0
\$\begingroup\$

What is the right design rules from JLCPCB? When I look at the electrical clearance from JLCPCB, I find:

  • Via to Via (Same net labels): 0.254mm
  • Hole to hole (Different net labels): 0.5mm
  • Pad to pad (Different net labels): 0.127mm
  • Pad to Pad with hole (Different net labels): 0.5mm
  • Via to track: 0.254 mm
  • Plated Hole to track: 0.33mm
  • Non Plated Hole to track: 0.254mm
  • Pad to track: 0.2mm
  • Minimum spacning: 0.09mm (4-6 layers)

https://jlcpcb.com/capabilities/pcb-capabilities

Question:

Are these the correct settings of the design rules?

enter image description here

Issue:

The issue is that it seems like a regular BGA footprint cannot even be produced by JLCPCB with those design rules. I have downloaded a sample CAD model from STMicroelectronics and it seems that all the rules from that model violate the JLCPCB rules. Is that correct?

\$\endgroup\$
3
  • \$\begingroup\$ are you entering the parameters in the correct units? \$\endgroup\$ Commented May 2 at 23:00
  • \$\begingroup\$ @JasenСлаваУкраїні yes, in mm. \$\endgroup\$
    – euraad
    Commented May 4 at 11:09
  • \$\begingroup\$ You would stand a better chance of getting a good answer if you included an image the proposed BGA footprint. I don't think anyone is going to go to a registration-walled site and install a footprint just to answer this question. \$\endgroup\$ Commented May 4 at 22:19

1 Answer 1

0
\$\begingroup\$

Yes!

The answer is that JLCPCB can produce that CAD-model. I uploaded the gerber files of that CAD-model and load it into JLCPCB and ask them for review the gerber files.

Approved, from their side.

\$\endgroup\$

Not the answer you're looking for? Browse other questions tagged or ask your own question.