR provides MYD-YT507H development board for evaluating the MYC-YT507H CPU Module. It takes full advantages of the Allwinner T5 MPU to explore a rich set of peripherals and interfaces to the base board including Serial ports, one Gigabit Ethernet and one 10/100M bps Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one TF card slot as well as a USB based 4G Mini PCIE interface. It has a DVP camera interface and a MIPI-CSI interface to allow connecting with camera modules. It also supports multi video output interfaces such as dual LVDS, HDMI and CVBS OUT, to achieve different display in dual screens.
The MYD-J1028X development board consists of a MYC-J1028X CPU module containing an NXP LS1028A dual core processor and a base board providing connectivity. The board provides evaluation and prototyping capabilities for applications like industrial control and edge computing. It has features like Gigabit Ethernet, USB 3.0, and an optional camera or RS232/485 module. The board runs Linux distributions and driver source code is provided to support development on the LS1028A processor.
Measuring 45mm by 82mm, the MYC-J1028X CPU Module is a high-performance embedded ARM SoM for industrial and automotive applications. It is based on NXP LS1028A SoC of the Layerscape family and features 1.5 GHz dual Arm Cortex-A72 cores, with integrated 3D GPU for HMI, and a time-sensitive networking (TSN) -enabled Ethernet switch and Ethernet controllers to support converged IT and OT networks. The MYC-J1028X has 2GB DDR4 and supports multiple external memory options including 8GB eMMC (default), QSPI NAND Flash (DNP) and XSPI NOR Flash (DNP). It has 32Kbit EEPROM and one temperature sensor on the rear of the board. A number of peripheral and IO signals are access through one 0.5mm pitch 314-pin MXM 3.0 gold-finger-edge-card connector. It is capable of supporting Ubuntu and Real-time Edge images based on Linux kernel.
The MYD-J1028X Development Board is using the MYC-J1028X as core controller board and has explored the features of the LS1028A processor to serve as an solid reference design for customer’s development. The base board has brought out rich peripherals through connectors and headers such as one USB3.0 Host, five Gigabit TSN Ethernet, one M.2 Key E based WiFi module interface, one USB 3.0 M.2 Key B based 5G Module interface, one M.2 Key B based SSD Module interface, one DP display port, one Audio output port, one Micro SD card slot as well as two SIM card slots and more others.
The MYD-YA15XC-T development board is using the MYC-YA15XC-T CPU Module as core controller board which is populated on a specially designed base board through 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) expansion interface. The MYD-YA15XC-T is a good reference design for using ST STM32MP1 Processors which features 650MHz Single or Dual Arm Cortex-A7 and 209MHz Cortex-M4 Cores. Typical applications are industrial control, consumer electronics, smart home, medical and more other energy-efficient applications which require rich performance and low power. More information can be found at:
http://www.myirtech.com/list.asp?id=659
Measuring only 39mm by 37mm, the MYC-YA15XC-T CPU Module is MYIR’s another System-on Module (SoM) based on ST STM32MP1 series processors after the first release of the MYC-YA157C CPU Module, The new MYC-Y157XC-T module has integrated the STM32MP151AAC3T processor by default and a dedicated Power Management IC STPMIC1 also from STMicroelectronics. It has onboard DDR3L, Nand Flash or eMMC and 32KB EEPROM. A number of peripherals and IO signals are brought out through 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) expansion interface to make the module an excellent embedded controller for applications like industrial control, consumer electronics, smart home, medical and etc. The MYC-YA15XC-T is running Linux with provided 5.4.31 kernel and many drivers in source code.
The MYS-8MMX Single Board Computer has a compact design with only 95mm by 65mm form factor. It is powered by NXP’s first embedded multicore applications processor i.MX 8M Mini which features up to 1.8GHz quad-core ARM Cortex-A53 plus 400MHz Cortex-M4 processor. The tiny board takes full features of the processor and is equipped with 2GB DDR4, 8GB eMMC and 32MB QSPI Flash. It has explored rich peripheral interfaces through headers and connectors including two USB 2.0 Host, one USB OTG, one Gigabit Ethernet, TF card, M.2 interface, LVDS LCD interface, MIPI CSI interface, HDMI output, IO expansion interface and more others. The AP6256 WiFi/BT module on the board also allows wireless communications with other devices. It is capable of running Linux operating system based on the Yocto 3.0 or Ubuntu 18.04 .
The FZ3 Card is a deep learning accelerator card based on the Xilinx Zynq UltraScale+ ZU3EG MPSoC. It features a 1.2 GHz quad-core ARM processor, 600MHz dual-core real-time processor, 4GB RAM, 8GB flash storage, and supports PaddlePaddle deep learning. The FZ3 Kit package includes the card, power adapter, storage card, cables, and documentation to enable quick development of AI applications like cameras, robots, and intelligent vehicles.
This book is written by Mr.Joseph Attard, a Senior lecturer II working at Malta College for Arts Science and Technology on the island of Malta. In this book, Joseph shared a lot of content on how to work with MYIR's Z-turn board, starting from simply creating a project in Vivado to flash an LED, continuing to Detecting Switch inputs, all the way to interfacing the Xilinx Zynq 7 System on Chip to multiple analogue sensors through multiple XADC channels. All the above-mentioned interfacing is done from both the ARM Cortex A9, commonly known as the Processing System and the Artix 7 FPGA, commonly known as Programmable Logic, both residing within the Zynq 7000 SoC.
Verification of EMC Compliance for MYC-Y6ULX CPU Module
The file has presented the verification of EMC compliance for MYIR's MYC-Y6ULX CPU Module which is an system-on-module (SoM) powered by NXP i.MX 6UltraLite / 6ULL processor based on the ARM Cortex-A7 architecture. The module is ready to run Linux and can support industrial operating temperature range from -40 to +85 Celsius.
Development Board for NXP i.MX 8M Quad Application Processors
The overview file introduces a versatile platform MYD-JX8MX development board for evaluating the MYC-JX8MX CPU Module. It takes full features of the i.MX 8M processor and has brought out rich peripherals through connectors and headers such as 4 x USB 3.0 Host ports and 1 x USB 3.0 Host/Device port, Gigabit Ethernet, TF card slot, USB based Mini PCIe interface for 4G LTE Module, WiFi/BT, Audio In/Out, HDMI, 2 x MIPI-CSI, MIPI-DSI, 2 x LVDS display interfaces, PCIe 3.0 (x4) NVMe SSD Interface, etc. The board is ready to run Linux and can work in extended temperature ranging from -30°C to 80°C. It is delivered with necessary cable accessories for customers to easily start development as soon as getting it out-of-box. A MIPI Camera Module MY-CAM003 is provided as an option for the board.
The document describes the MYC-JX8MX CPU module, which features an NXP i.MX 8M Quad processor with 1.3GHz Cortex-A53 cores and a 266MHz Cortex-M4 core. It has 1GB/2GB LPDDR4 RAM, 8GB eMMC flash, and peripherals including Gigabit Ethernet and USB interfaces. Measuring 82x52mm, it is designed for applications like imaging, building automation, and machine vision. An optional development board is also available to evaluate the CPU module.
This technical paper has collected and summarized some frequently asked questions (FAQs) by MYIR's engineers on development based on NXP's i.MX 6UL/6ULL ARM Cortex-A7 processors. Hope it can help developers during their work.
The catalogue includes helpful information on different ARM based products available from MYIR Tech Limited such as development boards, single board computers, CPU modules and so on.
MYD-Y6ULX Development Board for i.MX 6UL/6ULL ARM Cortex-A7 Processors
The MYD-Y6ULX development board is a complete evaluation platform for NXP’s i.MX 6UltraLite / 6ULL processor family, which can operate at 528 MHz and features the most efficient ARM Cortex-A7 core, providing various memory interfaces and enhancing the flexibility and convenience of the board to connect peripheral devices. The board is ready to run Linux and supports industrial operating temperature range from -40 to +85 Celsius. employs the MYC-Y6ULX CPU Module as the controller board by populating the CPU Module on its base board through 1.0mm pitch 140-pin stamp hole interface. The MYC-Y6ULX CPU Module is mounted with a shield cover and integrated with core components including i.MX 6UltraLite / 6ULL processor, 256MB DDR3, 256MB Nand Flash or optional 4GB eMMC and Ethernet PHY. The base board has extended rich peripherals through connectors and headers like Serial ports, USB, Ethernet, CAN, Micro SD card, WiFi module, LCD/Touch screen, Camera, Audio as well as a Mini PCIe interface for optional USB based 4G LTE module. It is a versatile platform and solid reference design delivered with necessary cable accessories and detailed documentations ideal for prototype and evaluation based on i.MX 6UL/6ULL solutions.
MYC-Y6ULX CPU Module - NXP i.MX 6UL/6ULL System-on-Module
This overview document gives a brief introduction of MYIR's MYC-Y6ULX CPU Module which is powered by NXP i.MX 6UltraLite / 6ULL processor based on the ARM Cortex-A7 architecture. It is ready to run Linux and delivers high performance with ultra-efficient power that targets Industry Control, Communications, HMI, Smart Healthcare and Internet of Things (IoT) applications. It carries out as many as peripheral signals and IOs through 1.0mm pitch 140-pin stamp hole expansion interface to allow customer’s extension for their next embedded design. The module can support industrial operating temperature range from -40 to +85 Celsius.
MYS-6ULX Single Board Computer for Industry 4.0 and IoT Applications
The document introduced MYIR's i.MX 6UL / 6ULL based ARM Cortex-A7 Single Board Computer for Industry 4.0 and IoT applications which is ready to run Linux with high performance and ulta low cost.
The MYC-C7Z015 CPU Module is an SOM (System on Module) board based on Xilinx XC7Z015 (Z-7015) All Programmable System-on-Chip (SoC) which is among the Xilinx Zynq-7000 family, featuring integrated dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic, four 6.25Gbps SerDes transceivers and one PCIe Gen2 x 4 integrated block. The MYC-C7Z015 module has 1GB DDR3 SDRAM, 4GB eMMC, 32MB quad SPI Flash, a Gigabit Ethernet PHY, a USB PHY and external watchdog on board. It provides a large number of I/O signals for ARM peripherals and FPGA I/Os through two 0.8mm pitch 140-pin board-to-board connectors, which is ideal for your next embedded design.
The MYC-C7Z015 CPU Module is compatible with MYIR’s MYC-C7Z010/20 CPU Modules and they can share the same base board which is designed by MYIR for evaluation or prototype purpose. The MYD-C7Z015 development board takes full features of the Zynq-7015 SoC. It has full features of the MYD-C7Z010/20 development board, additionally, it has one PCIe interface and one SFP transceiver module interface.
The MYC-C7Z015 CPU Module is ready to run Linux 3.15.0. It can be used in a variety of commercial, medical, automation, industrial, and military embedded applications.
This document introduces MYIR's MYD-JA5D4X development board and MYC-JA5D4X CPU Module which are based on Atmel’s ARM Cortex-A5 based SAMA5D42 orSAMA5D44 ARM Cortex-A5 processor, capable of running Linux and support extended operation temperature.
An invited talk given by Mark Billinghurst on Research Directions for Cross Reality Interfaces. This was given on July 2nd 2024 as part of the 2024 Summer School on Cross Reality in Hagenberg, Austria (July 1st - 7th)
Invited Remote Lecture to SC21
The International Conference for High Performance Computing, Networking, Storage, and Analysis
St. Louis, Missouri
November 18, 2021
RPA In Healthcare Benefits, Use Case, Trend And Challenges 2024.pptx
Your comprehensive guide to RPA in healthcare for 2024. Explore the benefits, use cases, and emerging trends of robotic process automation. Understand the challenges and prepare for the future of healthcare automation
Quantum Communications Q&A with Gemini LLM. These are based on Shannon's Noisy channel Theorem and offers how the classical theory applies to the quantum world.
Kalyani Technologies provides IT and security solutions and services. It has experience implementing projects for large companies across various industries. It offers managed IT services, network solutions, safety and security systems, and shared IT services. Kalyani Technologies has partnerships with world-class brands and aims to deliver high-quality, customized solutions through a consultative approach.
Daviscomms is a Singapore-based company that provides one-stop product design and manufacturing solutions for wireless communication and electronic products. It was established in 2000 and has regional distribution channels in Europe, USA, Australia and the Middle East. The company has design, engineering, prototyping and manufacturing capabilities. Its factory in Malaysia is ISO and regulatory certified. Daviscomms works with customers on ODM, EMS and OEM projects.
Engineering smart into the machines you buildTanuj Gidwani
Know about Wipro's Product Engineering Capabilities and how our ability to leverage new-age technologies such as IoT, Cloud, 3D printing, virtualization, and Artificial Intelligence (AI) has a deep impact on the way enterprises do business in an ever-changing world
HCFA is a Chinese company established in 2011 that focuses on industrial automation products including controllers, drives, sensors, electromechanical devices, and information systems. It has over 1000 employees, 4 R&D centers, and provides products to over 5000 customers in industries like electronics, lithium batteries, robotics, and machine tools. HCFA emphasizes innovation, integrity, and service.
Black Box India_Corporate_Deck_May23-Slideshare.pdfBlack Box
Black Box® is a trusted IT solutions provider delivering cutting-edge technology solutions and world-class consulting services to businesses around the globe. The breadth of our global reach and the depth of our expertise accelerate customer success by bringing people, ideas, and technology together to solve real-world business problems. Our IT infrastructure solutions, services, and products enable secure, flawless connectivity and meaningful collaboration for businesses in every major market sector on six continents.
For more information please visit - https://www.blackbox.com/en-us/discover-bb/about-blackbox
Littelfuse is the number one global provider of circuit protection solutions. They have grown from a small company with one fuse product into a leader in circuit protection through a customer-focused approach of developing innovative solutions to meet unique customer needs. Littelfuse has built the broadest circuit protection portfolio in the industry and a global footprint that allows them to work closely with customers. Their expertise, portfolio of products, and partnership approach position them to be a single-source provider of circuit protection solutions for customers around the world.
This document proposes a CCTV surveillance system for Tranter IT that includes outdoor and indoor cameras, a 32-channel DVR, power supplies, cables, TVs, an inverter, UPS, and installation. The system will provide remote monitoring, motion detection, daily recording storage and backup. Cameras will be strategically placed around the premises for comprehensive coverage. Implementation will take 2 weeks. A quotation for N1,005,585 is provided for the necessary equipment and installation. Approval from Tranter IT is requested to proceed.
The document lists the top 10 VLSI companies in India. Some of the top companies include Texas Instruments, which develops analog and digital signal processing technologies; SiliconMentor, which strives to empower engineering students with VLSI and embedded systems knowledge; and Analog Devices, a global leader in analog design and manufacturing. Other top companies are Cypress Semiconductor, Broadcom Corporation, Cisco Systems, Horizon Semiconductors, Einfochips, HCL Technologies, and Trident Tech Labs.
Cisco Tech Advantage Webinar. June 4th, 2014
Video: http://youtu.be/RkmMi9qea5Y
IoT is everywhere, from smart meters on houses to parking sensors in the ground – all devices are connected to the Internet. Internet engineers are helping traditional industries solve new industrial world challenges by connecting billions of new devices. An exciting part of the IoT journey is the integration between both worlds: Information Technology (IT) and Operation Technology (OT). For that a systems approach is required to scale the existing Internet infrastructure to accommodate IoT use cases, while making IT technology easy to adopt for OT operators.
In this session you will learn:
IoT infrastructure challenges and the need for open standards and partner ecosystem
Key elements to build large-scale IoT systems as IPv6, access control, plug and play, distributed intelligence and contextual awareness
Introduction to fog computing and advantages of extending cloud computing and services
Looking ahead to the future
Micro Machine Company is a precision machining company that has served customers for over 40 years. They blend technology with high craftsmanship and attention to detail from trained professionals. All employees, from engineers to shipping, are committed to zero defects. Micro Machine offers medical devices, components, and assemblies to exacting standards at competitive costs.
Micro Machine Company is a precision machining company that has served customers for over 40 years. They blend technology with high craftsmanship and attention to detail from experienced machinists. The company culture emphasizes zero defects from beginning to end of the manufacturing process. Micro Machine can offer precision components at competitive costs while meeting customers' exacting quality standards and specifications.
T-tel Communications is an emerging technology distributor of network infrastructure solutions, audio/video products, and telecommunications products based in Bangalore, India. It has been in business for over 6 years and has over 50 employees across multiple branch offices. T-tel specializes in supplying communications infrastructure products for IT, broadcasting, audio/visual, and telecommunications industries. It represents several global technology brands and aims to provide customers with world-class, cost-effective solutions and support.
Enterprise World 2014 - Manufacturing Industry Breakout SessionMark Morley, MBA
This presentation discusses the latest digital disruption related trends across the manufacturing industry and how OpenText's Enterprise Information Management solutions can help manage this digital disruption in the future. This presentation formed the basis of the manufacturing industry keynote session at Enterprise World 2014 in Orlando.
Vtech cms divisonal presentation may 2014 represented by htcsHTCS LLC
Following VTech's Press Release, covering their Annual Financial Report for FY 2014, the new CMS Divisional Presentation has been published as well. Contact HTCS, LLC for further details, send us an email:
Rolf.Seichter@HTConsultingServices.com
This document provides an overview of Eternity Group, a professional electronics manufacturing services company. Some key details include:
- It was established in 2003 and has grown to 1200 employees with over 20,000 square meters of plant and office space.
- It provides integrated OEM/ODM services for mobile terminals and has certification in quality management and medical device standards.
- Core services include design for manufacturing, procurement, assembly, quality assurance, and after-sales support.
- It has strong production capabilities for mass production and stable quality control processes.
ConnectM is a leading, global Machine-to-Machine (M2M) Technology Solutions, Business Intelligence (BI) and Services Company headquartered in Bangalore, India. With over 70,000 assets connected, ConnectM's Solution Delivery Platform(SDP) is a robust and proven technology. Our Pre-built applications are leveraged by over 40 customers to manage their assets/machines. ConnectM SDP and applications along with devices from its eco-system partners offer the customer a one-stop-shop for M2M needs.
ConnectM has delivered M2M solutions to various domains including Telecom, Energy, Utilities, Industrial, Construction, IT/ITES Enterprises and Transportation market segments.
ConnectM's solutions are powered by cutting edge M2M technology, and are designed to make significant, sustained and measurable business impact. ConnectM also offers services to its client to build complete solutions. ConnectM's strength is in its ability to offer domain specific analytics on the data collected and deliver actionable business intelligence.
Efficient Solutions For The Courier Express And Postal IndustryThorne & Derrick UK
SICK provides sensor solutions for various stages of the courier, express, and postal process including unloading/inbound, safety, induction, identification, dimensioning/weighing, sorting, outbound/loading, and building surveillance. Key applications include safety scanners to protect workers during unloading, handheld and automated scanners for identification, dimensioning systems for measuring parcels, and sensors to ensure safe and efficient sorting. SICK offers a wide range of products and services to help courier companies meet challenges in efficiency, security, sustainability and more.
The solar energy is the best energy as it does not release any type of the harmful gases that affect the green house. The solar panels are the environmental friendly when compared to the other devices for generating energy. If you are living in Pakistan and want to install the solar in Pakistan, then there is plenty of solar panel available over the market from where you can search the best one according to voltage need. The solar panel is less expensive and easy to use for longer time.
Here are some of the steps to buy the solar panel
<a>Solar IN PAKISTAN </a>
The solar energy is the best energy as it does not release any type of the harmful gases that affect the green house. The solar panels are the environmental friendly when compared to the other devices for generating energy. If you are living in Pakistan and want to install the solar in Pakistan, then there is plenty of solar panel available over the market from where you can search the best one according to voltage need. The solar panel is less expensive and easy to use for longer time.
Here are some of the steps to buy the solar panel
<a>Solar IN PAKISTAN </a>
Similar to MYIR Product Brochure - A Global Provider of Embedded SOMs & Solutions (20)
MYC-YF13X CPU Module - STM32MP135 based SoMLinda Zhang
The MYC-YF13X CPU Module Overview gives introduction of the STM32MP135 processor based System-on-Module from MYIR, a Chinese company focused on providing SoM solutions for embedded appilcations. Measuring only 37mm by 39mm, the MYC-YF13X module has integrated the STM32MP135DAF7 processor, DDR3L, external memory and carried out a variety of peripheral and IO signals through the 1.0 mm pitch 148-pin Castellated-Hole expansion interface. It is capable of running Linux and provided with software resources including kernel and driver source code, together with detailed user manual and documentations to help customer start their development rapidly. It is particularly suitable for applications such as entry-level industrial human-machine interfaces (HMI) and embedded devices for energy and power management.
MYIR also provides the MYD-YF13X Development Board as a starter kit for evaluating the MYC-YF13X CPU Module. It has a versatile base board to facilitate the expansion from the MYC-YF13X through the 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) interface, a rich set of peripherals and interfaces have been brought out such as RS232, RS485, two USB 2.0 HOST and one USB 2.0 OTG, two Gigabit Ethernet, CAN, one Micro SD card slot, one USB based Mini-PCIe 4G Module interface with one SIM card holder, LCD interface, Camera interface, Audio input and output as well as two extension headers.
More information about the MYC-YF13X CPU Module can be found at:
https://www.myirtech.com/list.asp?id=726
The MYD-YT507H Development Board consists of a compact CPU Module MYC-YT507H and a base board to provide a complete evaluation platform for ALLWINNER T507-H Processor which among Allwinner T5 series with a 1.5GHz quad-core Cortex-A53 CPU and a Mali-G31 MP2 GPU. The processor is AEC-Q100 certified and targets the new generation of automotive markets. Typical applications are power IoT, automotive electronics, commercial display, industrial control, medical devices, intelligent terminals and more others.
The MYD-YT507H has a base board which installed MYC-YT507H CPU Module through 1.0mm pitch 222-pin stamp-hole (Castellated-Hole) interface. The MYC-YT507H CPU Module is a highly-integrated SoM which combines the ALLWINNER T507-H processor, 1GB/2GB DDR4, 8GB eMMC, 32Kbit EEPROM and PMIC. The base board is explored with Serial ports, one Gigabit Ethernet and one 10/100M bps Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one TF card slot as well as a USB based 4G Mini PCIE interface. It has a DVP camera interface and a MIPI-CSI interface to allow connecting with camera modules. It also supports multi video output interfaces such as dual LVDS, HDMI and CVBS OUT, to achieve different display in dual screens.
The MYD-YT507H Development Board is delivered with one Quick Start Guide, one USB cable, one 12V/2A power adapter and one DC power jack adapter to provide user a complete platform for evaluating and prototyping based on T507 processor. MYIR also offers MY-CAM002U USB Camera Module, MY-CAM011B DVP Camera Module, MY-CAM003M MIPI Camera Module, MY-WIREDCOM RPI Module (RS232/RS485), MY-WF005S WiFi/BT Module and MY-LVDS070C LCD Module as options for the board which have greatly enhanced the functionality of the board.
The MYD-YT507H is running Linux OS. MYIR provides abundant software resources for Linux 4.9 based MYIR MEasy HMI V2.0 system with QT5.12.5, Ubuntu 18.04.5 system, including kernel, driver source codes and compilation tools to enable users to start their development rapidly and easily.
Measuring only 43mm by 45mm, the MYC-YT507H CPU Module is a compact System-on Module (SoM) based on Allwinner T507-H industrial processor which among Allwinner T5 series with a 1.5GHz quad-core Cortex-A53 CPU and a Mali-G31 MP2 GPU. The processor is AEC-Q100 certified and targets the new generation of automotive markets. Additionally, it has onboard 1GB/2GB LPDDR4, 8GB eMMC, 32Kbit EEPROM and Power management IC (PMIC). SMD packaging is adopted to save connector cost. A variety of peripheral and IO signals are accessible via the 1.0 mm pitch 222-pin stamp-hole (Castellated-Hole) expansion interface. With strong performance, extensive peripheral resources and low cost, the MYC-YT507H can be used in a wide range of applications such as power IOT, automotive electronics, commercial display, industrial control, medical devices, intelligent terminals, and more others.
The MYC-YT507H is running Linux 4.9 with ported Ubuntu 18.04.5 and MYIR MEasy HMI V2.0 system with QT5.12.5, supporting systems with XFCE graphics function. MYIR has provided the software development resources with kernel and drivers all in source code.
MYIR provides MYD-YT507H development board for evaluating the MYC-YT507H CPU Module. It takes full advantages of the Allwinner T5 MPU to explore a rich set of peripherals and interfaces to the base board including Serial ports, one Gigabit Ethernet and one 10/100M bps Ethernet, two USB 2.0 HOST and one USB 2.0 OTG, one TF card slot as well as a USB based 4G Mini PCIE interface. It has a DVP camera interface and a MIPI-CSI interface to allow connecting with camera modules. It also supports multi video output interfaces such as dual LVDS, HDMI and CVBS OUT, to achieve different display in dual screens.
The MYD-J1028X development board consists of a MYC-J1028X CPU module containing an NXP LS1028A dual core processor and a base board providing connectivity. The board provides evaluation and prototyping capabilities for applications like industrial control and edge computing. It has features like Gigabit Ethernet, USB 3.0, and an optional camera or RS232/485 module. The board runs Linux distributions and driver source code is provided to support development on the LS1028A processor.
Measuring 45mm by 82mm, the MYC-J1028X CPU Module is a high-performance embedded ARM SoM for industrial and automotive applications. It is based on NXP LS1028A SoC of the Layerscape family and features 1.5 GHz dual Arm Cortex-A72 cores, with integrated 3D GPU for HMI, and a time-sensitive networking (TSN) -enabled Ethernet switch and Ethernet controllers to support converged IT and OT networks. The MYC-J1028X has 2GB DDR4 and supports multiple external memory options including 8GB eMMC (default), QSPI NAND Flash (DNP) and XSPI NOR Flash (DNP). It has 32Kbit EEPROM and one temperature sensor on the rear of the board. A number of peripheral and IO signals are access through one 0.5mm pitch 314-pin MXM 3.0 gold-finger-edge-card connector. It is capable of supporting Ubuntu and Real-time Edge images based on Linux kernel.
The MYD-J1028X Development Board is using the MYC-J1028X as core controller board and has explored the features of the LS1028A processor to serve as an solid reference design for customer’s development. The base board has brought out rich peripherals through connectors and headers such as one USB3.0 Host, five Gigabit TSN Ethernet, one M.2 Key E based WiFi module interface, one USB 3.0 M.2 Key B based 5G Module interface, one M.2 Key B based SSD Module interface, one DP display port, one Audio output port, one Micro SD card slot as well as two SIM card slots and more others.
The MYD-YA15XC-T development board is using the MYC-YA15XC-T CPU Module as core controller board which is populated on a specially designed base board through 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) expansion interface. The MYD-YA15XC-T is a good reference design for using ST STM32MP1 Processors which features 650MHz Single or Dual Arm Cortex-A7 and 209MHz Cortex-M4 Cores. Typical applications are industrial control, consumer electronics, smart home, medical and more other energy-efficient applications which require rich performance and low power. More information can be found at:
http://www.myirtech.com/list.asp?id=659
Measuring only 39mm by 37mm, the MYC-YA15XC-T CPU Module is MYIR’s another System-on Module (SoM) based on ST STM32MP1 series processors after the first release of the MYC-YA157C CPU Module, The new MYC-Y157XC-T module has integrated the STM32MP151AAC3T processor by default and a dedicated Power Management IC STPMIC1 also from STMicroelectronics. It has onboard DDR3L, Nand Flash or eMMC and 32KB EEPROM. A number of peripherals and IO signals are brought out through 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) expansion interface to make the module an excellent embedded controller for applications like industrial control, consumer electronics, smart home, medical and etc. The MYC-YA15XC-T is running Linux with provided 5.4.31 kernel and many drivers in source code.
The MYS-8MMX Single Board Computer has a compact design with only 95mm by 65mm form factor. It is powered by NXP’s first embedded multicore applications processor i.MX 8M Mini which features up to 1.8GHz quad-core ARM Cortex-A53 plus 400MHz Cortex-M4 processor. The tiny board takes full features of the processor and is equipped with 2GB DDR4, 8GB eMMC and 32MB QSPI Flash. It has explored rich peripheral interfaces through headers and connectors including two USB 2.0 Host, one USB OTG, one Gigabit Ethernet, TF card, M.2 interface, LVDS LCD interface, MIPI CSI interface, HDMI output, IO expansion interface and more others. The AP6256 WiFi/BT module on the board also allows wireless communications with other devices. It is capable of running Linux operating system based on the Yocto 3.0 or Ubuntu 18.04 .
FZ3 Card - Deep Learning Accelerator CardLinda Zhang
The FZ3 Card is a deep learning accelerator card based on the Xilinx Zynq UltraScale+ ZU3EG MPSoC. It features a 1.2 GHz quad-core ARM processor, 600MHz dual-core real-time processor, 4GB RAM, 8GB flash storage, and supports PaddlePaddle deep learning. The FZ3 Kit package includes the card, power adapter, storage card, cables, and documentation to enable quick development of AI applications like cameras, robots, and intelligent vehicles.
This book is written by Mr.Joseph Attard, a Senior lecturer II working at Malta College for Arts Science and Technology on the island of Malta. In this book, Joseph shared a lot of content on how to work with MYIR's Z-turn board, starting from simply creating a project in Vivado to flash an LED, continuing to Detecting Switch inputs, all the way to interfacing the Xilinx Zynq 7 System on Chip to multiple analogue sensors through multiple XADC channels. All the above-mentioned interfacing is done from both the ARM Cortex A9, commonly known as the Processing System and the Artix 7 FPGA, commonly known as Programmable Logic, both residing within the Zynq 7000 SoC.
Verification of EMC Compliance for MYC-Y6ULX CPU ModuleLinda Zhang
The file has presented the verification of EMC compliance for MYIR's MYC-Y6ULX CPU Module which is an system-on-module (SoM) powered by NXP i.MX 6UltraLite / 6ULL processor based on the ARM Cortex-A7 architecture. The module is ready to run Linux and can support industrial operating temperature range from -40 to +85 Celsius.
Development Board for NXP i.MX 8M Quad Application ProcessorsLinda Zhang
The overview file introduces a versatile platform MYD-JX8MX development board for evaluating the MYC-JX8MX CPU Module. It takes full features of the i.MX 8M processor and has brought out rich peripherals through connectors and headers such as 4 x USB 3.0 Host ports and 1 x USB 3.0 Host/Device port, Gigabit Ethernet, TF card slot, USB based Mini PCIe interface for 4G LTE Module, WiFi/BT, Audio In/Out, HDMI, 2 x MIPI-CSI, MIPI-DSI, 2 x LVDS display interfaces, PCIe 3.0 (x4) NVMe SSD Interface, etc. The board is ready to run Linux and can work in extended temperature ranging from -30°C to 80°C. It is delivered with necessary cable accessories for customers to easily start development as soon as getting it out-of-box. A MIPI Camera Module MY-CAM003 is provided as an option for the board.
High-performance ARM SoM Powered by NXP i.MX 8MLinda Zhang
The document describes the MYC-JX8MX CPU module, which features an NXP i.MX 8M Quad processor with 1.3GHz Cortex-A53 cores and a 266MHz Cortex-M4 core. It has 1GB/2GB LPDDR4 RAM, 8GB eMMC flash, and peripherals including Gigabit Ethernet and USB interfaces. Measuring 82x52mm, it is designed for applications like imaging, building automation, and machine vision. An optional development board is also available to evaluate the CPU module.
This technical paper has collected and summarized some frequently asked questions (FAQs) by MYIR's engineers on development based on NXP's i.MX 6UL/6ULL ARM Cortex-A7 processors. Hope it can help developers during their work.
The catalogue includes helpful information on different ARM based products available from MYIR Tech Limited such as development boards, single board computers, CPU modules and so on.
MYD-Y6ULX Development Board for i.MX 6UL/6ULL ARM Cortex-A7 ProcessorsLinda Zhang
The MYD-Y6ULX development board is a complete evaluation platform for NXP’s i.MX 6UltraLite / 6ULL processor family, which can operate at 528 MHz and features the most efficient ARM Cortex-A7 core, providing various memory interfaces and enhancing the flexibility and convenience of the board to connect peripheral devices. The board is ready to run Linux and supports industrial operating temperature range from -40 to +85 Celsius. employs the MYC-Y6ULX CPU Module as the controller board by populating the CPU Module on its base board through 1.0mm pitch 140-pin stamp hole interface. The MYC-Y6ULX CPU Module is mounted with a shield cover and integrated with core components including i.MX 6UltraLite / 6ULL processor, 256MB DDR3, 256MB Nand Flash or optional 4GB eMMC and Ethernet PHY. The base board has extended rich peripherals through connectors and headers like Serial ports, USB, Ethernet, CAN, Micro SD card, WiFi module, LCD/Touch screen, Camera, Audio as well as a Mini PCIe interface for optional USB based 4G LTE module. It is a versatile platform and solid reference design delivered with necessary cable accessories and detailed documentations ideal for prototype and evaluation based on i.MX 6UL/6ULL solutions.
MYC-Y6ULX CPU Module - NXP i.MX 6UL/6ULL System-on-ModuleLinda Zhang
This overview document gives a brief introduction of MYIR's MYC-Y6ULX CPU Module which is powered by NXP i.MX 6UltraLite / 6ULL processor based on the ARM Cortex-A7 architecture. It is ready to run Linux and delivers high performance with ultra-efficient power that targets Industry Control, Communications, HMI, Smart Healthcare and Internet of Things (IoT) applications. It carries out as many as peripheral signals and IOs through 1.0mm pitch 140-pin stamp hole expansion interface to allow customer’s extension for their next embedded design. The module can support industrial operating temperature range from -40 to +85 Celsius.
MYS-6ULX Single Board Computer for Industry 4.0 and IoT ApplicationsLinda Zhang
The document introduced MYIR's i.MX 6UL / 6ULL based ARM Cortex-A7 Single Board Computer for Industry 4.0 and IoT applications which is ready to run Linux with high performance and ulta low cost.
The MYC-C7Z015 CPU Module is an SOM (System on Module) board based on Xilinx XC7Z015 (Z-7015) All Programmable System-on-Chip (SoC) which is among the Xilinx Zynq-7000 family, featuring integrated dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic, four 6.25Gbps SerDes transceivers and one PCIe Gen2 x 4 integrated block. The MYC-C7Z015 module has 1GB DDR3 SDRAM, 4GB eMMC, 32MB quad SPI Flash, a Gigabit Ethernet PHY, a USB PHY and external watchdog on board. It provides a large number of I/O signals for ARM peripherals and FPGA I/Os through two 0.8mm pitch 140-pin board-to-board connectors, which is ideal for your next embedded design.
The MYC-C7Z015 CPU Module is compatible with MYIR’s MYC-C7Z010/20 CPU Modules and they can share the same base board which is designed by MYIR for evaluation or prototype purpose. The MYD-C7Z015 development board takes full features of the Zynq-7015 SoC. It has full features of the MYD-C7Z010/20 development board, additionally, it has one PCIe interface and one SFP transceiver module interface.
The MYC-C7Z015 CPU Module is ready to run Linux 3.15.0. It can be used in a variety of commercial, medical, automation, industrial, and military embedded applications.
Atmel SAMA5D4 Development Board and CPU ModuleLinda Zhang
This document introduces MYIR's MYD-JA5D4X development board and MYC-JA5D4X CPU Module which are based on Atmel’s ARM Cortex-A5 based SAMA5D42 orSAMA5D44 ARM Cortex-A5 processor, capable of running Linux and support extended operation temperature.
An invited talk given by Mark Billinghurst on Research Directions for Cross Reality Interfaces. This was given on July 2nd 2024 as part of the 2024 Summer School on Cross Reality in Hagenberg, Austria (July 1st - 7th)
The Rise of Supernetwork Data Intensive ComputingLarry Smarr
Invited Remote Lecture to SC21
The International Conference for High Performance Computing, Networking, Storage, and Analysis
St. Louis, Missouri
November 18, 2021
RPA In Healthcare Benefits, Use Case, Trend And Challenges 2024.pptxSynapseIndia
Your comprehensive guide to RPA in healthcare for 2024. Explore the benefits, use cases, and emerging trends of robotic process automation. Understand the challenges and prepare for the future of healthcare automation
Quantum Communications Q&A with Gemini LLM. These are based on Shannon's Noisy channel Theorem and offers how the classical theory applies to the quantum world.
How RPA Help in the Transportation and Logistics Industry.pptxSynapseIndia
Revolutionize your transportation processes with our cutting-edge RPA software. Automate repetitive tasks, reduce costs, and enhance efficiency in the logistics sector with our advanced solutions.
Implementations of Fused Deposition Modeling in real worldEmerging Tech
The presentation showcases the diverse real-world applications of Fused Deposition Modeling (FDM) across multiple industries:
1. **Manufacturing**: FDM is utilized in manufacturing for rapid prototyping, creating custom tools and fixtures, and producing functional end-use parts. Companies leverage its cost-effectiveness and flexibility to streamline production processes.
2. **Medical**: In the medical field, FDM is used to create patient-specific anatomical models, surgical guides, and prosthetics. Its ability to produce precise and biocompatible parts supports advancements in personalized healthcare solutions.
3. **Education**: FDM plays a crucial role in education by enabling students to learn about design and engineering through hands-on 3D printing projects. It promotes innovation and practical skill development in STEM disciplines.
4. **Science**: Researchers use FDM to prototype equipment for scientific experiments, build custom laboratory tools, and create models for visualization and testing purposes. It facilitates rapid iteration and customization in scientific endeavors.
5. **Automotive**: Automotive manufacturers employ FDM for prototyping vehicle components, tooling for assembly lines, and customized parts. It speeds up the design validation process and enhances efficiency in automotive engineering.
6. **Consumer Electronics**: FDM is utilized in consumer electronics for designing and prototyping product enclosures, casings, and internal components. It enables rapid iteration and customization to meet evolving consumer demands.
7. **Robotics**: Robotics engineers leverage FDM to prototype robot parts, create lightweight and durable components, and customize robot designs for specific applications. It supports innovation and optimization in robotic systems.
8. **Aerospace**: In aerospace, FDM is used to manufacture lightweight parts, complex geometries, and prototypes of aircraft components. It contributes to cost reduction, faster production cycles, and weight savings in aerospace engineering.
9. **Architecture**: Architects utilize FDM for creating detailed architectural models, prototypes of building components, and intricate designs. It aids in visualizing concepts, testing structural integrity, and communicating design ideas effectively.
Each industry example demonstrates how FDM enhances innovation, accelerates product development, and addresses specific challenges through advanced manufacturing capabilities.
Best Programming Language for Civil EngineersAwais Yaseen
The integration of programming into civil engineering is transforming the industry. We can design complex infrastructure projects and analyse large datasets. Imagine revolutionizing the way we build our cities and infrastructure, all by the power of coding. Programming skills are no longer just a bonus—they’re a game changer in this era.
Technology is revolutionizing civil engineering by integrating advanced tools and techniques. Programming allows for the automation of repetitive tasks, enhancing the accuracy of designs, simulations, and analyses. With the advent of artificial intelligence and machine learning, engineers can now predict structural behaviors under various conditions, optimize material usage, and improve project planning.
TrustArc Webinar - 2024 Data Privacy Trends: A Mid-Year Check-InTrustArc
Six months into 2024, and it is clear the privacy ecosystem takes no days off!! Regulators continue to implement and enforce new regulations, businesses strive to meet requirements, and technology advances like AI have privacy professionals scratching their heads about managing risk.
What can we learn about the first six months of data privacy trends and events in 2024? How should this inform your privacy program management for the rest of the year?
Join TrustArc, Goodwin, and Snyk privacy experts as they discuss the changes we’ve seen in the first half of 2024 and gain insight into the concrete, actionable steps you can take to up-level your privacy program in the second half of the year.
This webinar will review:
- Key changes to privacy regulations in 2024
- Key themes in privacy and data governance in 2024
- How to maximize your privacy program in the second half of 2024
Transcript: Details of description part II: Describing images in practice - T...BookNet Canada
This presentation explores the practical application of image description techniques. Familiar guidelines will be demonstrated in practice, and descriptions will be developed “live”! If you have learned a lot about the theory of image description techniques but want to feel more confident putting them into practice, this is the presentation for you. There will be useful, actionable information for everyone, whether you are working with authors, colleagues, alone, or leveraging AI as a collaborator.
Link to presentation recording and slides: https://bnctechforum.ca/sessions/details-of-description-part-ii-describing-images-in-practice/
Presented by BookNet Canada on June 25, 2024, with support from the Department of Canadian Heritage.
YOUR RELIABLE WEB DESIGN & DEVELOPMENT TEAM — FOR LASTING SUCCESS
WPRiders is a web development company specialized in WordPress and WooCommerce websites and plugins for customers around the world. The company is headquartered in Bucharest, Romania, but our team members are located all over the world. Our customers are primarily from the US and Western Europe, but we have clients from Australia, Canada and other areas as well.
Some facts about WPRiders and why we are one of the best firms around:
More than 700 five-star reviews! You can check them here.
1500 WordPress projects delivered.
We respond 80% faster than other firms! Data provided by Freshdesk.
We’ve been in business since 2015.
We are located in 7 countries and have 22 team members.
With so many projects delivered, our team knows what works and what doesn’t when it comes to WordPress and WooCommerce.
Our team members are:
- highly experienced developers (employees & contractors with 5 -10+ years of experience),
- great designers with an eye for UX/UI with 10+ years of experience
- project managers with development background who speak both tech and non-tech
- QA specialists
- Conversion Rate Optimisation - CRO experts
They are all working together to provide you with the best possible service. We are passionate about WordPress, and we love creating custom solutions that help our clients achieve their goals.
At WPRiders, we are committed to building long-term relationships with our clients. We believe in accountability, in doing the right thing, as well as in transparency and open communication. You can read more about WPRiders on the About us page.
Measuring the Impact of Network Latency at TwitterScyllaDB
Widya Salim and Victor Ma will outline the causal impact analysis, framework, and key learnings used to quantify the impact of reducing Twitter's network latency.
Best Practices for Effectively Running dbt in Airflow.pdfTatiana Al-Chueyr
As a popular open-source library for analytics engineering, dbt is often used in combination with Airflow. Orchestrating and executing dbt models as DAGs ensures an additional layer of control over tasks, observability, and provides a reliable, scalable environment to run dbt models.
This webinar will cover a step-by-step guide to Cosmos, an open source package from Astronomer that helps you easily run your dbt Core projects as Airflow DAGs and Task Groups, all with just a few lines of code. We’ll walk through:
- Standard ways of running dbt (and when to utilize other methods)
- How Cosmos can be used to run and visualize your dbt projects in Airflow
- Common challenges and how to address them, including performance, dependency conflicts, and more
- How running dbt projects in Airflow helps with cost optimization
Webinar given on 9 July 2024
Understanding Insider Security Threats: Types, Examples, Effects, and Mitigat...Bert Blevins
Today’s digitally connected world presents a wide range of security challenges for enterprises. Insider security threats are particularly noteworthy because they have the potential to cause significant harm. Unlike external threats, insider risks originate from within the company, making them more subtle and challenging to identify. This blog aims to provide a comprehensive understanding of insider security threats, including their types, examples, effects, and mitigation techniques.
BT & Neo4j: Knowledge Graphs for Critical Enterprise Systems.pptx.pdfNeo4j
Presented at Gartner Data & Analytics, London Maty 2024. BT Group has used the Neo4j Graph Database to enable impressive digital transformation programs over the last 6 years. By re-imagining their operational support systems to adopt self-serve and data lead principles they have substantially reduced the number of applications and complexity of their operations. The result has been a substantial reduction in risk and costs while improving time to value, innovation, and process automation. Join this session to hear their story, the lessons they learned along the way and how their future innovation plans include the exploration of uses of EKG + Generative AI.
Quality Patents: Patents That Stand the Test of TimeAurora Consulting
Is your patent a vanity piece of paper for your office wall? Or is it a reliable, defendable, assertable, property right? The difference is often quality.
Is your patent simply a transactional cost and a large pile of legal bills for your startup? Or is it a leverageable asset worthy of attracting precious investment dollars, worth its cost in multiples of valuation? The difference is often quality.
Is your patent application only good enough to get through the examination process? Or has it been crafted to stand the tests of time and varied audiences if you later need to assert that document against an infringer, find yourself litigating with it in an Article 3 Court at the hands of a judge and jury, God forbid, end up having to defend its validity at the PTAB, or even needing to use it to block pirated imports at the International Trade Commission? The difference is often quality.
Quality will be our focus for a good chunk of the remainder of this season. What goes into a quality patent, and where possible, how do you get it without breaking the bank?
** Episode Overview **
In this first episode of our quality series, Kristen Hansen and the panel discuss:
⦿ What do we mean when we say patent quality?
⦿ Why is patent quality important?
⦿ How to balance quality and budget
⦿ The importance of searching, continuations, and draftsperson domain expertise
⦿ Very practical tips, tricks, examples, and Kristen’s Musts for drafting quality applications
https://www.aurorapatents.com/patently-strategic-podcast.html
Coordinate Systems in FME 101 - Webinar SlidesSafe Software
If you’ve ever had to analyze a map or GPS data, chances are you’ve encountered and even worked with coordinate systems. As historical data continually updates through GPS, understanding coordinate systems is increasingly crucial. However, not everyone knows why they exist or how to effectively use them for data-driven insights.
During this webinar, you’ll learn exactly what coordinate systems are and how you can use FME to maintain and transform your data’s coordinate systems in an easy-to-digest way, accurately representing the geographical space that it exists within. During this webinar, you will have the chance to:
- Enhance Your Understanding: Gain a clear overview of what coordinate systems are and their value
- Learn Practical Applications: Why we need datams and projections, plus units between coordinate systems
- Maximize with FME: Understand how FME handles coordinate systems, including a brief summary of the 3 main reprojectors
- Custom Coordinate Systems: Learn how to work with FME and coordinate systems beyond what is natively supported
- Look Ahead: Gain insights into where FME is headed with coordinate systems in the future
Don’t miss the opportunity to improve the value you receive from your coordinate system data, ultimately allowing you to streamline your data analysis and maximize your time. See you there!
Details of description part II: Describing images in practice - Tech Forum 2024BookNet Canada
This presentation explores the practical application of image description techniques. Familiar guidelines will be demonstrated in practice, and descriptions will be developed “live”! If you have learned a lot about the theory of image description techniques but want to feel more confident putting them into practice, this is the presentation for you. There will be useful, actionable information for everyone, whether you are working with authors, colleagues, alone, or leveraging AI as a collaborator.
Link to presentation recording and transcript: https://bnctechforum.ca/sessions/details-of-description-part-ii-describing-images-in-practice/
Presented by BookNet Canada on June 25, 2024, with support from the Department of Canadian Heritage.
The Increasing Use of the National Research Platform by the CSU Campuses
MYIR Product Brochure - A Global Provider of Embedded SOMs & Solutions
2. Table of Contents
About MYIR SOMs Customized Services
02 ~ 13
14
15 ~ 16
About MYIR
Naming Convention
SOM Selection Table
ODM Services
OEM Services
Solutions & Applications
19 ~ 21
22 ~ 27
28 ~ 33
34 ~ 35
36 ~ 39
40 ~ 43
44
45
ST Series
NXP Series
TI Series
RENESAS Series
AMD Series
ALLWINNER Series
SemiDrive Series
RockChip Series
46 ~ 54 55
56
Single Board Computers
01 02 03 04
1
3. MYIR Electronics Limited (MYIR for short),
established in 2011, is a global provider of
embedded System-On-Modules (SOMs) and
comprehensive solutions based on various
architectures such as ARM, FPGA, RISC-V, and AI.
We cater to customers' needs for large-scale
production, offering customized design,
industry-specific application solutions, and
one-stop OEM services.
MYIR, recognized as a national high-tech
enterprise, is also listed among the "Specialized
and Special new" Enterprises in Shenzhen, China.
Our core belief is that "Our success stems from our
customers' success" and embraces the philosophy
of "Make Your Idea Real, then My Idea Realizing!"
Company Profile
30,000+
Worldwide Customers
15+
Experience in the
Embedded Industry
years 45+
R&D Personnel
% 5,000+
R&D and
Manufacturing Base
M2 150+
Patents & Honors
ISO 9001
ISO 14001
2
4. History
2011-2012
Shenzhen Headquarter
Established
Beijing Office Established
Shanghai Office Established
Became ARM Approved
Partner
Became Xilinx Design Partner
2018-2021
SMT Factory Established in
Guanlan, Shenzhen
Became ST Authorized Partner
Became SemiDrive Design Partner
Mouser Became Distributor
Digi-key Became Distributor
Qualified as National High-tech
Enterprise
ISO9001 certificated
ISO14001 certificated
2022-2024
Became IDH Partner of Renesas
Became AllWinner Design Partner
Awarded Quality Supplier of
NARI Group
Awarded Quality Supplier of
XJ Group
Honored with The Partner Award
from ST
Awarded with
"Shenzhen Specialized and
Special New Enterprise"
2013-2017
Became TI Design Network Partner
Became NXP Approved Partner
Became IDH Partner of AVNET
Wuhan R&D Center Established
Head Office Moved to Yunli Smart Park
3
5. System-on-Modules
(SOMs)
System-on-Modules
(SOMs)
OEM Services
Application Fields
Main Business
Single Board
Computers ODM Services
ODM Services
OEM Services
Solutions
Solutions
Energy Storage
Medical Devices
PLC
Rail Transport
Industrial Automation
Industrial HMI
EV Charging Station
Commercial Display
Industrial Gateway
AI Edge Computing
Electric Power
Engineering Machinery
Single Board
Computers
4
6. Corporate Culture
Mission
Laying the foundation for digital, intelligent, and
networked embedded products to enable intelligent
manufacturing and smart living.
To become the most trusted provider of embedded SOMs
for industrial customers worldwide.
Co-creation, win-win collaboration, and sharing, aiming to
create maximum value for customers.
Vision Values
MYIR has developed a comprehensive range of professional and sophisticated enterprise-level information management platforms. These platforms enable comprehensive digital
management across various dimensions, including material supply chain, product research and development, customer management, project management, employee management,
production management, and more. Through these platforms, MYIR aims to achieve business digitization, management visualization, and intelligent production.
Information Management Platform
ERP System
Enterprise
Management
Customer
Management
CRM System
Supplier
Management
SRM System
Product
Management
PLM System, DFX Stsyem
Production
Management
MES System, iDAS Electrostatic Monitoring
System, WMS Intelligent Storage System
Business Philosophy
Continuously engaging in technological
innovation to provide customers with
cutting-edge technologies and products.
Systematically establishing a customer service
framework and offering comprehensive technical
support throughout the entire sales cycle,
from pre-sales to post-sales.
Guaranteeing a product lifecycle of no
less than 10 years.
The ISO management system runs through the
entire process, from material selection to R&D,
product testing, production, and shipment.
Delivery
Commitment
Quality
Assurance
Leading
Technology
Professional
Service
5
7. Qualifications and Honors
National High-Tech Enterprise Shenzhen Specialized and
Special New Enterprise
ISO9001 ISO14001
IDH Partner of Renesas
CE Certification Software Copyright Certificate of
Utility Model Patent
Certificate of
Invention Patent
Certificates of the Registration for
Integrated Circuit Layout Designs
Partner Award from ST for MYIR Quality Supplier of XJ Power Co., Ltd. Quality Supplier of NARI Group
第 1 页 (共 2 页)
证 书 号 第6125106号
发 明 专 利 证 书
发 明 名 称:一种计算机USB接口芯片生产用加工装置
发 明 人:朱学良;陈溯;郭勇军
专 利 号:ZL 2023 1 0382229.5
专 利 申 请 日:2023年04月12日
专 利 权 人:深圳市米尔电子有限公司
地 址:518000 广东省深圳市龙华区观澜街道库坑社区库坑大
富工业区2号圣建利工业园厂房C栋201
授 权 公 告 日:2023年07月07日 授 权 公 告 号:CN 116099717 B
国家知识产权局依照中华人民共和国专利法进行审查,决定授予专利权,颁发发明专利证书
并在专利登记簿上予以登记。专利权自授权公告之日起生效。专利权期限为二十年,自申请日起
算。
专利证书记载专利权登记时的法律状况。专利权的转移、质押、无效、终止、恢复和专利权
人的姓名或名称、国籍、地址变更等事项记载在专利登记簿上。
局长
申长雨
2023年07月07日
*2023103822295*
RoHS Certification
6
9. MYIR has established R&D centers in both Shenzhen and Wuhan, and boasts a senior
technical R&D team. Approximately 45% of our personnel are dedicated to R&D, and all of
them possess a bachelor's degree or higher. The core and backbone members of our R&D
team possess extensive experience in the embedded industry, having accumulated more
than 10 years of professional expertise in the field. They are equipped with cutting-edge
design concepts and practices specially tailored for high-volume product applications. Our
products exhibit industry-leading innovation, reliability, and stability, and we have filed for
numerous patents, copyrights, and various certifications, exceeding a total of 100.
R&D Capabilities
Excellent, Scientific,
and Systematic R&D Management
Technology and Skills
Complete R&D Management
Adopting the IPD process management concept, combined
with modern information system management tools
Project
Management
Task
Management
Defect
Management
Review
Management
Knowledge and
Experience Management
Design
Documentation
Code
Management
Design Capability Optimization
Establish complete and unified key design node control
Test Example Standard Circuit Library
Schematic/
PCB CheckList
DFX Management
Material AVL
Preferred Library
High-speed Signal
Design and Simulation
Standard Component
Library
Standard Circuit Diagram
Complete Schematic
(PCB CheckList)
SI Simulation Design
FMEA Analysis
Multiple OS Development Capabilities
Kernel Porting and Driver
Development Capabilities
System Optimization Capabilities
(boot time, real-time performance, multi-system
backup, OTA, security, etc.)
System Customization Capabilities
Conform to Industrial and Power scenarios
Protocol Development and
Application Development Capabilities
Hardware
Development
Software
Development 8
10. Testing Capability
The MYIR R&D and testing team adheres to a scientific, rigorous, objective and fair attitude, relying on a comprehensive testing system and professional, extensive testing
experience. All products are strictly tested in accordance with relevant national standards, industry standards, and company standards, ensuring that all the product has
long-term stability, reliability, mass production capability, and data traceability.
盐雾测试 MTBF测试
GB/T 2423.2-2008
GB/T 2423.22-2012
GB/T 2423.5-2019
GB/T 2423.8-1995
GB/T 2423.10-2019
Standards Range
Main Evaluation Items
GB/T 2423.17-2008
GB/T 19056-2012
Reliability Test
Standards Range
Main Evaluation Items
Power Test Signal Test
Corresponding chip data manual
Ground
Impedance Test
Ripple Test
Up-down
Waveform Test
Power On/Off
Timing Test
Power
Consumption Test
Power Noise Test
I2C Test
I2S Test
SDIO Test
Clock Test
Ethernet Test
UART Test
CAN Test
RS232/RS485 Test
EN55032
IEC61000-4
NB/T33008.1
GB/T 17626
Standards Range
Main Evaluation Items
Signal Test EMC Test Certification
EMI: Electromagnetic Interference
EMS: Electromagnetic Sensitivity
RE: Radiation Emission
CE: Conducted Emissions
RS:
Radiation Immunity
CS:
Conducted Immunity
ESD:
Electrostatic Immunity
Surge: Surge
Immunity
CE Certification
RoHS Certification
EN 55032: 2015
EN 55035: 2017
IEC62321
EN 61000-3-3: 2013
EN IEC 61000-3-2: 2019
Standards Range
Main Evaluation Items
Harmonics:
Harmonic Current
Flicker: Flashing
EFT/B:
Electric Fast Transient
Pulse Group
PMS:
Power Frequency
Magnetic Field
Anti-interference Degree
Dips:
Voltage Drop/
Short Interruption
High Temperature Test
Vibration Testing Shock Test
Salt Spray Test MTBF Test
Aging Test
9
11. Technical Services
MYIR is customer-oriented, and provides comprehensive technical support and services for various issues encountered by customers during the processes of project selection,
project approval, project development, product testing, small-batch trial production, and mass production. The company's frontline engineering team assists customers in
solving technical problems through various channels such as online communication, telephone, email, remote video conferencing, and on-site services, and provides abundant
learning materials. MYIR is committed to accelerating the customer's development process, reducing the customer's development costs, ensuring the quality of the customer's
products, and enhancing the competitiveness of the customer's products in the market.
Pre-sales Service
In-sales Service
After-sales Service
Communication and Requirement Analysis
The technical service team actively and comprehensively
participates in analyzing and understanding customer requirements.
Prototype Verification
We ensure the feasibility and stability of the system
design for the selected platform.
Consultative Product Selection Guidance
Our professional team recommends the most suitable SOM
optimized for performance, functionality, and cost-effectiveness.
Project Technical Risk Assessment
We identify potential risks, propose effective solutions,
and formulate countermeasures.
Software and Hardware Framework Construction
We ensure that the overall software and hardware system design
aligns with and fulfills the customer's specific requirements.
Developer Resources Download
Provide detailed documentation and software packages
for products.
1
1
4
2
5
3
Schematic and PCB Design Guidance
Ensure that the circuit design layout is reasonable and
meets system performance and stability requirements.
2
Schematic and PCB Review
Avoid potential circuit board design issues and defects.
3
Assist with Driver Development
Ensure compatibility between hardware and software, and
verify the functionality and performance of underlying drivers.
4
Assist with Middleware Porting
Ensure the normal operation and functional integrity
of the system.
5
Production Process Guidance
Provide production process guidance documents as a
reference to ensure product efficiency and quality.
9
R&D Sampling Service
Provide one-stop sampling services and reports, analyze
potential issues, and provide improvement suggestions.
10
Assist with System Optimization and Cropping
Improve system performance and stability while reducing
resource consumption.
6
Material Selection Guidance
Provide suggestions on quality, performance, and pricing
to enhance product competitiveness.
7
Test Plan Guidance
Ensure the project meets quality standards before launch
and guarantee product stability.
8
Technical Support
Respond to customer queries in a timely manner,
primarily providing support through emails, phone calls,
or online meetings.
Problem Recording and Organization
Maintain separate records for each customer issue to
track the root cause and implement continuous
improvement measures.
Warranty
Offer product repair and exchange services. MYIR's
production system ensures batch traceability at both the
product and material levels, facilitating problem
identification, analysis, resolution, as well as the provision of
analysis reports and usage suggestions.
Knowledge Sharing
Aid customers in enhancing their understanding of product
usage through articles, documentation and videos.
Output 8D report
The report encompasses a comprehensive analysis, including
problem description, root cause analysis, corrective actions,
preventive measures, and improvement suggestions.
10
12. The warehouse uses X-ray automatic component counting machines and AI-enabled intelligent
sensing shelves. For the electronic components warehouse, it maintains a controlled temperature
and humidity, incorporates anti-static measures, and strictly adheres to a first-in-first-out inventory
management protocol. It supports the issuance of materials for multiple work orders, enables
real-time inventory tracking, prevents material loss and errors, seamlessly integrates with MES and
ERP systems, and ensures traceability throughout the entire process of usage and management.
Systematic Warehouse Management A Complete Supply Chain System
Project initiation, PCB design, layout review, trial
production summary, and transition to mass
production review and summarize meetings to ensure
the smooth transition of the project.
Track and inspect the factory production line, conduct
sampling of finished products, timely feedback on
production abnormalities, and track process
improvement confirmations to ensure process quality
Conduct QA inspection, finished product sampling,
packaging inspection to ensure finished product quality
Hold timely and effective customer complaint meetings,
conduct root cause investigations and improvements,
confirm effectiveness. Follow up with customers,
adhering to customer-first principles
Material recognition, sample sealing, incoming inspection
(appearance, function) to ensure raw material quality
WMS Intelligent
Warehousing System
Intelligent shelves, combined with a smart
warehouse system, achieve zero material error.
Constant Temperature and
Constant Humidity, Ensuring Safety
Integrated circuits and electronic components are
stored in warehouses and cabinets maintained at
constant temperature and humidity to ensure the
effectiveness and reliability of materials.
We have a senior supply chain management team with over 10 years of industry experience. We offer
comprehensive BOM material supply, component selection, and substitute recommendation services. With
professional BOM engineers and strict, standardized IQC incoming material inspection standards, as well as
original genuine product guarantees sourced from original manufacturers and primary agents, we ensure that
we provide our customers with short delivery times, high-quality, and low-price component guarantees.
1,000+ Original Manufacturers and Agent Cooperation Partners (including some of them)
MYIR has implemented a series of inspection steps, including incoming inspection of materials, pre-assembly baking, solder paste printing inspection, online AOI, first article
inspection, spot X-RAY inspection, IPQC patrol inspection, and QA outgoing inspection. We also conduct comprehensive real-time electrostatic protection monitoring. By
adhering to the ISO9001 quality management system, we ensure a high product qualification rate for all outgoing products.
Quality Assurance
Incoming Materials Inspection
Process Control
QA Outgoing Inspection
Customer Feedback
Project Management
arrow.cn
11
13. Production Capacity
MYIR has a 3,000-square-meter smart SMT factory, equipped with a Class 100,000 cleanroom and multiple SMT production lines. Leveraging advanced production
equipment, sophisticated management systems, stringent quality control processes, a comprehensive supply chain network, and robust engineering support, we guarantee
product quality throughout the entire process, from raw material sourcing to production and ultimately shipping. Our factory possesses a surface mount capability of over 5
million points per day, and all production processes adhere strictly to RoHS and REACH standards.
Complete Automated Production Equipment
Equipped with Panasonic imported high-speed dual-track SMT line, our factory has fully
automatic solder paste printer, nitrogen reflow oven, wave soldering machine, AOI, SPI and
X-RAY inspection machines, intelligent first article inspection instrument, intelligent solder
paste management cabinet, automatic PCB router machine, conformal coating machine,
laser engraving machine, BGA rework stations, and other equipment. It is also supported by
MES intelligent management system, intelligent warehousing system, ERP system, and static
electricity management system.
Automatic Solder Paste Printer Automatic Solder Paste Inspection
Machine (3D SPI)
12
14. An industry-leading integrated manufacturing information management system (MES) that
enables seamless integration with ERP, WMS, SRM and other systems, improving the real-time
nature and transparency of factory management, as well as the level of full-process traceability
and error prevention control for products.
The production workshop equipment and assembly line stations are equipped with LoRa
electrostatic monitoring nodes. If the electrostatic levels exceed the standard, audible and
visual alarms will be triggered. The real-time data collected by the gateway will be
transmitted to the data backend. Overall electrostatic data from the workshop can be
dynamically displayed on a large screen in multiple dimensions.
Integrated Manufacturing Information Management System
Excellent Production Environment Conditions
NPM-D3A SMT Machine NPM-TT2 SMT Machine Online AOI Automatic Coating Production Line
13
15. Naming Convention
Manufacturer
Product Category
SOM Interface
Processor Model
Product Version
ROM Capacity
RAM Capacity Temperature Grade (C, E, I)
CPU Clock Speed
(Max)
MY: MYIR
Y: LCC/LCC+LGA
C: B2B Connector
J: MXM
L: LGA
No Character: SBC
No Character: V1 Version
V2: V2 Version
2D: 2GB DDR
1D: 1GB DDR
512D: 512MB DDR
256D: 256MB DDR
C: Commercial (0 ℃~+70 ℃)
E: Extended (-20 ℃~+70 ℃)
I: Industrial (-40 ℃~+85 ℃)
Special Identification
No Character: No Special Identification
B: With Enclosure
G: Material Difference
FAN: With Heatsink
B: Base Board
C: SOM
D: Development Board
S: Single Board Computer
120: 1.2GHz
80: 800MHz
65: 650MHz
E: eMMC
8E: 8GB eMMC
4E: 4GB eMMC
N: Nand Flash
256N: 256MB Nand Flash
512N: 512MB Nand Flash
M Y D - Y G 2 L 2 3 - V 2 - 8 E 2 D - 1 2 0 - I - X
G2LX: RZ/G2L
335X: AM335X
T113X: T113
6ULX: i.MX6UL
LCC (Leadless Chip Carriers, Castellated-hole)
LGA (Land Grid Array)
MXM (Mobile PCI Express Module, Gold-finger)
Where X is an explicit character,
used to distinguish different chip
models of the same series.
14
18. Advantages of MYIR’s System-On-Modules
Innovative Design
LCC/LGA Packaging
Ensures more stable and reliable signal connection,
superior vibration resistance, and convenience for mass
production
Shield Design
Resistant to signal interference and dust, while
supporting customized LOGO to enhance customer
brand value
Compact Design
Features a small size and flexible design, making it
suitable for various sizes of products, especially those
with limited structural space
Excellent Quality
Rigorous Testing
The SOMs undergo six rigorous tests, including signal
tests, high and low temperature tests, aging tests,
electrostatic tests, over 5,000 power-on and power-off
tests, and MTBF tests, to ensure product stability.
Compliance with International
Certification Standards
Adopting international SGS as a certification testing
partner, we provide CE and RoHS certification reports
Smart Factory
MYIR’s own factory, equipped with advanced production
equipment and adopting MES systems, ensures
high-quality and traceability of products
Competitive cost
Scale Effect
With over one million SOMs sold annually, we achieve
excellent bulk material costs through mass production
Packaging Advantage
The SOMs adopt an LCC/LGA packaging design, which
saves the cost of board-to-board connectors
Supply Chain Management
Establishing close cooperation relationships with
original manufacturers enables us to obtain more
competitive chip price support
17
19. Advantages of MYIR’s System-On-Modules
Quick Delivery and
Long Lifecycle
Short lead time
By implementing a comprehensive inventory
management system for our standard products, we
guarantee a shortened lead time for both sample and
bulk orders.
Long lifecycle
We guarantee a supply duration exceeding 10 years. In
case of material discontinuation, we have established a
comprehensive product change process and notification
policy to mitigate any potential disruptions.
Long-term maintenance
Our commitment extends to providing ongoing
software maintenance and regular updates for the BSP
package, ensuring its continued reliability and
performance over time.
Full-service
technical support
Pre-sales service
We offer optimal platform recommendations, feasibility
assessments, software and hardware framework
setups, and prototype function verifications during the
selection phase, guiding you through the initial stages
of your project seamlessly.
In-sales service
During the design phase, we provide schematic
diagram and PCB guidance and review, driver
debugging, middleware transplantation, and system
optimization, ensuring the smooth progress of your
development efforts.
After-sales service
We maintain prompt email communication with our FAE
team, offering remote assistance to resolve any issues
that may arise. We document the entire process and
provide an 8D report, ensuring transparency and
continuous improvement.
Abundant development
resources
Hardware documentation
Comprehensive product manuals, hardware design
guides, hardware user manuals, and pin usage tables
for our SOMs, facilitating easy integration and
customization.
Software documentation
Detailed quick start guides, software development
guides, software evaluation guides, and application
notes, enabling efficient software development and
deployment.
Design materials
Access to our baseboard schematic and PCB source
files, BSP software source code, and industry
application demos, providing a solid foundation for
your design and development efforts.
18
20. MYD-YF13X Development Board Top-view
Industrial Gateway Industrial Control
Industrial HMI Power Management
4G Module
Interface
USB2.0
Host x2
USB C
OTG
DC Jack
12V Input
CAN
RS485
RS232
BOOT Switch
USB
UART0 Debug
RTC BAT
MYC-YF135
Reset
4G ANT
User
ON/OFF
Giga Ethernet1
Giga Ethernet0
2X25 PIN
RGB/I2C/PWM
2X10 PIN
Ext IO
Audio
SIM Card
SD Card
RGB CAMERA
MYD-YF13X Development Board Bottom-view
MYC-YF13X
ST STM32MP135 Processor, Cortex-A7@1.0GHz
DDR3L, Nand Flash/eMMC, EEPROM
LCD-TFT Parallel Display Interface, 16-bit Camera, 2x USB2.0, 2x CAN-FD, 2x Gigabit Ethernet
37mm x 39mm; LCC Package, 148-pin; -40℃~+85℃ Industrial; Linux OS
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
Part Selections (Other Configurations can be Customized for Mass Production)
MYC-YF135-256N256D-100-I
MYC-YF135-4E512D-100-I
STM32MP135DAF7 Cortex-A7@1.0GHz
256MB DDR3
512MB DDR3
256MB Nand Flash
4GB eMMC
32Kbit EEPROM LCC 148PIN -40℃~+85℃ 37mm x 39mm
MYD-YF135-256N256D-100-I
MYD-YF135-4E512D-100-I
Linux
Communications
Multimedia
Others
Key Applications
2×RGMII, 2×CAN FD, 2×USB2.0, 8×UART, 5×SPI, 5×I2C
RGB, DCMI, 2×SAI, 3×I2S
12-bit 19-ch ADC, 12-bit 18-ch ADC, SWD
Peripherals/Interfaces
19
21. Reset Key
RTC BAT Conn
I2C x2 SPIx2
UART x2
CAN x1
SAI x1
Boot Switch
2x20PIN
RPI Interface
2x25PIN
2x10PIN DCMI 2x10PIN 2x10PIN
SDIOx1 UARTx1 IO
USB2.0x2
RGB
I2C
Resistor TP
PWM
DC JACK
5V Input
Ethernet
USB HOST
x2
Type C(DRP)
Type C(Debug)
Micro SD
User Key
PWR Key
Camera
RGB LCD
MYD-YA15XC-T Development Board Top-view MYD-YA15XC-T Development Board Bottom-view
SOM Part Number CPU
256MB DDR3
512MB DDR3
256MB Nand Flash
4GB eMMC
CPU Cores and
Clock Speed (Max)
RAM ROM Others
32Kbit EEPROM
Package
LCC
148PIN
Working Temp. Dimensions
37mm × 39mm
Software
MYC-YA151C-256N256D-65-C-T
STM32MP151AAC3
-40℃~+85℃
-40℃~+85℃
MYD-YA151C-V2-256N256D-65-C-T
MYC-YA151C-256N256D-65-I-T
Cortex-A7@650MHz
+Cortex-M4@209MHz
MYD-YA151C-V2-256N256D-65-I-T
MYC-YA151C-4E512D-65-C-T 0℃~+70℃
0℃~+70℃
MYD-YA151C-4E512D-65-C-T
MYC-YA151C-4E512D-65-I-T MYD-YA151C-4E512D-65-I-T
Linux
Development Board
Part Number
Part Selections (Other Configurations can be Customized for Mass Production)
Communications
Multimedia
Others
Key Applications
RGMII, 2×USB2.0, 8×UART, 6×SPI, 6×I2C
RGB, DCMI, 4×SAI, 3×I2S
2×16-bit 20-ch ADC, SWD
Peripherals/Interfaces
Medical Device Industrial
Manufacturing
HMI Petroleum &
Chemical
MYC-YA15XC-T
ST STM32MP151 Processor, Cortex-A7@650MHz + Cortex-M4@209MHz
DDR3L, Nand Flash/eMMC, EEPROM
Gigabit Ethernet, 2x USB 2.0, 8x UART, 6x SPI, 6x I2C
37mm x 39mm; LCC Package, 148-pin; 0 to 70 ℃ Commercial, -40℃~+85℃ Industrial; Linux OS
20
22. MYD-YA157C-V3 Development Board Top-view MYD-YA157C-V3 Development Board Bottom-view
Giga
Ethernet
USB2.0
Host
Expansion IO JTAG LED Debug UART
MIPI
WIFI & BT ANT
WIFI&BT
User Key
Wake up Key
Reset Key
CAN
HDMI
RS485
RS232
Type-C
Type-C
Power Input
RGB
DC Jack
12V Input
Micro SD
Medical Device Industrial
Manufacturing
HMI Petroleum &
Chemical
MYC-YA157C-V3
ST STM32MP157 Processor, 2x Cortex-A7@650MHz + Cortex-M4@209MHz
DDR3, eMMC, Ethernet PHY
Gigabit Ethernet, 2x CAN, 2x USB2.0, 8x UART, 6x SPI, 6x I2C
43mm x 45mm; LCC Package, 164-pin; 0 to 70 ℃ Commercial, -40℃~+85℃ Industrial; Linux OS
Part Selections (Other Configurations can be Customized for Mass Production)
Communications
Multimedia
Others
Key Applications
RGMII, 2×CAN FD, 2×USB2.0, 8×UART, 6×SPI, 6×I2C
RGB, MIPI DSI, 4×SAI, 3×I2S
2×16-bit 20-ch ADC, SWD
Peripherals/Interfaces
SOM Part Number
MYC-YA157C-V3-4E512D-65-C
MYC-YA157C-V3-4E512D-65-I
CPU
STM32MP157AAC3
2×Cortex-A7@650MHz
+Cortex-M4@209MHz 512MB DDR3L
CPU Cores and
Clock Speed (Max)
RAM
4GB eMMC
ROM Others
Ethernet PHY
Package
LCC 164PIN
Working Temp.
0℃~+70℃
-40℃~+85℃
Dimensions
43mm x 45mm
Software
MYD-YA157C-V3-4E512D-65-C
MYD-YA157C-V3-4E512D-65-I
Linux
Ubuntu
Development Board
Part Number
21
23. Communications
Multimedia
Others
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
SIM Card1 SIM Card2
4G/5G Module Interface
MYC-LMX9X
NXP i.MX 93 Processor, 2*Cortex-A55@1.7GHz + Cortex-M33@250MHz
0.5 TOPS NPU for Cost-effective and Energy-efficient ML Applications
2x Gigabit Ethernet (one TSN-based), 2x CAN FD, 8x UART, 8x I2C, 8x SPI
LPDDR4, eMMC, EEPROM, 37mm x 39mm; LGA Package, 218-pin; -40℃~+85℃ Industrial
Linux OS (Yocto based with QT / Debian)
MYD-LMX9X Development Board Top-view MYD-LMX9X Development Board Bottom-view
Key Applications
Motion Controller Engineering
Machinery
Part Selections (Other Configurations can be Customized for Mass Production)
2×RGMII, 2×CAN FD, 2×USB2.0, 8×UART, 8×SPI, 8×I2C, 2×I3C
MIPI DSI, LVDS, RGB, MIPI CSI, Parallel CSI , 3×SAI
12bit 4ch ADC, JTAG
Peripherals/Interfaces
MYC-LMX9352-8E1D-170-I
MYC-LMX9352-8E2D-170-I
MIMX9352CVVXMAB
2×Cortex-A55@1.7GHz+
Cortex-M33@250MHz
2GB LPDDR4
1GB LPDDR4
8GB eMMC 256KBit EEPROM LGA 218PIN -40℃~+85℃ 37mm x 39mm
MYD-LMX9352-8E1D-170-I
MYD-LMX9352-8E2D-170-I
Linux
Debian
Medical Device
Charging Pile
4G/5G ANT WIFI ANT Micro SD
Audio
WIFI Module
RS232/RS485/CAN
JTAG
USER KEY
Reset KEY
LVDS
A55 Debug
M33 Debug
MIPI CSI
ON/OFF KEY
RGB
ADC
Power Switch
DC Jack
12V Input
Type-C
OTG
HDMI
Giga
ENET2
Giga
ENET1
USB2.0
Host x2
BOOT Switch
MYC-LMX9X
22
24. SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
Communications
Multimedia
Others
Key Applications
Peripherals/Interfaces
MYC-J1028X
NXP LS1028A Processor, 2*Cortex-A72@1.5GHz, DDR4, eMMC, EEPROM
6x Gigabit Ethernet (TSN-based), 2x USB3.0, 2x CAN FD, 6x UART, 3x SPI, 1x SATA3.0
Support DP Display (DP1.3 and eDP 1.4, resolution up to 4K@60FPS)
45mm x 82mm; MXM 3.0 Gold-finger Interface, 314-pin; -40℃~+85℃ Industrial;
Supports Ubuntu and Real-time Edge Images based on Linux
MYD-J1028X Development Board Top-view MYD-J1028X Development Board Bottom-view
Industrial Routers Industrial Control Edge Computing
Part Selections (Other Configurations can be Customized for Mass Production)
SGMII, QSGMII, RGMII, 2×PCIE3.0, SATA 3.0, 2×USB3.0,
2×CAN FD, 6×UART, 3×SPI, 8×I2C
eDP, 6×SAI
JTAG
MYC-J1028N-8E2D-150-I LS1028AXN7PQA 2×Cortex-A72@1.5GHz 2GB DDR4 8GB eMMC 32Kbit EEPROM MXM 314PIN -40℃~+85℃ 45mm x 82mm MYD-J1028N-8E2D-150-I
Linux
Ubuntu
Ext GPIO/
SPI/UART/I2C
SSD Card
5G Module
Interface
AS0B821-S78B-7H
WIFI Module
Interface Boot Switch
DC Jack
12V Input
DP
DEBUG
UART
Audio Out
USB3.0
HOST
Giga Ethernet
x5
MYC-J1028X
Micro SD
JTAG
Switch
Buttons
FAN 12V
SIM2 Card
SIM1 Card
Automotive
Electronics
23
25. MYD-JX8MMA7 Development Board Top-view MYD-JX8MMA7 Development Board Bottom-view
MYC-JX8MMA7
i.MX 8M Mini + XC7A25T Aritx-7, 4*Cortex-A53@1.8GHz + Cortex-M4@400MHz + FPGA
ARM: LPDDR4, eMMC, QSPI Flash; FPGA: DDR3, QSPI Flash
Integrated 2D/3D GPU and 1080p VPU, Two PMIC (one for ARM and one for FPGA)
45mm x 82mm; MXM 3.0 Gold-finger Interface, 314-pin; -40℃~+85℃ Industrial; Linux OS
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
RGMII, 2×USB2.0, 4×UART, 2×SPI, 2×I2C, 3×GTP
MIPI DSI, MIPI CSI, 3×SAI
JTAG
Peripherals/Interfaces
SOM Part Number
MYC-JX8MMA7-8E2D-32Q256D-160-I
MYC-JX8MMA7-8E2D-32Q256D-180-C
CPU
4×Cortex-A53@1.6GHz+
Cortex-M4@400MHz
FPGA: 23K
4*Cortex-A53@1.8GHz+
Cortex-M4@400MHz
FPGA: 23K
ARM: MIMX8MM6CVTKZAA
FPGA: XC7A25T-2CSG325I
ARM: MIMX8MM6DVTLZAA
FPGA: XC7A25T-2CSG325C
ARM:
2GB LPDDR4
FPGA:
256MB DDR3
ARM:
8GB eMMC
FPGA:
32MB QSPI FLASH
CPU Cores and
Clock Speed (Max) RAM ROM Others
32MB QSPI FLASH
Package
MXM
314PIN
Working Temp.
-40℃~+85℃
Dimensions
45mm x 82mm
Software Development Board Part Number
MYD-JX8MMA7-8E2D-32Q256D-160-I
MYD-JX8MMA7-8E2D-32Q256D-180-C
Linux
&
LVDS OUTPUT
Micro SIM1
Micro SIM2
MIPI CSI
Parallel CSI
POWER
SWITCH
DC-12V
Type-C
USB DRP
USB
HOST
SFP2
SFP1
HDMI
AUDIO
1000MB
Ethernet
MYC-JX8MMA7
ON / OFF KEY
USER KEY
FMC-LPC
ARM BOOT
FPGA BOOT
5G MOUDLE
FPGA RST
RESET KEY
ARM SD
Ext GPIO/I2C/SAI/UART
Ext WIFI/BT
FAN
FPGA
DEBUG FPGA SD
ARM
Debug
Data Acquisition Industrial Control Industrial Gateway
Medical Equipment
0℃~+70℃
Communications
Multimedia
Others
24
26. MYC-JX8MPQ
NXP i.MX 8M Plus Processor, 4*Cortex-A53@1.6GHz + Cortex-M7@800MHz
2.3 TOPS NPU for Extensive AI/ML Capabilities; 800MHz Audio DSP, Dual Camera Interfaces (ISP), 3D GPU
LPDDR4, eMMC, QSPI Flash; 2x USB3.0, 2x Gigabit Ethernet, 2x CAN FD, 4x UART, 3x SPI, 6x I2C
45mm x 82mm; MXM Package, 314-pin; -40℃~+85℃ Industrial; Linux OS
Key Applications
High-performance
AI Devices
Industrial Computers
HMI
Part Selections (Other Configurations can be Customized for Mass Production)
2×RGMII, PCIE3.0, 2×USB3.0, 2×CAN FD, 4×UART, 3×SPI,
6×I2C
HDMI, MIPI-DSI, LVDS, 2×MIPI CSI, 6×SAI
JTAG
Peripherals/Interfaces
SOM Part Number
MYC-JX8MPQ-8E2D-160-I
MYC-JX8MPQ-8E4D-160-I
CPU
MIMX8ML8CVNKZAB
4×Cortex-A53@1.6GHz
+Cortex-M7@800MHz
2GB LPDDR4
4GB LPDDR4
CPU Cores and
Clock Speed (Max)
RAM
8GB eMMC
ROM Others
32MB QSPI FLASH
Package
MXM 314PIN
Working Temp.
-40℃~+85℃
Dimensions
45mm x 82mm
Software Development Board Part Number
MYD-JX8MPQ-8E2D-160-I
MYD-JX8MPQ-8E4D-160-I
Linux
JTAG
UART4 UART2
CAN 0 CAN 1
Ext GPIO/
SPI/UART/I2C Ext WIFI/BT
SSD Card
5G Module
12 DCIN
ENET 1
ENET 0 HDMI
TYPE-C
USB DRP
TYPE-C
Debug
SIM
Card
Headphone
USB Host
2×LVDS
(LVDS 0+LVDS 1)
RTC Battery
FAN Header
eMMC
QSPI
BOOT Switch
CPU
LPDDR4
Buttons
Switch
MYD-JX8MPQ Development Board Top-view MYD-JX8MPQ Development Board Bottom-view
LVDS 0
LVDS 1
CSI 1
CSI 2
DSI
SIM Card
TF Card
Edge Computing
Communications
Multimedia
Others
25
27. MYC-C8MMX-V2
NXP i.MX 8M Mini Processor, 4*Cortex-A53@1.8GHz + Cortex-M7@400MHz
DDR4, eMMC, QSPI Flash, On-board Gigabit Ethernet PHY
2x USB2.0, Gigabit Ethernet, PCIE2.0, 4x UART, 3x SPI, 3x I2C
49mm x 60mm; 200-pin Board-to-Board Connectors; 0℃~+70℃ Commercial; -40℃~+85℃ Industrial
Linux / Android OS
MYD-C8MMX-V2 Development Board Top-view MYD-C8MMX-V2 Development Board Bottom-view
Key Applications
Medical Device Industrial Control
Commercial HMI
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number
MYC-C8MMQ6-V2-8E2D-180-C
MYC-C8MMQ6-V2-8E2D-160-I
CPU
MIMX8MM6DVTLZAA
MIMX8MM6CVTKZAA
4×Cortex-A53@1.8GHz
+Cortex-M4@400MHz
4×Cortex-A53@1.6GHz
+Cortex-M4@400MHz
2GB DDR4
CPU Cores and
Clock Speed (Max)
RAM
8GB eMMC
ROM Others
Ethernet PHY
32MB QSPI FLASH
Package
B2B 200PIN
Working Temp.
-40℃~+85℃
0℃~+70℃
Dimensions
49mm × 60mm
Software Development Board Part Number
MYD-C8MMQ6-V2-8E2D-180-C
MYD-C8MMQ6-V2-8E2D-160-I
Linux
Android
Peripherals/Interfaces
RGMII, PCIE2.0, 2×USB2.0, 4×UART, 3×SPI, 3×I2C
MIPI DSI, MIPI CSI, 5×SAI
JTAG
TP
Backlight
Dual LVDS LCD
Single LVDS LCD
12V POWER IN
LTE Module
Interface
Camera
Boot Switch
WIFI/BT
WIFI/BT ANT
Buttons
Audio Out
Expansion
Header Debug ESPI
UART3
Audio In
Micro USB
USB2.0
ETH Micro SD SIM Card
USB2.0 UART4
Artificial
Intelligence
MIPI Interface SSD Card
Communications
Multimedia
Others
26
28. MYC-Y6ULX-V2
NXP i.MX 6UL/i.MX 6ULL Processor, Cortex-A7@528MHz
DDR3, Nand FLASH/eMMC, On-board Gigabit Ethernet PHY
2x USB2.0, 2x 10/100Mbps Ethernet, 2x CAN, 8x UART, 4x SPI, 4x I2C
37mm x 39mm; LCC Package, 140-pin; 0℃~+70℃ Commercial; -40℃~+85℃ Industrial;
Linux OS
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
512MB DDR3
CPU CPU Cores
and Clock Speed (Max)
RAM
4GB eMMC
256MB DDR3 256MB Nand FLASH
256MB DDR3 256MB Nand FLASH
ROM Others
Ethernet PHY
Package
LCC 140PIN
Working Temp. Dimensions
37mm x 39mm
Software Development Board Part Number
MYC-Y6ULY2-V2-256N256D-50-C
MCIMX6Y2CVM05AB
0℃~+70℃ MYD-Y6ULY2-V2-256N256D-50-C
MYC-Y6ULY2-V2-256N256D-50-I
Cortex-A7@528MHz
-40℃~+85℃ MYD-Y6ULY2-V2-256N256D-50-I
MYC-Y6ULY2-V2-4E512D-50-C 0℃~+70℃ MYD-Y6ULY2-V2-4E512D-50-C
MYC-Y6ULY2-V2-4E512D-50-I
MCIMX6G2CVM05AB
-40℃~+85℃
MYD-Y6ULY2-V2-4E512D-50-I
MYC-Y6ULG2-V2-256N256D-50-I MYD-Y6ULG2-V2-256N256D-50-I
Linux
Peripherals/Interfaces
2×RMII, 2×CAN, 2×USB2.0, 8×UART, 4×SPI, 4×I2C
RGB, Parallel CSI , 3×I2S
2×12bit 10ch ADC, JTAG
Buttons LEDs
WIFI Module
SIM Card
Camera
LTE Module
interface
RTC Battery
Holder
Expansion
Header
Micro SD
Card
USB Host*2
RS485/CAN/RS232
ETH1
ETH2
LTE
Antenna
WiFi
Antenna
Micro USB
OTG
Debug UART
12V Power In
Headphone
MIC
Line In
LCD
Boot Switch
HMI Industrial Control Medical Device
Charging Pile
MYD-Y6ULX-V2 Development Board Top-view
Communications
Multimedia
Others
27
29. MYC-YM62X
TI AM62x Processor, 1/2/4x Cortex-A53@1.4GHz + Cortex-M4F@400MHz
DDR4, eMMC, EEPROM, PMIC
3D GPU (Only for AM625), full-HD dual-display support
2x Display Controllers, 2x USB2.0, 2x Gigabit Ethernet, 3x CAN-FD, 1x GPMC
43mm x 45mm; LCC + LGA Package, 164-pin + 58-pin; -40℃~+85℃ Industrial; Linux
MYD-YM62X Development Board Top-view MYD-YM62X Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
MYC-YM6254-8E2D-140-I
MYC-YM6252-8E1D-140-I
MYC-YM6231-8E1D-140-I
AM6254ATCGGAALW
AM6252ATCGGAALW
AM6231ASGGGAALW
2GB DDR4
1GB DDR4
1GB DDR4
8GB eMMC 32Kbit EEPROM LCC+LGA 222PIN -40℃~+85℃ 43mm x 45mm
MYD-YM6254-8E2D-140-I
MYD-YM6252-8E1D-140-I
MYD-YM6231-8E1D-140-I
Linux
4×Cortex-A53@1.4GHz+
Cortex-M4F@400MHz
2×Cortex-A53@1.4GHz+
Cortex-M4F@400MHz
Cortex-A53@1.0GHz+
Cortex-M4F@400MHz
2×RGMII, 2×USB 2.0, 9×URAT, 3×CAN FD, 4×I2C, 5×SPI
2×LVDS, 1×RGB, 1×MIPI CSI, 3×MCASP
1×GPMC, 1×JTAG
Communications
Multimedia
Others
Medical Device Industrial Control
Industrial HMI Energy & Power
28
30. MYC-C335X-V4
Up to 1GHz TI AM335x Cortex-A8 processors
DDR3, Nand Flash, Gigabit Ethernet PHY
6x UART, 2x USB2.0, 2x Gigabit Ethernet, 2x CAN
70mm x 50mm; DIP Package, 2x 60-pin; -40℃~+85℃ Industrial; Linux
MYD-C335X-V4 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
2×RGMII, 2×CAN, 2×USB2.0, 6×UART, 2×SPI, 3×I2C
RGB, 2×McASP
12bit 8ch ADC, JTAG
Communications
Multimedia
Others
Reset
RS485×1
CAN×1
TF Card
5V Power
EXT interface
ADC×7
SPI×1
I2C×2
UART×4
LCD+Touch
USER LED×3
HDMI×1
Audio In
Audio Out
USB 2.0
Host×4
UART2 3-Wire
Debug 3-Wire
10/100/1000M
ETH0
10/100M/1000M
ETH1
Mini USB
OTG
Buttons
Bettery Holder
256MB DDR3
512MB DDR3
256MB DDR3
512MB DDR3
256MB Nand FLASH
512MB Nand FLASH
256MB Nand FLASH
512MB Nand FLASH
Ethernet PHY
32Kbit EEPROM
DIP
2×60PIN
70mm × 50mm
MYC-C3352-V4-256N256D-80-I
AM3352BZCZD80
-40℃~+85℃
MYD-C3352-V4-256N256D-80-I
MYC-C3352-V4-512N512D-80-I Cortex-A8@800MHz MYD-C3352-V4-512N512D-80-I
MYC-C3352-V4-512N512D-80-C 0℃~+70℃ MYD-C3352-V4-512N512D-80-C
MYC-C3358-V4-256N256D-100-I
AM3358BZCZA100 Cortex-A8@1.0GHz
-40℃~+85℃
MYD-C3358-V4-256N256D-100-I
MYC-C3358-V4-512N512D-100-I MYD-C3358-V4-512N512D-100-I
MYC-C3358-V4-512N512D-100-C 0℃~+70℃ MYD-C3358-V4-512N512D-100-C
Linux
Medical Equipment Industrial Control Gaming Peripherals
Charging PileBilling
Control Unit
29
31. MYC-Y335X-V2
Up to 1GHz TI AM335x Cortex-A8 processors
DDR3, Nand Flash, Gigabit Ethernet PHY, PMIC
6x UART, 2x USB 2.0, 2x Gigabit Ethernet, 2x CAN
65mm x 35mm; LCC Package, 146-pin; -40℃~+85℃ Industrial; Linux
MYD-Y335X-V2 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
2×RGMII, 2×CAN, 2×USB2.0, 6×UART, 2×SPI, 3×I2C
RGB, 2×McASP
2×12bit 8ch ADC, JTAG
Communications
Multimedia
Others
MYC-Y3352-V2-256N256D-80-I
MYC-Y3358-V2-256N256D-100-I
AM3352BZCZD80
AM3358BZCZA100
Cortex-A8@800MHz
Cortex-A8@1.0GHz
256MB DDR3 256MB Nand FLASH
Ethernet PHY
32Kbit EEPROM
LCC 146PIN -40℃~+85℃ 65mm x 35mm
MYD-Y3352-V2-256N256D-80-I
MYD-Y3358-V2-256N256D-100-I
Linux
Medical Equipment Industrial Control Gaming Peripherals
Charging PileBilling
Control Unit
Boot
Jumper
Reset Power Button
Bettery Holder
USR Button
TF Card
EXT Interface
JTAG
Buzzer
LCD
POWER Switch
POWER 5V
Debug UART
Audio Out
Net1_10/100/1000M
Net2_10/100/1000M
Mini
USB
USB
Host Audio In
RS485×1 CAN×1
30
32. MYC-J335X-V2
Up to 1GHz TI AM335x Cortex-A8 processors
DDR3, Nand Flash, Gigabit Ethernet PHY, PMIC
6x UART, 2x USB2.0, 2x Gigabit Ethernet, 2x CAN, 2x SPI
67mm x 45mm; MXM Package, 200-pin; -40℃~+85℃ Industrial; Linux
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
2×RGMII, 2×CAN, 2×USB2.0, 6×UART, 2×SPI, 3×I2C
RGB, 2×McASP
12bit 8ch ADC, JTAG
Communications
Multimedia
Others
USART×2
Net1_10/100/1000M
USB
OTG
USB
Uart
USB
Host
Audio In
Audio Out
Net2_10/100/1000M
Battery Holder
Micro SD
Power_en
User keys
I2C-USART×2 UART EXT
Interface
I2C-GPIO×8
RS485×2
CAN×1
PW Switch
POWER 5V
Rest
LCD
MYD-J335X-V2 Development Board Top-view
Medical Equipment Industrial Control Gaming Peripherals
Charging PileBilling
Control Unit
MYC-J3352-V2-256N256D-80-I
MYC-J3358-V2-256N256D-100-I
AM3352BZCZD80
AM3358BZCZA100
Cortex-A8@800MHz
Cortex-A8@1.0GHz
256MB DDR3 256MB Nand FLASH
Ethernet PHY
32Kbit EEPROM
MXM 200PIN -40℃~+85℃ 67mm x 45mm
MYD-J3352-V2-256N256D-80-I
MYD-J3358-V2-256N256D-100-I
Linux
31
33. MYC-C335X-GW
Up to 1GHz TI AM335x Cortex-A8 processors
DDR3, Nand Flash/eMMC, EEPROM, PMIC
6x UART, 2x USB2.0, 2x Gigabit Ethernet, 2x CAN
50mm x 40mm; B2B Package, 2x 80-pin; -40℃~+85℃ Industrial; Linux
MYD-C335X-GW Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
2×RGMII, 2×CAN, 2×USB2.0, 6×UART, 2×SPI, 3×I2C
RGB, 2×McASP
12bit 8ch ADC, JTAG
Communications
Multimedia
Others
Ethernet0
Ethernet1
USB Host
LED
ADC
Expand Port WIFI ANT 4G ANT
GPS ANT
JTAG
Ap6212
SIM Card slot
4G LTE MINI
PCI-E
SFP
Reset Key
LCD
RS485
RS232
Boot Mode
DC JACK
Micro SD
Debug UART
LVDS
DC Input
MYC-C3354-256N256D-80-I-GW
MYC-C3354-4E512D-80-I-GW
AM3354BZCZD80 Cortex-A8@800MHz
256MB DDR3L
512MB DDR3L
256MB Nand Flash
4GB eMMC
32Kbit EEPROM B2B 2×80PIN -40℃~+85℃ 50mm x 40mm
MYD-C3354-256N256D-80-I-GW
MYD-C3354-4E512D-80-I-GW
Linux
Industrial Gateway Medical Equipment Industrial Control
HMI
32
34. MYC-C437X-V2
Up to 1GHz TI AM437x Cortex-A9 Processor
DDR3, eMMC, EEPROM, Gigabit Ethernet PHY, PMIC
6x UART, 2x USB2.0, 2x Gigabit Ethernet, 2x CAN, 2x SPI, 3x I2C, 2x Parallel Camera Interfaces
45mm x 60mm; B2B Package, 200-pin; -40℃~+85℃ Industrial; Linux
MYD-C437X-V2 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
2×RGMII, 2×CAN, 2×USB2.0, 6×UART, 2×SPI, 3×I2C
RGB, 2×Parallel CSI, 2×McASP
2×12bit 8ch ADC, JTAG
Communications
Multimedia
Others
MYC-C4378-V2-4E512D-100-C
MYC-C4378-V2-4E512D-100-I
AM4378BZDND100 512MB DDR3 4GB eMMC
Ethernet PHY
256Kbit EEPROM
B2B 200PIN
-40℃~+85℃
0℃~+70℃
45mm x 60mm
MYD-C4378-V2-4E512D-100-C
MYD-C4378-V2-4E512D-100-I
Linux
Cortex-A9@1.0GHz
Medical Equipment Industrial Control
Industrial HMI Code Scanner
Power En
4GB eMMC
Switch
REST SD Card
Camera×2
TI AM437x
USB Host×4
User keys
Bettery Holder
EXT Interface
PMIC
HDMI
USB Device Audio out
JTAG
Audio In Debug
UART
UART3 Ethernet 0
101001000M
Ethernet 1
101001000M
Lcd-16Bit
Power Switch
DDR3
Rs485
CAN0
CAN1
5V DC In
Ethernet PHY
101001000M
Lcd-24Bit
ADC×8
I2C×2
UART×2
SPI×2
QSPI Flash(DNP)
33
35. SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
MYC-YG2UL
RENESAS RZ/G2UL Processor, 64-bit MPU, Cortex-A55@1.0GHz + Cortex-M33@200MHz
DDR3L, eMMC, EEPROM
Camera Interface, Display Interface, USB2.0, CAN-FD, Dual Gigabit Ethernet
37mm x 39mm; LCC + LGA Package, 190-pin; -40℃~+85℃ Industrial; Linux OS
MYD-YG2UL Development Board Top-view MYD-YG2UL Development Board Bottom-view
Motion Controller Engineering
Machinery
Part Selections (Other Configurations can be Customized for Mass Production)
Medical Device
Charging Pile
MYC-YG2UL-4E512D-100-I R9A07G043U11GBG
Cortex-A55@1.0GHz+
Cortex-M33@200MHz
512MB DDR3 4GB eMMC 32KBit EEPROM LCC+LGA 190PIN -40℃~+85℃ 37mm x 39mm MYD-YG2UL-4E512D-100-I
Linux
OpenWrt
Communications
Multimedia
Others
Key Applications
2×RGMII, 2×CAN FD, 2×USB2.0, 7×UART, 3×SPI, 4×I2C
RGB, MIPI CSI, 4×SSI
12-bit 2-ch ADC, JTAG
Peripherals/Interfaces
34
36. Part Selections (Other Configurations can be Customized for Mass Production)
MYD-YG2LX Development Board Top-view MYD-YG2LX Development Board Bottom-view
Industrial HMI Industrial Control
Industrial Gateway Energy & Power
4G ANT
MYC-YG2LX-V2
4G/5G Module
Interface
Giga Ethernet1
Giga Ethernet0 HDMI
WIFI
Module
USB2.0
Host x2
WIFI ANT
USB C
OTG
DC Jack
12V Input
Power Switch
BOOT Switch
Reset
UART2
JTAG
ADC
UART0 Debug
User
ON/OFF
Micro SD
Ext
GPIO/I2C/UART/SPI/CAN
Audio
LVDS
RGB
MIPI CSI
SIM1 Card SIM2 Card
MYC-YG2LX
RENESAS RZ/G2L Processor, 2x Cortex-A55@1.2GHz + Cortex-M33@200MHz
Integrated 3D Graphics engine and video CODEC engine (H.264)
Rich Multimedia Interfaces: MIPI-DSI / RGB / MIPI-CSI / Parallel CSI
43mm x 45mm; LCC + LGA Package, 222-pin; -40℃~+85℃ Industrial; Linux OS / Ubuntu
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
MYC-YG2L23-8E1D-120-I
MYC-YG2L23-8E2D-120-I
R9A07G044L23GBG
2×Cortex-A55@1.2GHz+
Cortex-M33@200MHz
2GB DDR4
1GB DDR4
8GB eMMC 256KBit EEPROM LCC+LGA 222PIN -40℃~+85℃ 43mm x 45mm
MYD-YG2L23-8E1D-120-I
MYD-YG2L23-8E2D-120-I
Linux
Ubuntu
Communications
Multimedia
Others
Key Applications
2×RGMII, 2×CAN FD, 2×USB2.0, 7×UART, 3×SPI, 4×I2C
RGB, MIPI DSI, Parallel CSI, MIPI CSI, SSI, SRC
12-bit 8-ch ADC, JTAG
Peripherals/Interfaces
35
37. MYC-C7Z010/20-V2
Xilinx XC7Z010/20 Processor, 2x Cortex-A9@667/766MHz+Artix 7 FPGA
DDR3, eMMC, QSPI Flash
On-board Gigabit Ethernet PHY
75mm x 55mm; B2B Package, 2x140-pin; -40℃~+85℃ Industrial; Linux OS
MYD-C7Z010/20-V2 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
Automotive Industrial Control Communication Systems
Medical Device
MYC-C7Z010-V2-4E1D-667-I
MYC-C7Z020-V2-4E1D-766-I
MYC-C7Z010-V2-4E1D-667-C
xc7z010-1clg400
xc7z020-2clg400
xc7z010-1clg400
2×Cortex-A9@667Hz
+Atrix 7 FPGA (28K)
2×Cortex-A9@766Hz
+Atrix 7 FPGA (85K)
2×Cortex-A9@667Hz
+Atrix 7 FPGA (28K)
2×Cortex-A9@766Hz
+Atrix 7 FPGA (85K)
1GB DDR3 4GB eMMC
32MB QSPI Flash
Ethernet PHY
USB PHY
B2B 2×140PIN
-40℃~+85℃
0℃~+70℃
75mm × 55mm
MYD-C7Z010-V2-4E1D-667-I
MYD-C7Z020-V2-4E1D-766-I
MYD-C7Z010-V2-4E1D-667-C
MYC-C7Z020-V2-4E1D-766-C xc7z020-2clg400 MYD-C7Z020-V2-4E1D-766-C
Linux
CAN XADC
POWER SWITCH
BOOT SELECT
RESET BUTTON
LPC FMC
FMC LED
Jumper For CAN
USER BUTTON
JTAG FUNCSELECT
FMC JTAG SELECT
PMODx3
(Only for Z-7020)
12V DC USB HOST×4
TF CARD
10/100/
1000 ETH0
RS232
DEBUG
RTC
BATTERY
RTC IC
MYC-C7Z010/20-V2
HDMI
JTAG
POWER LED
LCD
RGMII, USB2.0, CAN, 2×SPI, 2x I2C, XADC
141PIN (FPGA_XC7020) , 114PIN (FPGA_XC7010)
Communications
FPGA Expansion IO
36
38. MYC-Y7Z010/20-V2
Xilinx XC7Z010/20 Processor, 2x Cortex-A9@667/766MHz+Artix 7 FPGA
DDR3, eMMC, QSPI Flash
On-board Gigabit Ethernet PHY
75mm x 50mm; LCC Package, 180-pin; -40℃~+85℃ Industrial; Linux OS
MYD-Y7Z010/20-V2 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
Automotive Artificial Intelligence (AI)
Medical Device
RGMII, USB2.0, CAN, 2×SPI, 2× I2C, JTAG
Expandable 121PIN
Communications
FPGA Expansion IO
Reset Key
PL Ethernet
2.0 USB Host
Debug UART
Boot setting switech
16MB QSPI Flash
JTAG 512MB DDR3 Xilinx Zynq
XC7Z010/20
TF Card Gigabit Ethernet
RS232
RS485/CAN Power Connetor
eMMC
Combination LED
Ethernet PHY
GPIO Gonnetor
MYC-Y7Z010-V2-4E512D-667-I
MYC-Y7Z020-V2-4E512D-766-I
xc7z010-1clg400
xc7z020-2clg400
2*Cortex-A9@667Hz
+Atrix 7 FPGA (28K)
2*Cortex-A9@766Hz
+Atrix 7 FPGA (85K)
512MB DDR3 4GB eMMC
16MB QSPI Flash
Ethernet PHY
LCC 180PIN -40℃~+85℃ 75mm × 50mm
MYD-Y7Z010-V2-4E1D-667-I
MYD-Y7Z020-V2-4E1D-766-I
Linux
Industrial Control
37
39. MYC-C7Z015
Xilinx XC7Z015 Processor, 2x Cortex-A9@766MHz+Artix 7 FPGA
DDR3, eMMC, QSPI Flash
On-board Gigabit Ethernet PHY
75mm x 55mm; B2B Package, 2x140-pin; -40℃~+85℃ Industrial; Linux OS
MYD-C7Z015 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
Automotive Communication Systems
Medical Device
RGMII, USB2.0, CAN, 2×SPI, 2×I2C, 2×XADC, SFP, PCIE,
SATA
137PIN (FPGA_XC7015)
Communications
FPGA Expansion IO
Industrial Control
JTAG
POWER LED
CAN XADC PMODx3
12V DC USB HOST×4 TF CARD
10/100/
1000 ETH0
FMC JTAG
SELECT
RS232
DEBUG
IDE POWER
HDMI
LCD
RTC IC
RTC BATTERY
SFP
PCIE
SATA
POWER SWITCH
BOOT SELECT
RESET BUTTON
LPC FMC
FMC LED
Jumper For CAN
USER BUTTON
JTAG FUNCSELECT
MYC-C7Z015-4E1D-766-I xc7z015-2clg485
2×Cortex-A9@766Hz
+Atrix 7 FPGA (74K)
1GB DDR3 4GB eMMC
32MB QSPI Flash
Ethernet PHY
USB PHY
B2B 2×140PIN -40℃~+85℃ 75mm × 55mm MYD-C7Z015-4E1D-766-I
Linux
38
40. MYC-CZU3EG/4EV/5EV-V2
Zynq UltraScale+ ZU3EG /ZU4EV /ZU5EV MPSoC, 4x Cortex-A53@1.2GHz+2x Cortex-R5@600MHz
DDR4, eMMC, QSPI Flash
USB 3.0, Gigabit Ethernet, CAN, TF, DP, PCIe, SATA, HDMI, LCD
60mm x 52mm; B2B Package, 2x160-pin; 0℃~+70℃ Commercial; Linux OS
MYD-CZU3EG/4EV/5EV-V2 Development Board Top-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
Development Board
Part Number
Data Center Automotive
Medical Device
RGMII, CAN, USB3.0, USB_UART, 2×PMOD, PCIE2.0, DP,
SATA3.0, 4×SFP (Only for 4EV/5EV)
156PIN (FPGA)
Communications
FPGA Expansion IO
Industrial Control
LCD Connector PMOD
POWER
SWITCH 12V Connector1
12V
Connector2
SATA3.0 DP
JTAG Type-C
USB3.0
CAN PS_PROG_KEY
ARDUINO
FMC LPC
FAN_PWR
USER_KEY
DP-PWR-LED SYS_RST_KEY
Gigabit
Ethernet
SFP*4(only for
EV MPSoCs)
LCD Connector
SD Card
Boot Mode Switch
USB-UART
HDMI
SATA-PWR
PCIE
4GB DDR4 4GB eMMC
128MB QSPI Flash
Ethernet PHY
USB PHY
B2B
2×160PIN
60mm × 52mm
MYC-CZU3EG-V2-4E4D-1200-C XCZU3EG-1SFVC784 0℃~+70℃ MYD-CZU3EG-V2-4E4D-1200-C
ARM: 4×A53@1200MHz+2×R5@533MHz
+ UltraScale+ FPGA 154K
MYD-CZU4EV-V2-4E4D-1200-C
MYC-CZU4EV-V2-4E4D-1200-I-FAN XCZU4EV-2SFVC784
ARM: 4×A53@1200MHz+2×R5@533MHz
+ UltraScale+ FPGA 192K
MYD-CZU5EV-V2-4E4D-1200-C
MYC-CZU5EV-V2-4E4D-1200-I-FAN XCZU5EV-2SFVC784
ARM: 4×A53@1200MHz+2×R5@533MHz
+ UltraScale+ FPGA 256K
-40℃~+85℃
Linux
39
41. MYC-YT507H
Allwinner T507-H processor, 4x Cortex-A53@1.5GHz
LPDDR4, eMMC, EEPROM, PMIC
Supports 4K@60FPS H.265 video decoding and 4K@25FPS H.264 video encoding
Supports different display in dual screens, MIPI CSI and DVP camera inputs
43mm x 45mm; LCC + LGA Package, 164-pin + 58-pin; -40℃~+85℃ Industrial; Linux / Android / Ubuntu
MYD-YT507H Development Board Top-view MYD-YT507H Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
RGMII, 4×USB2.0, 6×UART, 2×SDIO, 2×SPI, 4×I2C, 6×PWM,
5×ADC
HDMI, 2×LVDS, RGB24, TV CVBS, Parallel CSI, MIPI
CSI, 3×I2S, SPDIF
Communications
Multimedia
MYC-YT507H-8E1D-150-I
4×Cortex-A53@1.5GHz LCC+LGA 222PIN -40℃~+85℃ 43mm x 45mm
MYD-YT507H-8E1D-150-I
MYC-YT507H-8E2D-150-I
T507H
1GB LPDDR4
2GB LPDDR4
8GB eMMC
MYD-YT507H-8E2D-150-I
Linux
Android
Ubuntu
32Kbit EEPROM
30PIN
DVP Interface
40 PIN LVDS0
40 PIN LVDS1
20 PIN MIPI CSI
MicroSD slot
SIM slot
HeadPhone
USB C
Debug
USB Type A
Host x2
SMA ANT
LVDS Power
Speaker
Reset Key
FEL Key
Power on/off Key
Switch
SPDIF audio
Interface
2X10PIN SDIOx1
UARTx1
2x10PIN DVP
camerax1
100MB Ethernet HDMI
USB C
Debug
DC Jack
Power input
TV OUT
2x25PIN RPI
Interface
HD-LVDS
Interface
ADC
4G module
interface
1000MB Ethernet
Medical Equipment Industrial Control
Commercial Display Intelligent Terminal
Development Board
Part Number
40
42. MYC-LT527
Allwinner T527 processor, 4x Cortex-A55@1.8GHz + 4x Cortex-A55@1.4GHz + RISC-V@200MHz
Up to 2 Tops NPU, LPDDR4, eMMC, EEPROM, PMIC
G57 GPU, 4K encoding/decoding VPU, HiFi4 DSP, 4 to 6 camera inputs
Multi video output interfaces: HDMI, DP, LVDS, MIPI-DSI, and RGB; Supports 4K+1080P dual-screen display
43mm x 45mm; LGA Package, 381-pin; -40℃~+85℃ Industrial; Linux / Android / Ubuntu
MYD-LT527 Development Board Top-view MYD-LT527 Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
RGMII, 4×USB2.0, 6×UART, 2×SDIO, 2×SPI, 4×I2C, 6×PWM,
5×ADC
HDMI, 2×LVDS, RGB24, TV CVBS, Parallel CSI, MIPI
CSI, 3×I2S, SPDIF
Communications
Multimedia
Medical Equipment Industrial Control
Commercial Display Intelligent Terminal
miniDP
HDMI Giga Eth0
FAN
Key LED
RTC Battery
WIFI+BT
Module
RPI connector
MYC-LT527
DC Jack
12V Input
MI Fans PI
connector
WIFI+BT ANT
USB0 ID SEL
Audio
Giga Eth1
USB3.0 HOST
USB2.0 OTG
MIPI-CSI2
MIPI-CSI1 MIPI-DSI
LVDS
McroSD
MYC- LT527MN-16E2D-180-I-G
MYC- LT527MN-32E4D-180-I-G
MYC- LT527M-16E2D-180-I-G
MYC- LT527M-16E2D-180-E
LT527MN
LT527M
4×Cortex-A55@1.8GHz
+4×Cortex-A55@1.4GHz,
RISC-V@200MHz,
HIF14 600MHz, 2Tops NPU
4×Cortex-A55@1.8GHz
+4×Cortex-A55@1.4GHz,
RISC-V@200MHz
2GB LPDDR4
2GB LPDDR4
16GB eMMC
4GB LPDDR4 32GB eMMC
16GB eMMC
32Kbit EEPROM LGA 381PIN
-40℃~+85℃
-20℃~+70℃
43mm x 45mm
MYD- LT527MN-16E2D-180-I
MYD- LT527MN-32E4D-180-I
MYD- LT527M-16E2D-180-I
MYD- LT527M-16E2D-180-E
Linux
Android
Ubuntu
Development Board
Part Number
41
43. MYC-YT113i
Allwinner T113-i Processor, 2x Cortex-A7@1.2GHz + RISC-V@800MHz
DDR3, eMMC, EEPROM
1x Gigabit Ethernet, 2x USB2.0, 6x UART, 2x CAN, 8x PWM, 1x GPADC, 4x TPADC
37mm x 39mm; LCC + LGA Package, 140-pin + 50-pin; -40℃~+85℃ Industrial; Linux
MYD-YT113i Development Board Top-view MYD-YT113i Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
RGMII, 2×USB2.0, 6×UART, 2×CAN, SDIO, SPI, 4×I2C, 8×PWM
MIPI DSI, RGB DSI, Dual link LVDS, CVBS OUT,
Parallel CSI, 2×I2S
Communications
Multimedia
Medical Equipment Industrial Control
Commercial Display Giga Ethernet USB C OTG
USB2.0
Host x2
USB C
Debug
SIM1 Card
User
DC Jack
12V Input
Power Switch
UART Debug
MYC-YT113i
WIFI Module
Audio
ADC Ext GPIO/I2C/UART/SPI/CAN
Reset
LVDS
LVDS
POWER
Micro SD
SIM2 Card
LVDS0
4G/5G Module
Interface
MYC-YT113i-4E256D-110-I
MYC-YT113i-4E512D-110-I
MYC-YT113i-8E512D-110-I
T113-i
2×Cortex-A7@1.2G
+RISC-V@800MHz
LCC+LGA 140+50PIN -40℃~+85℃ 37mm x 39mm
MYD-YT113i-4E256D-110-I
MYD-YT113i-4E512D-110-I
MYD-YT113i-8E512D-110-I
MYC-YT113i-8E1D-110-I
256MB DDR3
512MB DDR3
1GB DDR3
4GB eMMC
8GB eMMC
MYD-YT113i-8E1D-110-I
Linux
32Kbit EEPROM
Energy & Power
Development Board
Part Number
42
44. MYC-YT113X
Allwinner T113-S3 Processor, 2x Cortex-A7@1.2GHz, with built-in 128MB DDR3
Rich multimedia interfaces: MIPI-DSI / RGB / LVDS / Parallel CSI
6x UART, 2x USB2.0, 1x Gigabit Ethernet, 2x CAN
37mm x 39mm; LCC Package, 140-pin; -40℃~+85℃ Industrial; Linux
MYD-YT113X Development Board Top-view MYD-YT113X Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max)
RAM ROM Others Package Working Temp. Dimensions Software
Peripherals/Interfaces
RGMII, 2×USB2.0, 6×UART, 2×CAN, SDIO, 2×SPI,
4×I2C, 8×PWM
MIPI DSI, RGB DSI, 2×LVDS, Parallel CSI, 2×I2S
Communications
Multimedia
Giga Ethernet USB C OTG
USB2.0
Host x2
USB C
Debug
SIM1 Card
User
DC Jack
12V Input
Power Switch
UART Debug
MYC-YT113
WIFI Module
Audio
ADC Ext GPIO/I2C/UART/SPI/CAN
Reset
LVDS
LVDS
POWER
Micro SD
SIM2 Card
LVDS0
4G/5G Module
Interface
Medical Equipment Industrial Control
Commercial Display Energy & Power
MYC-YT113S3-256N128D-110-I
MYC-YT113S3-4E128D-110-I
T113-S3 2×Cortex-A7@1.2GHz 128MB DDR3
256MB Nand Flash
4GB eMMC
32Kbit EEPROM LCC 140PIN -40℃~+85℃ 37mm x 39mm
MYD-YT113S3-256N128D-110-I
MYD-YT113S3-4E128D-110-I
Linux
Development Board
Part Number
43
45. MYC-JD9360
SemiDrive D9-Pro processor, 6x Cortex-A55@1.6GHz + Cortex-R5@800MHz + 0.8 Tops NPU
Support dual display at 1080p resolution of different contents
Support the third HMI display through Cortex-R5 co-processor control
HD vision processing unit (VPU): H.264 encoding and decoding 4Kp30, H.265 decoding 4Kp30
82mm x 45mm; MXM Package, 314-pin; -40℃~+85℃ Industrial; Linux / Ubuntu
MYD-JD9360 Development Board Top-view MYD-JD9360 Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
Peripherals/Interfaces
2×RGMII, 2×USB3.0, 2×PCIe3.0, 16×UART, 4×CAN FD,
2×SDIO, 8×SPI, 12×I2C, 8×PWM, 4×ADC
MIPI DSI, LVDS, MIPI CSI, Parallel CSI
Communications
Multimedia
MYC-JD9360-16E2D-160-I D9-Pro
6×Cortex-A55@1.6GHz
+Cortex-R5@800MHz
+0.8Tops NPU
2GB LPDDR4 16GB eMMC EEPROM MXM 314PIN -40℃~+85℃ 82mm × 45mm MYD-JD9360-16E2D-160-I
Linux
Ubuntu
Micro SD
4G/5G Module
Interface
RTC
Safety_Debug
Secure_Debug
Usr_Debug
JTAG
Usr Key
Reset Key
MYC-JD9X
Dual_LVDS Power
Dual_LVDS
Wifi Antenna
Wifi Antenna
Run LED
Err LED
12V Power
RS232, RS485,
CAN, DI, DO
HDMI USB
USB Type C Audio Ethernet1
Ethernet0
4G/5G LED
Power LED
ADC
OSPI
SPI
Camera
Micro SIM
M2.PCIE
Single LVDS
Intelligent
Medical Equipment
Industrial Robot
Construction
Machinery T-BOX
Smart Cockpit
44
46. MYC-LR3568
Rockchip RK3568 processor, 4x Cortex-A55@1.6GHz + Cortex-R5@800MHz + 1 Tops NPU
DDR4, eMMC
Supports different display in three screens at 4K resolution
HDMI, 2x Gigabit Ethernet, PCIE, SATA, 10x UART, 2x CAN
43mm x 45mm; LGA Package, 381-pin; -40℃~+85℃ Industrial; Linux / Android /Debian
MYD-LR3568 Development Board Top-view MYD-LR3568 Development Board Bottom-view
Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
SOM Part Number CPU
CPU Cores and
Clock Speed (Max) RAM ROM Others Package Working Temp. Dimensions Software
Development Board
Part Number
Peripherals/Interfaces
2×RGMII, 2×USB2.0, 2×USB3.0, 2×PCIe3.0, PCIe2.1, SDIO
SATA3.0, 10×UART, 3×CAN, 4×SPI, 6×I2C, 16×PWM, 8×ADC
HDMI2.0a, eDP1.3, Dual MIPI-DSI_TX, Single LVDS, Parallel DSI
2×MIPI CSI, Parallel CSI, 4×I2S/TDM, 8×ADC
Communications
Multimedia
MYC-LR3568J-16E2D-180-I RK3568J 4×Cortex-A55@1.8GHz 2GB DDR4 16GB eMMC - LGA 381PIN -40℃~+85℃ 43mm × 45mm MYD-LR3568J-16E2D-180-I
Linux
Android
Debain
Charging Pile Industrial
Manufacturing
Industrial HMI Energy & Power miniDP
HDMI Giga Eth0
2*20pin2.54mm
RPI connector
2*20pin2.54mm
MI Fans PI connector
FAN
Key LED
RTC Battery
MYC-LR3568
WIFI+BT
Module
DC Jack
12V Input
WIFI+BT ANT PCIE3.0 USB Debug
USB0 ID SEL
speaker
Audio
Giga Eth1
USB3.0 HOST
M2.SSD
MIPI-CSI LVDS
MIPI-DSI
McroSD
45
47. Single Board Computers
Solutions and Applications
The embedded industrial single board computer is a complete computing system that integrates a processor, memory, storage, and various peripheral interfaces. It has
gone through rigorous design and testing, exhibiting high stability and reliability, and can operate stably for long periods in harsh industrial environments. Engineers and
developers can directly carry out application development and deployment on it, and it is widely used in fields such as industrial control, industrial automation, industrial
data collection, medical equipment, and more.
Single
Board
Computers
ARM Cores
CPU Vendor
Dual-core
A55
Remi Pi
Renesas RZ/G2L
2×A55@1.2GHz+M33@200MHz
P47
Single-Core
A7
MYS-6ULX
NXP i.MX6UL/i.MX6ULL
A7@528MHz
P48
Single or
Dual-core
A9
Z-turn Board V2
AMD-Xilinx XC7Z010/20
ARM: 2×A9@667MHz/766MHz,
FPGA: 28K/ 85K
P52 Rico Board
TI AM437X
A9@1.0GHz
P50
Quad-core
A53
MYS-8MMX-V2
NXP i.MX 8M Mini
4×A53@1.8GHz+M4@400MHz
P49 FZ3 Card
Xilinx XCZU3EG
ARM:4xA53@1200MHz+2xR5@600MHz
FPGA: 154K
P51
Z-turn Lite
AMD-Xilinx XC7Z010
ARM: 2×A9@667MHz,
FPGA: 28K
P53
FZ5 Card
Xilinx XCZU5EV
ARM:4xA53@1200MHz+2xR5@600MHz
FPGA: 256K
P54
46
48. Key Applications
Part Selections (Other Configurations can be Customized for Mass Production)
Commercial Display
Industrial Gateway Industrial Control
Industrial HMI
Part Number
MYD-YG2L23-8E1D-120-C-REMI
CPU
R9A07G044L23GBG
2×Cortex-A55@1.2GHz+
Cortex-M33@200MHz
1GB DDR4
CPU Cores and Clock Speed (Max) RAM
8GB eMMC
ROM Working Temp
0℃~+70℃
Dimensions
120mm x 70mm
Software
Linux
Ubuntu
Debian
Remi Pi
Remi Pi Top-view Remi Pi Bottom-view
RENESAS RZ/G2L Processor, 2x Cortex-A55@1.2GHz + Cortex-M33@200MHz
1GB DDR4, 8GB eMMC Flash, 32KB EEPROM
2x USB 2.0 HOST, 1x USB 2.0 OTG, 2x Gigabit Ethernet, WiFi/Bluetooth
Camera Interface (MIPI-CSI), LVDS, HDMI, Audio Input/Output
Optional 7-inch LCD Modules, Camera Module and RPI Module (RS232/RS485/CAN)
Linux OS (Yocto based with QT / Debian / Ubuntu)
CPU
RAM
ROM
Power Management
Power Supply
WiFi/Bluetooth
Ethernet
Debug
Buttons
Status LED
RPI Interface
RTC
RENESAS RZ/G2L Processor, 2x Cortex-A55@1.2GHz + Cortex-M33@200MHz
1GB DDR4
8GB eMMC
PMIC, RAA215300
USB Power Supply (Type-C)
2.4GHz/5GHz WIFI + BT4.2 Module
2x Gigabit Ethernet Interfaces
1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host (Type-A)
1x HDMI Display Interface
1x LVDS Display Interface
1x MIPI-CSI Camera Interface
1x Audio Input/Output Interface
2x Debug UART (Cortex-A55, Cortex-M33)
ON/OFF, RESET, USER
Power, System Status
1x 2.54mm 2x 20-pin male expansion header (GPIO/I2C/UART/SPI/CAN)
Used for timing when power off
Features Description
USB
Multimedia
47
49. Medical Device Industrial Control
Industrial HMI Energy & Power
Key Applications
Part Number
MYS-6ULX-IND
MYS-6ULX-IOT
CPU
MCIMX6G2CVM05AB
MCIMX6Y2CVM05AB
Cortex-A7@528MHz 256MB DDR3
CPU Cores and Clock Speed (Max) RAM
256MB Nand FLASH
ROM Working Temp
-40℃~+85℃
0℃~+70℃
Dimensions
70mm x 55mm Linux
Software
MYS-6ULX
Part Selections (Other Configurations can be Customized for Mass Production)
MYS-6ULX-IND MYS-6ULX-IOT
Industry 4.0
MCIMX6G2CVM05AA
256MB DDR3
256MB Nand Flash
1x USB 2.0 OTG, 1x USB 2.0 Host
1x 10/100M Ethernet Interface
1x Micro SD Card Slot
2x Keys
2x User LED
2x 2.0mm pitch 2x 20-pin Male Headers
(1 x Ethernet, 8 x UARTs, 4 x I2C, 2 x CAN, 4 x SPI, 8 x ADC, 4 x PWM, 2 x
I2S, 1 x 8-bit Camera, 1 x JTAG, up to 46 x GPIOs)
24-bit RGB LCD & Touch Screen (50-pin FPC connector)
-
-40℃~85℃
Linux (Yocto, Debian)
IoT Applications
MCIMX6Y2DVM05AA
1x 2.4GHz, IEEE 802.11b/g/n Standards
0℃~70℃
Linux (Yocto, Debian)
Features MYS-6ULX-IND MYS-6ULX-IOT
Target Applications
CPU
RAM
ROM
USB
Ethernet
TF Card
Key
Status LED
Expansion Header
LCD
WIFI
Working Temp.
OS
NXP i.MX 6UL/i.MX 6ULL Processor, Cortex-A7@528MHz
256MB DDR3, 256MB Nand Flash
1x USB 2.0 HOST, 1x USB 2.0 OTG, 1x 10/100Mbps Ethernet
Optional Expansion Board adds Ethernet, CAN, RS485, Audio, RTC and Camera
Optional 4.3 or 7 inch LCD Module, Camera and WiFi Modules
Linux OS (Yocto based with QT / Debian)
48
50. Medical Device Energy & Power Intelligent Fire Systems
Industrial Control
Key Applications
MYS-8MMX-V2
MYS-8MMX-V2 Box MYS-8MMX-V2 Top-view
Part Number
MYS-8MMQ6-V2-8E2D-180-C
MYS-8MMQ6-V2-8E2D-180-C-B
MYS-8MMQ6-V2-8E2D-160-I
MYS-8MMQ6-V2-8E2D-160-I-B
CPU
MIMX8MM6DVTLZAA
MIMX8MM6CVTKZAA
4×Cortex-A53@1.8GHz+
Cortex-M4@400MHz
4×Cortex-A53@1.6GHz+
Cortex-M4@400MHz
CPU Cores and Clock Speed (Max)
2GB DDR4
RAM
8GB eMMC
ROM Working Temp
-40℃~+85℃
0℃~+70℃
Dimensions
95mm x 69mm Without
With
Without
With
135mm x 74.5mm x 35.8mm
135mm x 74.5mm x 35.8mm
95mm x 69mm
Linux
Ubuntu
Software Enclosure
Part Selections (Other Configurations can be Customized for Mass Production)
NXP i.MX 8M Mini, 4x Cortex-A53@1.8GHz + Cortex-M4@400MHz
2GB DDR4
8GB eMMC
2 PIN Phoenix Connector
1x USB 2.0 OTG (Type-C)
2x USB 2.0 Host (Type-A)
1x HDMI Display Interface
1x LVDS Display Interface
1x MIPI-CSI Camera Interface
1x Gigabit Ethernet Interface
1x WIFI/BT Antenna SMA
1x 2PIN 1.25mm Pitch Connector
1x NVMe PCIe M.2 2242 SSD Slot
1x 2x25PIN 2.0mm Pitch Expansion Interface
1x Micro SD Card Slot
1x Debug UART, 3PIN 2.54mm Pitch
ON/OFF, RESET, USER
User, System Status
Features Description
CPU
RAM
ROM
Power Input
USB
Multimedia
Ethernet
WiFi/Bluetooth
RTC
M.2
Expansion Interface
Micro SD
Debug
Buttons
Status LED
NXP i.MX 8M Mini Processor, 4x Cortex-A53@1.8GHz + Cortex-M4@400MHz
2GB DDR4, 8GB eMMC Flash, 32MB QSPI FLASH
2x USB2.0 HOST, 1x USB2.0 OTG, Gigabit Ethernet, WiFi/Bluetooth, M.2 PCIe Interface
Camera Interface (MIPI-CSI), LVDS, HDMI
Supports for Yocto Linux and Ubuntu Linux OS
49
51. Key Applications
Scanner
Medical Device Industrial Control
Industrial HMI
Rico Board
Rico Board Top-view Rico Board Bottom-view
Up to 1GHz TI AM437x Sitara ARM Cortex-A9 Processor
512MB DDR3 SDRAM, 4GB eMMC Flash, 16MB QSPI Flash, 32KB EEPROM
UARTs, USB Host/Device, Gigabit Ethernet, Dual-Camera, TF, …
Supports HDMI and LCD Display
Supports for Linux OS
CPU
RAM
ROM
Display
USB
HDMI
TF Card
Camera
Ethernet
UART
JTAG
Expansion Interface
PCB
Dimensions
OS Support
Up to 1GHz TI AM437x Sitara ARM Cortex-A9 Processor
512MB DDR3
4GB eMMC, 16MB QSPI Flash, 32KB EEPROM
24-bit true color display interface
1x USB 2.0 Host port, 1x Mini USB 2.0 Device port
1x HDMI Display interface
1x TF card interface
2x Camera interfaces
1x Gigabit Ethernet Interface
1x Debug UART
1x 20-pin JTAG interface
2x SPI, 2x I2C, 2x CAN, 4x UARTs, 1x MMC, 8x ADC
8-layer design
65mm x 100mm
Linux
Features Description
Part Selections (Other Configurations can be Customized for Mass Production)
Part Number CPU CPU Cores and Clock Speed (Max) RAM ROM Working Temp Dimensions Accessories
Software
MYS-4378-100-C
MYS-4378-100-C-S
AM4378BZDN100 Cortex-A9@1.0GHz 512MB DDR3 4GB eMMC 0℃~+70℃ 100mm x 65mm Linux
Without
With
50
52. Medical Device
Industrial Quality Assurance
Security Monitoring Artificial Intelligence (AI)
Key Applications
FZ3 Card Top-view FZ3 Card Bottom-view
Xilinx Zynq UltraScale+ ZU3EG MPSoC Processor, 4*Cortex-A53@1.2GHz+2*Cortex-R5@600MHz
DDR4, eMMC, QSPI Flash, EEPROM
USB2.0, USB3.0, Gigabit Ethernet, TF, DP, PCIe, MIPI-CSI, BT1120, USB-UART, JTAG…
Computing Power up to 1.2TOPS, MobileNet up to 100FPS
Ready-to-Run PetaLinux 2020.1
Supports Xilinx Vitis Software Development Platform
XCZU3EG
4GB DDR4 (64-bit)
8GB eMMC
32MB QSPI
32KB I2C EEPROM
1x Gigabit PHY
2x USB 2.0 PHY
4K/30fps (2lane)
1x Gigabit Ethernet Interface
1x USB 2.0 Host, 1x USB 3.0 Host
PCIe 2.1 x 1 lane
FPC_25PIN 4lane
FPC_32PIN 16bit
1x Mini USB-to-UART Port
2x 2.54mm pitch 2 x 20-pin IO Expansion Interfaces
12-layer Design
100mm x 70mm
Features Description
CPU
RAM
ROM
QSPI FLASH
EEPROM
PHY
Mini DP
Ethernet
USB
PCIe
MIPI
BT1120
Debug
Expansion IOs
PCB
Dimensions
FZ3 Card
Part Number CPU RAM ROM Working Temp Other Storage Software Accessories
Part Selections (Other Configurations can be Customized for Mass Production)
MYS-ZU3EG-8E4D-EDGE-K2
MYS-ZU3EG-8E4D-EDGE
Without
With
XCZU3EG-1SFVC784I
ARM: 4×A53@1200MHz+
2×R5@533MHz+
UltraScale+ FPGA 154K
4GB DDR4 8GB eMMC -40℃~+85℃
32MB QSPI FLASH
32Kbit EEPROM
Linux
CPU Cores and Clock Speed (Max)
51
53. Medical Device Industrial
Automotive Visual Monitoring
Key Applications
Z-turn Board V2 Top-view Z-turn Board V2 Bottom-view
Xilinx XC7Z010/20 Processor, 2*Cortex-A9@667MHz+Artix 7 FPGA
1GB DDR3, 16MB QSPI Flash, 64Kbit EEPROM
USB_UART, USB2.0 OTG, 1 x 10/100/1000Mbps Ethernet, CAN, HDMI, TF, …
Onboard Three-axis Acceleration Sensor and Temperature Sensor
Supports Optional Camera Module and Z-turn IO Cape
Ready-to-Run Linux Single Board Computer
Supports Python Development
Part Number CPU CPU Cores and Clock Speed (Max) RAM ROM Working Temp Dimensions Software
Part Selections (Other Configurations can be Customized for Mass Production)
Xilinx XC7Z010/XCZ7020
1GB DDR3 SDRAM
16MB QSPI Flash
Onboard Three-axis Acceleration Sensor, Temperature Sensor
1 x Mini USB2.0 OTG, 1 x USB-UART debug interface
1 x HDMI (supports 1080p resolution)
1 x TF card interface
1 x CAN
1x 10/100/1000Mbps Ethernet Interface
2x 1.27mm pitch 80-pin SMT female connectors
PLIO: 90/106 (XC7Z010/XC7Z020)
63mm x 102mm x 1.6mm (8-layer PCB design)
Linux
Features Description
CPU
RAM
ROM
Sensor
USB
HDMI
TF
CAN
Ethernet
User I/O
Dimensions
OS support
Z-turn Board V2
MYS-7Z010-V2-0E1D-667-C
MYS-7Z010-V2-0E1D-667-C-S
MYS-7Z020-V2-0E1D-766-C
MYS-7Z020-V2-0E1D-766-C-S
XC7Z010-1CLG400
XC7Z020-2CLG400
2×Cortex-A9@667Hz
+Atrix 7 FPGA (28K)
2×Cortex-A9@766Hz
+Atrix 7 FPGA (85K)
1GB DDR3 16MB QSPI Flash 0℃~+70℃ 63mm × 102mm Linux
Accessories
With
Without
With
Without
52
54. Medical Device Industrial
Automotive Visual Monitoring
Key Applications
Z-turn Lite Top-view Z-turn Lite Bottom-view
Part Number CPU CPU Cores and Clock Speed (Max) RAM ROM Other Storage Working Temp Dimensions Software
Part Selections (Other Configurations can be Customized for Mass Production)
Xilinx XC7Z010
512MB DDR3 SDRAM
4GB eMMC Flash, 16MB QSPI Flash
1x 10/100/1000Mbps Ethernet Interface
1 x Mini USB2.0 OTG
1 x 2.54mm pitch 14-pin JTAG Interface
1 x 0.5mm pitch 120 Position Connector Socket for Expansion Interface
1 x 2.54mm pitch 4-pin Debug UART Interface
1 x TF card interface
1x Reset, 1 x User
91mm x 63mm (10-layer PCB design )
Linux
Features Description
CPU
RAM
ROM
Ethernet
USB
Input and Output
TF
Buttons
Dimensions
OS support
Z-turn Lite
MYS-7Z010-L-C
MYS-7Z010-L-C-S
XC7Z010-1CLG400
Accessories
With
Without
2×Cortex-A9@667Hz
+Atrix 7 FPGA (28K)
512MB DDR3 4GB eMMC 0℃~+70℃
16MB QSPI Flash 91mm x 63mm Linux
Xilinx XC7Z010 Processor, 2*Cortex-A9@667MHz+Artix 7 FPGA
512MB DDR3, 4GB eMMC, 16MB QSPI Flash
USB2.0 OTG, 10/100/1000M Ethernet, TF, Debug UART, JTAG…
One 120 Position Connector Socket for Expansion interface
Ready-to-Run Linux Single Board Computer
Optional Camera and LCD Modules, IO Extension Cape
53
55. Key Applications
Consumer Electronics
Medical Diagnosis Artificial Intelligence (AI)
Intelligent Security
FZ5 Card
FZ5 Card Top-view FZ5 Card Bottom-view
FZ5 EdgeBoard AI Box Front-view FZ5 EdgeBoard AI Box Back-view
Zynq UltraScale+ XCZU5EV MPSoC, 4*Cortex-A53@1.2GHz+2*Cortex-R5@600MHz+FPGA
Computing Power up to 2.4TOPS, Runs at 55 FPS for ResNet-50
8GB DDR4, 32GB eMMC, 64MB QSPI Flash, 32KB EEPROM
RS232, RS485, 4 x USB 3.0, Gigabit Ethernet, CAN, TF, DP, HDMI-IN, JTAG…
Supports 8- to 16-channel Video Decoding and 4- to 8-channel Intelligent Analysis
Ready-to-Run PetaLinux 2020.1
CPU
RAM
ROM
QSPI FLASH
EEPROM
Serial Ports
Ethernet
USB3.0
CAN
HDMI
MIPI DP
User I/O
XCZU5EV
8GB DDR4 (64bit, 2400MHz)
32GB eMMC
64MB QSPI
32KB EEPROM
1x RS232, 1x RS485, 1 x USB-UART Debug
1x Gigabit Ethernet
4x USB3.0 Host
1x CAN
1x HDMI In
1x Mini DisplayPort (DP), 4K/30fps
1 x FPC_40PIN (Reserved for MIPI-CSI)
1 x 1.27mm pitch 2 x 50-pin IO Expansion Interface
(5 x PS_MIO, 69 x PL_IO)
Features Description
Part Selections (Other Configurations can be Customized for Mass Production)
Part Number CPU CPU Cores and Clock Speed (Max) RAM ROM Working Temp Other Storage Software
MYS-ZU5EV-32E8D-EDGE-K1
MYS-ZU5EV-32E8D-EDGE-BOX
XCZU5EV-2SFVC784I ARM: 4×A53@1200MHz+2×R5@600MHz
FPGA: 256K
8GB DDR4 32GB eMMC -40℃~+85℃
64MB QSPI Flash
32KB EEPROM
Linux
54
56. ODM Services
Based on years of experience in the embedded industry, MYIR has amassed extensive product technology and project development expertise in embedded software and hardware
development utilizing ARM/FPGA core processors. MYIR also offers professional and efficient customized services tailored to the specific requirements of customers.
Base Board Customization
Whole Board Customization
SoM Customization
Customized Service Process
Submit Requirements
Sign Contract
Testing and Certification
Customized Solutions
Technical Evaluation
Project Development
Customer Acceptance
Business Communication
Prototype Delivery
Mass Delivery
55
57. OEM Services
MYIR's Smart SMT factory is committed to providing customers with one-stop PCBA manufacturing services, encompassing PCB manufacturing, component procurement, SMT
processing, assembly, and testing. Located in Longhua District, Shenzhen, the factory utilizes its advanced production equipment and management system, rigorous quality
control procedures, comprehensive supply chain system, and robust engineering support to assist customers in enhancing production efficiency, reducing product delivery time,
and ensuring production quality. It caters to a diverse range of customers across various industries, including industrial control, power communication, new energy, automotive
electronics, medical electronics, smart home, security, and numerous other sectors globally.
OEM Services Cover Many Industries
One-stop PCBA Manufacturing Service
DFM (Design for Manufacturing) PCB Fabrication Parts Sourcing PCBA Processing
Program Burning and Testing High Temperature Aging Test Conformal Coating Finished Product Assembly
Industrial Control Intelligent Security
Medical Instruments
Automotive Electronics
New Energy
Power Communication Rail Transit Industrial Gateway
Engineering Machinery
56