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Photonic Integrated Circuit Technology

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Rinu Antony
Rinu Antony

*(PPT was prepared for a 15 min presentation) The topic "Photonic Integrated circuit technology" is in itself very vast that it cant be explained completely in a matter of minutes, so it is better to focus on a particular type of PIC throughout the presentation .(because,based on substrate material,the technology changes and it is always important to maintain a flow throughout the presentation). Research well on the topic,do your best and leave the rest :)

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Photonic Integrated Circuit Technology
INTRODUCTION PHOTONIC IC VS ELECTRONIC IC Basic components CLASSIFICATION FABRICATION PIC – AN EXAMPLE EVaLUATION OF a PIC APPLICATIONS CURRENT ASPECTS FUTURE PROSPECTS REFERENCES
INTRODUCTION  Technology introduced -1970’s  Optical equivalent of electronic IC  Involves integration of optical functions into a single chip  High speed data rates  Small size, reduced power consumption
PHOTONIC IC VS ELECTRONIC IC FEATURES PIC EIC Data Carrier Photons Electrons Type of components Functional optical devices Transistors No. of components integrated Limited to a few hundred Range into millions  Substrate materials Many different materials in a single chip Fits nicely onto Silicon
BASIC COMPONENTS PASSIVE • Waveguides/Couplers • Switches (optical interconnect, wavelength selective switches) • Filters (add-drop filters, MUX/DEMUX) • Dispersion compensators • Attenuator • Gain equalizer • Isolators/Circulators ACTIVE • Amplifiers • Lasers • LED • Modulators • Detectors • Wavelength Converters
Photonic Integrated Circuit Technology
a) b) c) a)Array Waveguide Grating(AWG) b)Multimode Interference Couplers (MMI) c)Mach-Zehnder Interferometers(MZI)
CLASSIFICATION  Based on integration : - Monolithic Integration - Hybrid Integration - Modular Integration  Based on type of substrate material : - Indium Phosphide (InP) - Gallium Arsenide (GaAs) - Lithium Niobate - Silicon (Si) - Silica-on-Silicon - Silicon on Insulator
Photonic Integrated Circuit Technology
FABRICATION • Structural strategy for the fabrication of PICs onto an InP substrate • Basic steps : - Epitaxial growth - Waveguide etching - Passivation and planarization - Metallization and interconnect
Four active-passive integration schemes: (a) vertical twin-guide integration (b) vertical single guide integration (c) quantum well intermixing (and selective area growth) (d) butt-joint integration
Cross section of the wafer structure after the 4 processes:
PIC – AN EXAMPLE WDM chip : Integration of multiple wavelengths onto single transmitter and reciever chips
EVALUATION OF A PIC  Merits :  Demerits : Compared with EICs Compared to discrete optical components • Increased Bandwidth and lower power consumption • Smaller size, lower power consumption • High Reliability • Improved optical alignment • Data Transparency • Immunity to vibration • High cost for developing new fabrication technology
APPLICATIONS • Fiber Optics • Bio-Photonics • Sensors • Photonic Computing • Nano Photonics
CURRENT ASPECTS • WDM system on a chip • Match discrete components in performance • Unmatched space ,power and reliability • Deliver lowest cost/bit • High spectral efficiency
FUTURE PROSPECTS • Complex packages that support advanced modulation schemes and receiver designs • Integration of electronics and optics
Optical Fiber Communications – Principles and Practice by John M. Senior www.infinera.com http://en.wikipedia.org http://iopscience.iop.org http://www.sciencedirect.com http://www.vlcphotonics.com http://www.photonics.com http://ieeexplore.ieee.org http://www.researchgate.net http://photonicswiki.org http://www.onechipphotonics.com www.circuitstoday.com
Thank You

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Photonic Integrated Circuit Technology

  • 2. INTRODUCTION PHOTONIC IC VS ELECTRONIC IC Basic components CLASSIFICATION FABRICATION PIC – AN EXAMPLE EVaLUATION OF a PIC APPLICATIONS CURRENT ASPECTS FUTURE PROSPECTS REFERENCES
  • 3. INTRODUCTION  Technology introduced -1970’s  Optical equivalent of electronic IC  Involves integration of optical functions into a single chip  High speed data rates  Small size, reduced power consumption
  • 4. PHOTONIC IC VS ELECTRONIC IC FEATURES PIC EIC Data Carrier Photons Electrons Type of components Functional optical devices Transistors No. of components integrated Limited to a few hundred Range into millions  Substrate materials Many different materials in a single chip Fits nicely onto Silicon
  • 5. BASIC COMPONENTS PASSIVE • Waveguides/Couplers • Switches (optical interconnect, wavelength selective switches) • Filters (add-drop filters, MUX/DEMUX) • Dispersion compensators • Attenuator • Gain equalizer • Isolators/Circulators ACTIVE • Amplifiers • Lasers • LED • Modulators • Detectors • Wavelength Converters
  • 7. a) b) c) a)Array Waveguide Grating(AWG) b)Multimode Interference Couplers (MMI) c)Mach-Zehnder Interferometers(MZI)
  • 8. CLASSIFICATION  Based on integration : - Monolithic Integration - Hybrid Integration - Modular Integration  Based on type of substrate material : - Indium Phosphide (InP) - Gallium Arsenide (GaAs) - Lithium Niobate - Silicon (Si) - Silica-on-Silicon - Silicon on Insulator
  • 10. FABRICATION • Structural strategy for the fabrication of PICs onto an InP substrate • Basic steps : - Epitaxial growth - Waveguide etching - Passivation and planarization - Metallization and interconnect
  • 11. Four active-passive integration schemes: (a) vertical twin-guide integration (b) vertical single guide integration (c) quantum well intermixing (and selective area growth) (d) butt-joint integration
  • 12. Cross section of the wafer structure after the 4 processes:
  • 13. PIC – AN EXAMPLE WDM chip : Integration of multiple wavelengths onto single transmitter and reciever chips
  • 14. EVALUATION OF A PIC  Merits :  Demerits : Compared with EICs Compared to discrete optical components • Increased Bandwidth and lower power consumption • Smaller size, lower power consumption • High Reliability • Improved optical alignment • Data Transparency • Immunity to vibration • High cost for developing new fabrication technology
  • 15. APPLICATIONS • Fiber Optics • Bio-Photonics • Sensors • Photonic Computing • Nano Photonics
  • 16. CURRENT ASPECTS • WDM system on a chip • Match discrete components in performance • Unmatched space ,power and reliability • Deliver lowest cost/bit • High spectral efficiency
  • 17. FUTURE PROSPECTS • Complex packages that support advanced modulation schemes and receiver designs • Integration of electronics and optics
  • 18. Optical Fiber Communications – Principles and Practice by John M. Senior www.infinera.com http://en.wikipedia.org http://iopscience.iop.org http://www.sciencedirect.com http://www.vlcphotonics.com http://www.photonics.com http://ieeexplore.ieee.org http://www.researchgate.net http://photonicswiki.org http://www.onechipphotonics.com www.circuitstoday.com