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33 votes
2 answers
3k views

How is wafer dicing economical (for small ICs)?

Is my understanding that, for a given technology, the cost of making a silicon wafer is pretty much fixed, in the sense that it will not change no matter how much you fill the space (how many ICs you ...
valerio_new's user avatar
  • 1,642
3 votes
1 answer
7k views

Difference between the words 'die' and 'chip' [closed]

In some articles speaking about the IGBT power modules, we can see that the word 'die' has been used for calling the semiconductor component of IGBT device. However, other articles calls it 'chip'. ...
Albert's user avatar
  • 151
2 votes
1 answer
263 views

Problems with doping semiconductor materials in 7nm technology

As you know, semiconductor technology is going to reach 7nm lithographic precision soon. Which means that the smallest segment length on a semiconductor die can be as short as 7nm. After making some ...
hkBattousai's user avatar
  • 14.2k
11 votes
2 answers
2k views

Are some CPUs implemented in standard cells and are others customized?

Explaining the question more, I see some die pictures which are implementing a Cortex-M0, with Bluetooth LE and so on, depending on the chip functionality, and are appearing like this (nRF51822): ...
thexeno's user avatar
  • 1,305