2.5D/3D technologies require designers to reduce electrostatic discharge (ESD) protection of the internal I/O interfaces. To avoid over-design of ESD protection, designers require a more fundamental understanding of the ESD events that occur at this level. Here we present insights, practical guidelines and research directions for circuit designers and suppliers of bonding tools.
- Shih-Hsiang (Shane) Lin
- Marko Simicic
- Nicolas Pantano