I have a top only pad in a footprint. I don't need any open window on the the top solder layer so I set the tented option enable for my pad...
But even if the top solder is off (no window for this pad, it is tented), I have top paste for this pad... see picture :
So, I have to switch to manual paste mask expansion and put -999 mils into value to be sure it disappear...
For me it's a mistake/bug from Altium. Because it have no sense to have paste on a pad without any window on top solder mask on it to received. So does not a tented pad should automatically disable the associated paste for this external layer ?
Related information : https://bugcrunch.live.altium.com/#Idea/9120