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Not a very technical question but I'm interested in finding out the average size of a 3-axis accelerometer die. I’m finding that the smaller package sizes are around 2x2x1mm, is there a way of estimating roughly what size the die would be for a IC package of that size?

The two IC’s I’ve come across are ‘0273.141.169-1NV Bosch’ & ‘MEMSensing Microsystems MSA300’ both of which are 2x2x1mm.

Could I estimate that the die would be approximately 80% of the package size for example? I’ve spent some time googling this with no answers. Does anyone have any experience with this, or do I need to decap/X-Ray the ICs?

Thanks in advances & Best Regards,

Jack

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  • \$\begingroup\$ For some packages, such estimates make no sense at all, for others, you can do much better. What kind of packages are we talking about? \$\endgroup\$ Commented Jul 20, 2021 at 16:58
  • \$\begingroup\$ package sizes are often more defined by the number and size of desirable contacts than by the die size, but of course there's exceptions, like chip-scale packages, which, you guess it, are literally chips with a few balls underneath and otherwise lacquer all around. \$\endgroup\$ Commented Jul 20, 2021 at 16:59
  • \$\begingroup\$ But before you decap anything, have you checked for patents with "3-axis accelerometer" belonging to the manufacturers of these devices? Not like there's too much secret about the size, so there might be pretty enlightening drafts in there. \$\endgroup\$ Commented Jul 20, 2021 at 17:06
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    \$\begingroup\$ It depends very strongly on the die and package in question. There are parts you can get with the same exact die in both SOIC and DIP, and sometimes TSSOP too. \$\endgroup\$
    – Hearth
    Commented Jul 20, 2021 at 18:44
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    \$\begingroup\$ Here is what that Bosch part looks like inside: dokumen.tips/reader/f/… \$\endgroup\$ Commented Jul 20, 2021 at 22:57

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