I'm not saying it can't be done without, but I would really recommend a board pre-heater.
These devices apply lower, non-soldering heat to the whole board to make it easier to reflow the solder. If you consider that the room temperature might be 20 deg C, and you need to get the solder in excess of 210 deg C that's a big jump. All that heat having to come from one hot air source makes it very difficult to get the solder you want - particularly solder that's underneath a chip that will insulate it - hot enough without damaging it.
Whereas if you preheat the whole board, even just to 100 deg C, it's much easier to apply the hot air gun, because you need to use a lot less heat. You can go higher on the preheat if you like, just be mindful of what else is on the board and whether this will be a problem.