Not a very technical question but I'm interested in finding out the average size of a 3-axis accelerometer die. I’m finding that the smaller package sizes are around 2x2x1mm, is there a way of estimating roughly what size the die would be for a IC package of that size?
The two IC’s I’ve come across are ‘0273.141.169-1NV Bosch’ & ‘MEMSensing Microsystems MSA300’ both of which are 2x2x1mm.
Could I estimate that the die would be approximately 80% of the package size for example? I’ve spent some time googling this with no answers. Does anyone have any experience with this, or do I need to decap/X-Ray the ICs?
Thanks in advances & Best Regards,
Jack