I'm really in a hurry with a university project. I need to finish the first prototype of an electronics board by the end of the week. It's a through hole board, no SMD.
Having just single sided copper boards and press-n-peel paper, I first tried to go by the single layer way. I can't get to the point of a decent routing. Even using jumper wires seems unpractical. I ended having more than 20 jumper wires connecting different parts of the board.
Then I tried the double layer routing. Everything fell into place in a matter of minutes. Everything looks clean and manageable. No jumper wires, no hard-to-fabricate vias in the middle of connectors, etc...
Could it be possible to develop the two sides of the two layers board onto different copper boards and the align and glue everything together?
It looks promising to me. The hardest part would be the alignment, but to me it looks quite easier that aligning the press-n-peel sheets. I could make alignment holes and then do the rest of the milling.
Has any of you tried this method?
What are the pros and the cons?
Thanks and sorry for my bad English