Advanced Routable QFN
Enabling single-layer routable and highly customizable I/O footprint are the unique characteristics of the Advanced Routable-QFN lead frame. This new flexibility makes it ideal for small System in Package (SiP) applications, including semiconductors that require the integration of multiple dies and passive components within a single package. Unlike BGA substrates with multiple layers, the Advanced Routable-QFN lead frame offers better heat dissipation efficiency and lower signal loss thanks to its single-layer structure. Therefore, it is suitable for devices that require high signal integrity and reliability, such as the latest Wi-Fi 7 routers and sensors.
Different from typical semiconductor assembly process, the Advanced-Routable QFN lead frame is firstly produced via photomask plating and etching. After that, customer (assembly house) requires to conduct lead frame backside half-etching after EMC encapsulation process to form SMT terminals for mounting onto PCB.
Wettable-Flank QFN
QFN is a lead-less pkg. After mounted onto PCB, it is very difficult to do solder wetting quality inspection, because the solder joint will be covered up by QFN molded body. X-ray inspection is an existing inspection method used in the field, but it is costly and human dependent. For automatic visual inspection (AVI), it requires existence of “solder tail” extended beyond the package edge.
QFN with wettable-flank feature is a solution. In a more specific description, the wettable-flank feature is that there is a solderable step-cut on QFN I/Os with certain height such that it forms a solder fillet during SMT, and its tail with sufficient size can be identified by AVI.
There are different methods to make the wettable-flank or step-cut feature on QFN, either by lead frame maker or assembly house. However, the most economical method is still produced by our deep-groove etching technology.
Product & Services
because we know assembly process well.
![]() MSL Solutions
|
![]() Surface Finishing
|
||
![]() QFN solutions
|
![]() Power Device solutions
|
![]() Cost Effective HD LF
|
![]() Value Added Services
|