Rough Copper Technology
Many people simply think that making lead frame surface very rough to be panacea for improving semiconductor package reliability, achieving MSL1 standard. To some extent, it is possibly true; but in most cases, too rough the lead frame surface may cause other assembly process problems. For example, the Flip-Chip package may experience solder voids or solder bump cracking due to possible air bubble entrapment in the reflow process. This issue is particularly prevalent to small solder dot bumping onto very rough lead frame bonding pad. To address this problem, a new rough copper electrodeposition process has been developed, which creates a unique surface morphology that not only reduces the risk of air bubble trapping but also enhances the Moisture Sensitivity Level (MSL) performance of the package.
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because we know assembly process well.