Recently I've designed a PCB for the ESP8266EX-chip. With my amount of knowledge, I thought it would be smart to stitch vias into pads. To be specific, not only the ground pad of the chip, but also the small pin-pads (It's a QFN Chip).
After soldering everything using a reflow oven, the PCB wasn't working -> I couldn't upload anything to the chip. So I tried soldering the PCB in a reflow oven without any parts on the solder paste. This time I saw, that the vias suck up almost all solder off of the PCB pads. This could also be an effect because I don't have any parts on the solder paste, but after searching the internet about my problem, it seems that my open vias are the problem.
I tried filling the vias with solder paste, and then putting solder paste on the pads, no success.
Is there a way to make this work? I received 35 boards from a sponsor (couldn't go lower), and it would be incovenient if I have to throw them away.
Soldering using a solder station is not an option, I tried. Looking for a solution on the internet was also not helpful.