SlideShare a Scribd company logo
PROJECT ARA
By:
ZIAD IBRAHIM IBN NAZAR
1HK11CS121
Dept. . of CSE 1 23/0/2016
Under the Guidance of
Mr. Neelam Malayadri
Asst. Professor
INTRODUCTION TO PROJECT ARA
 Project Ara is the codename for an initiative by Google that aims to develop a free ,
open hardware platform for creating highly modular smartphones .
 It is made up of swappable and replaceable parts.
 The phone is designed to be a long-term sustainable product tailored to customers’
changing needs .
Dept. . of CSE 2 23/0/2016
Overview of Modular Phone
 A modular smartphone is made using different components.
 Modular phones components can independently be upgraded or replaced.
 The most important component is the main board, where others are attached.
 Customization has shown to be attractive to customers in a mobile device and
increases the devices lifespan.
Dept. . of CSE 3 23/0/2016
 The MDK defines the Ara platform for module developers and
provides reference implementations for various design features.
 The Ara platform consists of an on-device packet-switched data
network .
 It is based on the MIPI UniPro protocol stack, a flexible power bus,
and an elegant industrial design that mechanically unites the modules
with an endoskeleton.
MDK – MODULE DEVELOPMENT
KIT
Dept. . of CSE 4 23/0/2016
SOFTWARE ARCHITECTURE
 Project ARA runs on a
specialised version of
Android
 Modules use generic device
class drivers that interface
with updated Android HALs
and services to enable the
unique modular features on
the Ara platform.
Dept. . of CSE 5 23/0/2016
Project ARA Platform
 Endo-Skeleton
 Modules
Dept. . of CSE 6 23/0/2016
Endo-Skeleton
 The Ara endoskeleton is the frame and backplane of the device, determining
the size and layout of the phone.
 Ara modules slide in and attach to the endo’s slots, which has a backplane to
electrically and logically connect modules together.
 There are currently 3 endo size
◦ Mini
◦ Medium
◦ Large
 Endoskeleton Connection
◦ Front : Latches
◦ Back: Electro Permanent Magnets
 Life Span – 5 to 6 Years
Dept. . of CSE 7 23/0/2016
Modules
 Modules are building blocks of Project Ara.
 Module is an integrated component which can house a Chip,
Wireless component, SD Slot, which are connected to endo.
 Modules can be of anything like camera, battery, chip etc.
 Modules are connected by EPM, due to which they are
swappable
Dept. . of CSE 8 23/0/2016
New Technologies in ARA
 UniPro 1.6
 Capacitive M-PHY
 Electropermanent Magnet
Dept. . of CSE 9 23/0/2016
UniPro 1.6
 UniPro is a high speed internet protocol that project ARA uses
to allow its modules to speak to each other.
 They share a common low level language for communicating
and building a network.
 Project ARA is tapping into the latest UniPRO 1.6 SPEC
 Which offer high-bandwidth, and low power connections
between the modules.
Dept. . of CSE 10 23/0/2016
Capacitive M-PHY
 A physical layer spec which is developed by MIPI alliance and made to work with
UniPro.
 For project ARA, M-PHY is a capacitive interface, which means that the points
won’t be worn down over time from swapping modules in and out of the phone.
 M-PHY is requiring less pins and providing more bandwidth per pin with
improved power efficiency.
Dept. . of CSE 11 23/0/2016
Electropermanent Magnet
 Electropermanent magnets are used for affixing the modules in place in the
‘ENDO’
 Normal Electromagnets magnetize depending on if current is running through
them- that would be battery drain
 But Electropermanent magnets only use current to flip magnetization on & off
 It is able to retain its magnetized state without draining additional power
Dept. . of CSE 12 23/0/2016
Electro permanent Magnet
Advantages
 Phones are very cheap.
 You only buy the feature that you want.
 Your phone can last indefinitely.
 Repairs are easy and cheaper .
Dept. . of CSE 13 23/0/2016
Goal of Project ARA
 To reduce production of E-Waste.
 To Expand life-span of electronic components .
 To be used by six billion people.
Conclusion….
Modular market
 Modular market might not settle so quickly .
 With the prototype’s receive in the market, new companies or individuals
might get interested in the development of modules
 The success is tightly connected to the variety of modules and brands that
the user might be able to acquire .
 The platform that allows the user to manage all its modules should be
intuitive enough for new smartphone users.
Dept. . of CSE 14 23/0/2016
References
 http://www.projectara.com/
 PHONEBLOKS. Phonebloks, a phone worth keeping. 2014.
https://phonebloks.com/en
 THUNDERCLAP.INC. Thundeclap. 2012 https://www.thunderclap.it/en
 http://www.modularphonesforum.com/developers/faq/ara-software-stack/
 http://www.theverge.com/2015/1/14/7547495/ara-configurator-app-project-ara-
smartphone
 https://github.com/projectara
 http://www.projectara.com/mdk/
Dept. . of CSE 15 23/0/2016
Dept. . of CSE 16 23/0/2016
Dept. . of CSE 17 23/0/2016

More Related Content

PROJECT ARA

  • 1. PROJECT ARA By: ZIAD IBRAHIM IBN NAZAR 1HK11CS121 Dept. . of CSE 1 23/0/2016 Under the Guidance of Mr. Neelam Malayadri Asst. Professor
  • 2. INTRODUCTION TO PROJECT ARA  Project Ara is the codename for an initiative by Google that aims to develop a free , open hardware platform for creating highly modular smartphones .  It is made up of swappable and replaceable parts.  The phone is designed to be a long-term sustainable product tailored to customers’ changing needs . Dept. . of CSE 2 23/0/2016
  • 3. Overview of Modular Phone  A modular smartphone is made using different components.  Modular phones components can independently be upgraded or replaced.  The most important component is the main board, where others are attached.  Customization has shown to be attractive to customers in a mobile device and increases the devices lifespan. Dept. . of CSE 3 23/0/2016
  • 4.  The MDK defines the Ara platform for module developers and provides reference implementations for various design features.  The Ara platform consists of an on-device packet-switched data network .  It is based on the MIPI UniPro protocol stack, a flexible power bus, and an elegant industrial design that mechanically unites the modules with an endoskeleton. MDK – MODULE DEVELOPMENT KIT Dept. . of CSE 4 23/0/2016
  • 5. SOFTWARE ARCHITECTURE  Project ARA runs on a specialised version of Android  Modules use generic device class drivers that interface with updated Android HALs and services to enable the unique modular features on the Ara platform. Dept. . of CSE 5 23/0/2016
  • 6. Project ARA Platform  Endo-Skeleton  Modules Dept. . of CSE 6 23/0/2016
  • 7. Endo-Skeleton  The Ara endoskeleton is the frame and backplane of the device, determining the size and layout of the phone.  Ara modules slide in and attach to the endo’s slots, which has a backplane to electrically and logically connect modules together.  There are currently 3 endo size ◦ Mini ◦ Medium ◦ Large  Endoskeleton Connection ◦ Front : Latches ◦ Back: Electro Permanent Magnets  Life Span – 5 to 6 Years Dept. . of CSE 7 23/0/2016
  • 8. Modules  Modules are building blocks of Project Ara.  Module is an integrated component which can house a Chip, Wireless component, SD Slot, which are connected to endo.  Modules can be of anything like camera, battery, chip etc.  Modules are connected by EPM, due to which they are swappable Dept. . of CSE 8 23/0/2016
  • 9. New Technologies in ARA  UniPro 1.6  Capacitive M-PHY  Electropermanent Magnet Dept. . of CSE 9 23/0/2016
  • 10. UniPro 1.6  UniPro is a high speed internet protocol that project ARA uses to allow its modules to speak to each other.  They share a common low level language for communicating and building a network.  Project ARA is tapping into the latest UniPRO 1.6 SPEC  Which offer high-bandwidth, and low power connections between the modules. Dept. . of CSE 10 23/0/2016
  • 11. Capacitive M-PHY  A physical layer spec which is developed by MIPI alliance and made to work with UniPro.  For project ARA, M-PHY is a capacitive interface, which means that the points won’t be worn down over time from swapping modules in and out of the phone.  M-PHY is requiring less pins and providing more bandwidth per pin with improved power efficiency. Dept. . of CSE 11 23/0/2016
  • 12. Electropermanent Magnet  Electropermanent magnets are used for affixing the modules in place in the ‘ENDO’  Normal Electromagnets magnetize depending on if current is running through them- that would be battery drain  But Electropermanent magnets only use current to flip magnetization on & off  It is able to retain its magnetized state without draining additional power Dept. . of CSE 12 23/0/2016 Electro permanent Magnet
  • 13. Advantages  Phones are very cheap.  You only buy the feature that you want.  Your phone can last indefinitely.  Repairs are easy and cheaper . Dept. . of CSE 13 23/0/2016 Goal of Project ARA  To reduce production of E-Waste.  To Expand life-span of electronic components .  To be used by six billion people.
  • 14. Conclusion…. Modular market  Modular market might not settle so quickly .  With the prototype’s receive in the market, new companies or individuals might get interested in the development of modules  The success is tightly connected to the variety of modules and brands that the user might be able to acquire .  The platform that allows the user to manage all its modules should be intuitive enough for new smartphone users. Dept. . of CSE 14 23/0/2016
  • 15. References  http://www.projectara.com/  PHONEBLOKS. Phonebloks, a phone worth keeping. 2014. https://phonebloks.com/en  THUNDERCLAP.INC. Thundeclap. 2012 https://www.thunderclap.it/en  http://www.modularphonesforum.com/developers/faq/ara-software-stack/  http://www.theverge.com/2015/1/14/7547495/ara-configurator-app-project-ara- smartphone  https://github.com/projectara  http://www.projectara.com/mdk/ Dept. . of CSE 15 23/0/2016
  • 16. Dept. . of CSE 16 23/0/2016
  • 17. Dept. . of CSE 17 23/0/2016