Introduction to thin film growth and molecular beam epitaxy
This document provides an introduction to thin film growth techniques focusing on molecular beam epitaxy (MBE). It describes various physical vapor deposition and chemical vapor deposition methods. MBE is explained in detail, including the advantages of growth in an ultra-high vacuum environment with independent material sources and in-situ monitoring via RHEED. Different growth modes such as Frank-van der Merwe, Volmer-Weber, and Stranski-Krastanov are also summarized.
Complete Coverage on High velocity forming methods also known as high energy rate forming processes HVF and HERF. Very useful for mechanical engineering students and teachers.. Explosive forming, magnetic pulse forming, hydro forming, electro hydro forming discussed.
This document describes an investigation of the LaAlO3-SrTiO3 (LAO-STO) heterointerface using transmission electron microscopy (TEM). The sample was prepared using pulsed laser deposition to grow a thin film of LAO on a STO substrate, followed by ion slicing to produce a wedge-shaped cross-section for TEM analysis. The TEM results revealed a high-density two-dimensional electron gas formed at the LAO-STO interface, which has potential applications in next-generation electronic devices and holds promise for novel electronic properties.
Pulsed laser deposition (PLD) involves using laser pulses to ablate material from a target that is deposited as a thin film on a substrate. PLD offers advantages like the ability to deposit complex oxide materials with precise stoichiometry. The first PLD system successfully deposited a high-temperature superconducting YBa2Cu3O7 thin film. PLD works by ablating material from a target using high-energy laser pulses to create a plasma plume that deposits on the substrate surface. Factors like laser wavelength and background gas are known to affect the film growth process in PLD. While PLD provides good control over film composition and properties, scaling it for large area deposition remains a challenge due to
- Epitaxy involves the deposition and growth of crystalline layers on a substrate in a way that matches the substrate's crystalline structure. This results in single-crystal layers.
- Common epitaxy techniques discussed are vapor-phase epitaxy (VPE), liquid-phase epitaxy (LPE), and molecular beam epitaxy (MBE).
- MBE involves evaporating source materials in an ultra-high vacuum and allowing them to condense on a heated substrate. It allows precise control over composition and doping at the monolayer level.
The document discusses various thin film deposition techniques including physical vapor deposition (PVD) and chemical vapor deposition (CVD). Under PVD, it describes thermal evaporation and sputtering in detail. Thermal evaporation involves heating a source material until its atoms evaporate and deposit on a substrate. Sputtering uses plasma to bombard a target material, ejecting atoms that deposit on the substrate. Molecular beam epitaxy is also covered, using slow deposition of atoms from effusion cells in ultra-high vacuum to grow epitaxial thin films.
Optical fiber lasers operate based on stimulated emission of photons from excited atoms or molecules within an active medium, such as rare earth doped silica fibers. They were first developed in the 1960s and have several advantages over solid-state lasers including high beam quality, efficiency, and thermal management. Fiber lasers are fabricated by first making a preform via modified chemical vapor deposition to dope the silica with rare earth ions. The preform is then drawn into an optical fiber, which can be structured using fiber Bragg gratings to form the laser cavity. Applications include materials processing, telecommunications, medicine, and directed energy weapons.
This document discusses various applications of electroceramics and magnetic materials. It describes how multilayer ceramic capacitors use thin dielectric layers to achieve high capacitance density. Ferroelectric thin films have applications in nonvolatile memories, capacitors, sensors, and optical devices due to their dielectric, piezoelectric and electro-optic properties. Ferromagnetic materials find use in transformers, electromagnets, recording media, and sensors. The document outlines the operating principles and advantages of these various electroceramic and magnetic applications.
Principle, interaction of X-Ray with matter, imaging, film and film less techniques, types and use of filters and screens, geometric factors, Inverse square law, characteristics of films - graininess, density, speed, contrast, characteristic curves, Penetrameters, Exposure charts, Radiographic equivalence. Fluoroscopy- xero-Radiography, Computed Radiography, Computed Tomography
This document provides an overview of microfabrication and nanofabrication techniques. It discusses both top-down approaches like photolithography, nanoimprint lithography, and nanosphere lithography as well as bottom-up techniques such as carbon nanotube synthesis and molecular self-assembly. The document also covers common microfabrication processes like thin film deposition, doping, oxidation, etching, and lithography. It provides details on lithography methods, thin film deposition techniques like CVD and PVD, and etching approaches including wet and dry etching.
This document provides an overview of microfabrication and nanofabrication techniques. It discusses both top-down approaches like photolithography, nanoimprint lithography, and nanosphere lithography as well as bottom-up techniques such as carbon nanotube synthesis and molecular self-assembly. The document also covers common microfabrication processes like thin film deposition, doping, oxidation, etching, and lithography. It provides details on lithography techniques, thin film deposition methods like CVD and PVD, and etching approaches including wet and dry etching.
This document discusses nanoscience and nanotechnology. It begins by defining nanoscience as the study of structures between 1-100nm, where properties change significantly from their bulk counterparts due to high surface area to volume ratios and quantum effects. It then provides examples of how these factors enhance mechanical, electrical, optical and other properties. Applications discussed include microelectronics, energy efficiency, medicine, and textiles. In the concluding questions, it asks about the significance of nanoscale, medical applications of nanomaterials, classifications of nanomaterials, and properties such as mechanical, electrical and optical.
Recent advances in superhard nanocomposite coatings were presented. Nanocomposite coatings can be designed using various methods like combining two nanocrystalline phases or embedding nanocrystalline phases in an amorphous matrix to improve hardness and toughness. Coatings are synthesized using methods like chemical vapor deposition or magnetron sputtering. Properties are evaluated through nanoindentation, scratch adhesion testing, and measuring fracture toughness. Designing coatings with optimal parameters can yield both high hardness and toughness for industrial applications.
Recent advances in superhard nanocomposite coatings were presented. Nanocomposite coatings can be designed using various methods like combining two nanocrystalline phases or embedding nanocrystalline phases in an amorphous matrix to improve hardness and toughness. Coatings are synthesized using methods like chemical vapor deposition or magnetron sputtering. Properties are evaluated through nanoindentation, scratch adhesion testing, and measuring fracture toughness. Designing coatings with optimized parameters can provide both high hardness and toughness making nanocomposite coatings suitable for industrial applications.
The document discusses various applications of electroceramics and ferroelectric thin films. It describes multilayer ceramic capacitors which use alternate dielectric and electrode layers. Ferroelectric thin films can be used in non-volatile memories, capacitors, sensors, and acoustic wave substrates. It also discusses ferroelectric RAM and the advantages it provides over other memory types. Other applications mentioned include actuators, capacitors, pyroelectric detectors, and substrates for surface acoustic waves.
Radiographic testing uses x-rays or gamma rays to detect defects in welds. X-rays are produced when electrons collide with heavy metal targets, while gamma rays come from radioactive sources. The material is exposed to radiation, and defects appear as variations in density on the processed film. Trained inspectors can interpret the film to locate cracks, pores, inclusions and other issues. While gamma rays have advantages like portability, x-rays generally provide higher quality images for precise defect analysis of welds. Both techniques provide a permanent radiographic record but require safety precautions due to invisible radiation.
20CDE09- INFORMATION DESIGN
UNIT I INCEPTION OF INFORMATION DESIGN
Introduction and Definition
History of Information Design
Need of Information Design
Types of Information Design
Identifying audience
Defining the audience and their needs
Inclusivity and Visual impairment
Case study.
Conservation of Taksar through Economic Regeneration
This was our 9th Sem Design Studio Project, introduced as Conservation of Taksar Bazar, Bhojpur, an ancient city famous for Taksar- Making Coins. Taksar Bazaar has a civilization of Newars shifted from Patan, with huge socio-economic and cultural significance having a settlement of about 300 years. But in the present scenario, Taksar Bazar has lost its charm and importance, due to various reasons like, migration, unemployment, shift of economic activities to Bhojpur and many more. The scenario was so pityful that when we went to make inventories, take survey and study the site, the people and the context, we barely found any youth of our age! Many houses were vacant, the earthquake devasted and ruined heritages.
Conservation of those heritages, ancient marvels,a nd history was in dire need, so we proposed the Conservation of Taksar through economic regeneration because the lack of economy was the main reason for the people to leave the settlement and the reason for the overall declination.
Introduction to IP address concept - Computer Networking
An Internet Protocol address (IP address) is a logical numeric address that is assigned to every single computer, printer, switch, router, tablets, smartphones or any other device that is part of a TCP/IP-based network.
Types of IP address-
Dynamic means "constantly changing “ .dynamic IP addresses aren't more powerful, but they can change.
Static means staying the same. Static. Stand. Stable. Yes, static IP addresses don't change.
Most IP addresses assigned today by Internet Service Providers are dynamic IP addresses. It's more cost effective for the ISP and you.
In May 2024, globally renowned natural diamond crafting company Shree Ramkrishna Exports Pvt. Ltd. (SRK) became the first company in the world to achieve GNFZ’s final net zero certification for existing buildings, for its two two flagship crafting facilities SRK House and SRK Empire. Initially targeting 2030 to reach net zero, SRK joined forces with the Global Network for Zero (GNFZ) to accelerate its target to 2024 — a trailblazing achievement toward emissions elimination.
Response & Safe AI at Summer School of AI at IIITH
Talk covering Guardrails , Jailbreak, What is an alignment problem? RLHF, EU AI Act, Machine & Graph unlearning, Bias, Inconsistency, Probing, Interpretability, Bias
OCS Training - Rig Equipment Inspection - Advanced 5 Days_IADC.pdf
OCS Training Institute is pleased to co-operate with
a Global provider of Rig Inspection/Audits,
Commission-ing, Compliance & Acceptance as well as
& Engineering for Offshore Drilling Rigs, to deliver
Drilling Rig Inspec-tion Workshops (RIW) which
teaches the inspection & maintenance procedures
required to ensure equipment integrity. Candidates
learn to implement the relevant standards &
understand industry requirements so that they can
verify the condition of a rig’s equipment & improve
safety, thus reducing the number of accidents and
protecting the asset.
Thin films are layers of material ranging from 10-500 nanometers thick. Thin film technology is used in many applications like microelectronics, optics, and magnetic coatings. There are various deposition techniques used to fabricate thin films, including physical vapor deposition methods like sputtering and evaporation, and chemical vapor deposition methods like plasma-enhanced CVD and low-pressure CVD. Each deposition technique has advantages and disadvantages depending on the substrate and material properties. Thin films are used to produce microelectronics, sensors, tailored materials, optical coatings, and corrosion/wear resistant coatings.
This paper analyzes the reliability of MOSFETs that use indium-tin oxide as the gate oxide instead of silicon dioxide. Interface trap charges at the oxide-silicon interface can degrade MOSFET performance by changing the threshold voltage over time. The paper finds that MOSFETs using indium-tin oxide exhibit improved immunity to the effects of interface trap charges compared to those using silicon dioxide. Specifically, indium-tin oxide MOSFETs show enhanced static, linearity, and intermodulation performance metrics when subjected to both positive and negative interface trap charges. Thus, indium-tin oxide has potential to improve MOSFET reliability by reducing sensitivity to interface trap charge effects.
This document discusses advanced coating techniques. It begins with an introduction to coatings, their purposes and types. It then discusses desired coating properties and classifications of coating processes, including traditional and more advanced techniques like physical vapor deposition (PVD). The document focuses on PVD methods like evaporation, sputtering and ion plating in detail. It explains the basic processes, advantages, disadvantages and applications of each technique. Other coating methods like thermal spraying are also briefly introduced. Overall, the document provides a comprehensive overview of coating technologies with a focus on PVD processes.
Introduction to thin film growth and molecular beam epitaxyOleg Maksimov
This document provides an introduction to thin film growth techniques focusing on molecular beam epitaxy (MBE). It describes various physical vapor deposition and chemical vapor deposition methods. MBE is explained in detail, including the advantages of growth in an ultra-high vacuum environment with independent material sources and in-situ monitoring via RHEED. Different growth modes such as Frank-van der Merwe, Volmer-Weber, and Stranski-Krastanov are also summarized.
Complete Coverage on High velocity forming methods also known as high energy rate forming processes HVF and HERF. Very useful for mechanical engineering students and teachers.. Explosive forming, magnetic pulse forming, hydro forming, electro hydro forming discussed.
This document describes an investigation of the LaAlO3-SrTiO3 (LAO-STO) heterointerface using transmission electron microscopy (TEM). The sample was prepared using pulsed laser deposition to grow a thin film of LAO on a STO substrate, followed by ion slicing to produce a wedge-shaped cross-section for TEM analysis. The TEM results revealed a high-density two-dimensional electron gas formed at the LAO-STO interface, which has potential applications in next-generation electronic devices and holds promise for novel electronic properties.
Pulsed laser deposition (PLD) involves using laser pulses to ablate material from a target that is deposited as a thin film on a substrate. PLD offers advantages like the ability to deposit complex oxide materials with precise stoichiometry. The first PLD system successfully deposited a high-temperature superconducting YBa2Cu3O7 thin film. PLD works by ablating material from a target using high-energy laser pulses to create a plasma plume that deposits on the substrate surface. Factors like laser wavelength and background gas are known to affect the film growth process in PLD. While PLD provides good control over film composition and properties, scaling it for large area deposition remains a challenge due to
- Epitaxy involves the deposition and growth of crystalline layers on a substrate in a way that matches the substrate's crystalline structure. This results in single-crystal layers.
- Common epitaxy techniques discussed are vapor-phase epitaxy (VPE), liquid-phase epitaxy (LPE), and molecular beam epitaxy (MBE).
- MBE involves evaporating source materials in an ultra-high vacuum and allowing them to condense on a heated substrate. It allows precise control over composition and doping at the monolayer level.
The document discusses various thin film deposition techniques including physical vapor deposition (PVD) and chemical vapor deposition (CVD). Under PVD, it describes thermal evaporation and sputtering in detail. Thermal evaporation involves heating a source material until its atoms evaporate and deposit on a substrate. Sputtering uses plasma to bombard a target material, ejecting atoms that deposit on the substrate. Molecular beam epitaxy is also covered, using slow deposition of atoms from effusion cells in ultra-high vacuum to grow epitaxial thin films.
Optical fiber lasers operate based on stimulated emission of photons from excited atoms or molecules within an active medium, such as rare earth doped silica fibers. They were first developed in the 1960s and have several advantages over solid-state lasers including high beam quality, efficiency, and thermal management. Fiber lasers are fabricated by first making a preform via modified chemical vapor deposition to dope the silica with rare earth ions. The preform is then drawn into an optical fiber, which can be structured using fiber Bragg gratings to form the laser cavity. Applications include materials processing, telecommunications, medicine, and directed energy weapons.
This document discusses various applications of electroceramics and magnetic materials. It describes how multilayer ceramic capacitors use thin dielectric layers to achieve high capacitance density. Ferroelectric thin films have applications in nonvolatile memories, capacitors, sensors, and optical devices due to their dielectric, piezoelectric and electro-optic properties. Ferromagnetic materials find use in transformers, electromagnets, recording media, and sensors. The document outlines the operating principles and advantages of these various electroceramic and magnetic applications.
Principle, interaction of X-Ray with matter, imaging, film and film less techniques, types and use of filters and screens, geometric factors, Inverse square law, characteristics of films - graininess, density, speed, contrast, characteristic curves, Penetrameters, Exposure charts, Radiographic equivalence. Fluoroscopy- xero-Radiography, Computed Radiography, Computed Tomography
This document provides an overview of microfabrication and nanofabrication techniques. It discusses both top-down approaches like photolithography, nanoimprint lithography, and nanosphere lithography as well as bottom-up techniques such as carbon nanotube synthesis and molecular self-assembly. The document also covers common microfabrication processes like thin film deposition, doping, oxidation, etching, and lithography. It provides details on lithography methods, thin film deposition techniques like CVD and PVD, and etching approaches including wet and dry etching.
This document provides an overview of microfabrication and nanofabrication techniques. It discusses both top-down approaches like photolithography, nanoimprint lithography, and nanosphere lithography as well as bottom-up techniques such as carbon nanotube synthesis and molecular self-assembly. The document also covers common microfabrication processes like thin film deposition, doping, oxidation, etching, and lithography. It provides details on lithography techniques, thin film deposition methods like CVD and PVD, and etching approaches including wet and dry etching.
This document discusses nanoscience and nanotechnology. It begins by defining nanoscience as the study of structures between 1-100nm, where properties change significantly from their bulk counterparts due to high surface area to volume ratios and quantum effects. It then provides examples of how these factors enhance mechanical, electrical, optical and other properties. Applications discussed include microelectronics, energy efficiency, medicine, and textiles. In the concluding questions, it asks about the significance of nanoscale, medical applications of nanomaterials, classifications of nanomaterials, and properties such as mechanical, electrical and optical.
Recent advances in superhard nanocomposite coatings were presented. Nanocomposite coatings can be designed using various methods like combining two nanocrystalline phases or embedding nanocrystalline phases in an amorphous matrix to improve hardness and toughness. Coatings are synthesized using methods like chemical vapor deposition or magnetron sputtering. Properties are evaluated through nanoindentation, scratch adhesion testing, and measuring fracture toughness. Designing coatings with optimal parameters can yield both high hardness and toughness for industrial applications.
Recent advances in superhard nanocomposite coatings were presented. Nanocomposite coatings can be designed using various methods like combining two nanocrystalline phases or embedding nanocrystalline phases in an amorphous matrix to improve hardness and toughness. Coatings are synthesized using methods like chemical vapor deposition or magnetron sputtering. Properties are evaluated through nanoindentation, scratch adhesion testing, and measuring fracture toughness. Designing coatings with optimized parameters can provide both high hardness and toughness making nanocomposite coatings suitable for industrial applications.
The document discusses various applications of electroceramics and ferroelectric thin films. It describes multilayer ceramic capacitors which use alternate dielectric and electrode layers. Ferroelectric thin films can be used in non-volatile memories, capacitors, sensors, and acoustic wave substrates. It also discusses ferroelectric RAM and the advantages it provides over other memory types. Other applications mentioned include actuators, capacitors, pyroelectric detectors, and substrates for surface acoustic waves.
Radiographic testing uses x-rays or gamma rays to detect defects in welds. X-rays are produced when electrons collide with heavy metal targets, while gamma rays come from radioactive sources. The material is exposed to radiation, and defects appear as variations in density on the processed film. Trained inspectors can interpret the film to locate cracks, pores, inclusions and other issues. While gamma rays have advantages like portability, x-rays generally provide higher quality images for precise defect analysis of welds. Both techniques provide a permanent radiographic record but require safety precautions due to invisible radiation.
Similar to RF SPUTTERING.pptx engineering physics.. (20)
20CDE09- INFORMATION DESIGN
UNIT I INCEPTION OF INFORMATION DESIGN
Introduction and Definition
History of Information Design
Need of Information Design
Types of Information Design
Identifying audience
Defining the audience and their needs
Inclusivity and Visual impairment
Case study.
Conservation of Taksar through Economic RegenerationPriyankaKarn3
This was our 9th Sem Design Studio Project, introduced as Conservation of Taksar Bazar, Bhojpur, an ancient city famous for Taksar- Making Coins. Taksar Bazaar has a civilization of Newars shifted from Patan, with huge socio-economic and cultural significance having a settlement of about 300 years. But in the present scenario, Taksar Bazar has lost its charm and importance, due to various reasons like, migration, unemployment, shift of economic activities to Bhojpur and many more. The scenario was so pityful that when we went to make inventories, take survey and study the site, the people and the context, we barely found any youth of our age! Many houses were vacant, the earthquake devasted and ruined heritages.
Conservation of those heritages, ancient marvels,a nd history was in dire need, so we proposed the Conservation of Taksar through economic regeneration because the lack of economy was the main reason for the people to leave the settlement and the reason for the overall declination.
An Internet Protocol address (IP address) is a logical numeric address that is assigned to every single computer, printer, switch, router, tablets, smartphones or any other device that is part of a TCP/IP-based network.
Types of IP address-
Dynamic means "constantly changing “ .dynamic IP addresses aren't more powerful, but they can change.
Static means staying the same. Static. Stand. Stable. Yes, static IP addresses don't change.
Most IP addresses assigned today by Internet Service Providers are dynamic IP addresses. It's more cost effective for the ISP and you.
In May 2024, globally renowned natural diamond crafting company Shree Ramkrishna Exports Pvt. Ltd. (SRK) became the first company in the world to achieve GNFZ’s final net zero certification for existing buildings, for its two two flagship crafting facilities SRK House and SRK Empire. Initially targeting 2030 to reach net zero, SRK joined forces with the Global Network for Zero (GNFZ) to accelerate its target to 2024 — a trailblazing achievement toward emissions elimination.
Response & Safe AI at Summer School of AI at IIITHIIIT Hyderabad
Talk covering Guardrails , Jailbreak, What is an alignment problem? RLHF, EU AI Act, Machine & Graph unlearning, Bias, Inconsistency, Probing, Interpretability, Bias
OCS Training Institute is pleased to co-operate with
a Global provider of Rig Inspection/Audits,
Commission-ing, Compliance & Acceptance as well as
& Engineering for Offshore Drilling Rigs, to deliver
Drilling Rig Inspec-tion Workshops (RIW) which
teaches the inspection & maintenance procedures
required to ensure equipment integrity. Candidates
learn to implement the relevant standards &
understand industry requirements so that they can
verify the condition of a rig’s equipment & improve
safety, thus reducing the number of accidents and
protecting the asset.
2. SPUTTERING GENERAL
Sputtering is a term used to describe the mechanism in which atoms are
ejected from the surface of a material when that surface is stuck by
sufficiency energetic particles.
First discovered in 1852, and developed as a thin film deposition technique by
Langmuir in 1920.
Metallic films: Al-alloys, Ti, Tantalum, Nickel, Cobalt, Gold, etc.
3. Reason for sputtering
Use large-area-targets which gives uniform thickness over the
wafer.
Control the thickness by Deposition time and other parameters.
Even materials with very high melting points are easily sputtered.
Sputtered films typically have a better adhesion on the substrate.
Sputtering can be performed bottom-up.
6. Sputtering
steps
➤ lons are generated and directed at a target.
➤ The ions sputter targets atoms.
➤ The ejected atoms are transported to the
substrate.
➤ Atoms condense and form a thin film.
7. Sputtering
yield
Defined as the number of atoms ejected per
incident ion.Determines the deposition rate.
Depends on:
Mass of bombarding ions.
Energy of the bombarding ions.
Direction of incidence of ions (angle).
Pressure.
8. Sputtering deposition film
growth
Sputtered atoms have velocities of 3-6 E5
m/sec and energy of 10-40 eV.
Many of these atoms deposited upon the
substrate.
Thus, sputtered atoms will suffer one or
more collision with the sputter gas.
9. • The sputter atoms have:
• Arrive at surface with reduce energy (1-2 eV).
• Be backscattered to target/chamber.
• The sputtering gas pressure can impact on film
deposition parameters, such as Deposition rate
and composition of the film.
12. Reactive
sputtering
• Reactive gas is introduced into the sputtering chamber in
addition to the Argon plasma.
• The compound is formed by the elements of that gas
combining with the sputter material (Ex. TIN).
• The reaction is usually occurs either on the wafer surface
or on the target itself.
• As you add more reactive gas at some point the reaction
rate exceeds the sputtering rate.
• At this point the target surface switches from clean
metal to compound over a short time.
13. The transition in target chemistry
changes sputtering conditions
dramatically !
15. Dc sputtering
E(e^ - )< 2eV - no ionization, elastic collisions only
E (e) > 2eV - inelastic collisions add energy to Ar
ionization (highest energy process, ~15eV)
Ar+e^ - A * r ^ 2 e^ -
Note: mass (e^ - )/mass (Ar) sim10^ -5
*energy transfer small
* e gain energy via elastic collisions until E>15eV
for ionization
* #ions ~ #neutrals sim 3 * 10 ^ 9 * c
*m ^ - 3 @ 10mT
16. • Light e- pulled towards walls faster than ions, leaving slightly
more ions in glow region
• Light e- move away from cathode faster than ions, leading
to a large field, high acceleration of ions into cathode
• high-E ions (10keV to 1 MeV) knock target material loose
resulting plume of neutrals
• new electrons from impact reactions replenish the plasma
17. Parameters for DC
Sputtering
● Sputter voltage
typically -2 to -5 kV
●Substrate Bias Voltage
substrate is being bombarded by electrons and ions
from target and plasma sputtering film while you deposit
neutral atoms deposit independently put negative bias on
the substrate to control this can significantly change film
properties
●Deposition rate
changes with Ar pressure
increases with sputter yield
• usually increases with high voltage
18. Definition
RF sputtering is a sophisticated and highly
efficient process that allows for the precise
deposition of thin films onto a substrate, paving
the way for advancements in electronics, optics,
and materials science.
20. Process of sputtering
• The RF sputtering process begins with the careful
selection of a solid target material.
• The material is decided based on the specific properties
desired for the ensuing thin film deposition.
• This choice often involves selecting from a range of
materials that include metals, semiconductors and
insulators.
• The subsequent steps take place within a vacuum
chamber.
• The vacuum chamber is an essential component of the
process designed to eliminate interference from the
surrounding atmosphere and establish a meticulously
controlled environment.
21. • Once the target material is chosen, the substrate,
onto which the thin film will be deposited, is placed
strategically within the vacuum chamber to ensure
precision in the subsequent deposition steps.
• To facilitate the sputtering process, an inert gas,
typically argon, is introduced into the vacuum
chamber.
• This inert gas serves as a medium through which
momentum is transferred from ionized gas particles
(plasma) to the selected target material.
22. • RF power is introduced in the chamber leading
to the creation of a plasma within the chamber.
• The high-frequency oscillations of the RF power
enhance the ionization of the gas, creating a
more energetic and controlled plasma
compared to DC sputtering.
23. • As the RF power energizes the plasma, high-energy
ions within the plasma collide with the atoms
constituting the target material.
• This collision process effectively dislodges atoms
from the surface of the target material.
• These dislodged atoms then travel through the
vacuum chamber, navigating the controlled
environment and ultimately settling onto the
strategically positioned substrate.
• This results in the formation of a thin film on the
substrate, transferring the desired properties of the
initially chosen target material to the substrate.
24. RF Power in RF Sputtering
• The amount of RF power required for RF sputtering can
vary depending on several factors, including the specific
materials being used, the size and geometry of the
sputtering system, the desired deposition rate, and the
characteristics of the thin film being deposited.
• Generally, RF sputtering systems operate in the radio
frequency range, typically between 13.56 MHz and 100
MHz
25. • As the RF power is applied to the target material,
it creates a plasma in the vacuum chamber.
• The power level influences the ionization of the
inert gas (commonly argon) and, consequently,
the sputtering rate.
• Higher RF power levels can lead to a more
energetic plasma, which may result in a higher
deposition rate and enhanced film properties.
26. • Typically, RF power levels for sputtering can
range from a few hundred watts to several
kilowatts.
• For smaller laboratory-scale systems, the power
might be in the range of 100-500 watts.
• In larger industrial-scale systems, the RF power
can be much higher, ranging from several
hundred watts to several kilowatts.
27. • The optimal power level for RF sputtering is often
determined experimentally for a specific set of
parameters, including the type of target material,
the substrate material, and the desired film
properties.
• Process engineers and researchers typically
perform power optimization studies to find the
most efficient and effective power level for a
given deposition process
28. • The choice of RF power is a crucial parameter in the
control and optimization of the sputtering process,
influencing factors such as film thickness, uniformity,
and the overall efficiency of the deposition.
• It's common for operators and researchers to adjust
and fine-tune the RF power to achieve the desired thin
film characteristics in a reproducible manner.
29. Advantages of RF Sputtering
Uniform Thin Films: RF sputtering provides excellent control
over the deposition process, resulting in highly uniform and
reproducible thin films.
Target Material Variety: RF sputtering supports a wide range
of target materials, including metals, alloys, and compound
materials, allowing for the deposition of diverse thin films with
specific properties.
Reduced Heating: The use of RF power reduces the thermal
stress on the target material, enabling the deposition of thin
films on temperature-sensitive substrates.
High Deposition Rates: RF sputtering can achieve higher
deposition rates compared to DC sputtering, making it suitable
for large-scale production.
30. Applications of RF
Sputtering:
Semiconductor Manufacturing: RF sputtering is widely employed in the
production of semiconductor devices, including integrated circuits and thin-film
transistors.
Optical Coatings: The precision and uniformity of RF-sputtered thin films make
them ideal for optical coatings, such as anti-reflective coatings on lenses and
mirrors.
Solar Cells: RF sputtering is utilized in the manufacturing of thin-film solar cells,
contributing to the development of efficient and cost-effective solar energy
solutions.
Data Storage: The technology is integral in the production of magnetic thin films
for use in hard disk drives and other data storage devices.
31. MAGNETRON
SPUTTERING
Here magnets are used to increase the percentage of
electrons that take part in ionization events, increase
probability of electrons striking Ar, increase electron path
length, so the ionization efficiency is increased significantly.
Another reasons to use magnets:
Lower voltage needed to strike plasma. Controls
uniformity.
Reduce wafer heating from electron bombardment.
Increased deposition rate
- Good control over reactive sputtering
32. Strong electric and magnetic
field
• Magnetron sputtering is a highly versatile thin
film deposition technique for coating films with
excellent adhesion and high density.
• A type of physical vapor deposition (PVD)
coating technology, magnetron sputtering is a
plasma-based coating process where a
magnetically confined plasma is created near
the surface of a target material, Positively
charged energetic ions from the plasma collide
with the negatively charged target material,
and atoms from the target are ejected or
"sputtered", which then deposit on a substrate.
33. PROCESS
The magnetron device has a dipole magnetic configuration to trap the
electrons emitted at the cathode. In this way the excitation and
ionization rates are enhanced, allowing the operation of the discharge
at low pressures, below 10 mbar. To create this dipole configuration,
usually three rows of permanent magnets are arranged in the following
order, N- S-N or S-N-5, that is, the inner row must have an opposite
polarization in relation to the outer rows. On the balanced
magnetrons, the magnets have the same strength. On the unbalanced
magnetron the inner magnet is weakened. In this way, more electrons
are lost to the plasma, resulting in an increase of the plasma length,
towards the substrate. In this way, the substrate current increases
dramatically, as well as the coating quality
35. Difference between RF and DC
sputtering
• In RF sputtering, DC power source is replaced with an AC one in
the vacuum chamber, in which the polarity of the power supply
changes alternatively. Thus, the electrons reach the target
when it possesses the positive pole in the half-cycle and
neutralize the positive ions collected on the target surface;
while in the other half-cycle, target atoms sputtered by positive
ions bombarding the target are deposited on the substrate and
form a layer
36. • To electrically discharge the target during sputtering a
frequency of 1MHz or higher is needed. Application of an
alternative current to an insulating target in this frequency
range is equivalent to current flow through dielectric media
of capacitors in series.Since the frequency normally used in
this method is in the range of 5-30 MHz, it is commonly
known as Radio Frequency (RF) Sputtering.
37. Why Frequency of 13.56 MHz is
Used?
• In order to prevent the interference between the
frequencies used in telecommunication services, the
standard radio frequency recommended by the ITU Radio
Regulations (2012) for operating industrial (I), scientific
(S), and medical (M) instruments, which is called ISM, is
centered at 13.56 MHz with a bandwidth of 14 kHz.Also
this frequency is low enough to provide sufficient time
for the momentum transfer of argon ions to the target.
At higher frequencies, Ar ions are practically immobilized
and electrons play effective role in the sputtering process
(more like e-beam evaporation method).
38. RF Sputtering Advantages over DC
Sputtering
• Now, we will examine DC vs RF sputtering and explain the
advantages of RF magnetron sputtering.The plasma formation is not
limited to the cathode or target surface and can extend in the
vacuum chamber.
• Higher plasma currents in lower working pressure: Plasma can be
maintained in less working gas pressure (1-15 mTorr), which results in
less collision between sputtered atoms and chamber molecules and
larger mean free path for target atoms. Also, the magnetic field of
the magnetron creates a boundary tunnel which traps the electrons
near target surface and increases sputtering yield in lower pressures.
39. • By eliminating charge build up on the cathode
surface, plasma arcing and layer quality control
issues will be eradicated, so more uniform layer
deposition is possible.
• In RF sputtering larger surface of the target is
involved in the sputtering process, resulting in
decreasing the so called ‘Race Track Erosion’ on
its surface, so the lifetime of the target is
enhanced.
40. Disadvantages of RF
Sputtering
• Compared to DC Sputtering, higher voltages
should be applied in order to increase the
sputtering rate, leading to more heating
effect on the substrate.
• This method is more complicated and
expensive compared to traditional DC
sputtering.
41. • RF current is transported on the skin or surface of the
conductors and not through them, so special connectors
and cables is needed for RF sputtering.
• With decrease in secondary electrons over cathode,
deposition rate is lower than DC method and higher power
level is needed to increase deposition rate
• .As a consequence of lower sputtering yields of electrically
insulating targets, resulting in lower deposition rates, RF
sources with higher powers should be employed, in
contrast to DC sputtering.