Global Standards for the Microelectronics Industry
Committee Chairs
| Committee | Chair | Company | |
|---|---|---|---|
| JC-11: Mechanical Standardization | Xiang Li | Intel Corporation | |
| JC-11: Mechanical Standardization | Zhineng Fan (Co-Vice-Chair) |
Amphenol | |
| JC-11: Mechanical Standardization | John Norton (Co-Vice-Chair) |
Nvidia Corporation | |
| JC-11.2 Subcommittee: Design Requirements | Kayleen Helms | Intel Corporation | |
| JC-11.4 Subcommittee: Uncased Devices | Dale Arnold | Micron Technology | |
| JC-11.5 Package Interface | Xiang Li | Intel Corporation | |
| JC-11.7 IEC Interface | Kayleen Helms | Intel Corporation | |
| JC-11.11 Subcommittee: Microelectronic Plastic Packages | Dale Arnold | Micron Technology | |
| JC-11.14 Subcommittee: Microelectronic Assemblies | Xiang Li | Intel Corporation | |
| JC-13: Government Liaison | Paul Nixon | BAE Systems | |
| JC-13: Government Liaison | Craig Taylor (Vice-Chair) |
AMD | |
| JC-13.1 Subcommittee: Discrete Devices | Beth Parker | Microchip Technology | |
| JC-13.2 Subcommittee: Microelectronic Devices | Ben Mendoza | Golden Altos | |
| JC-13.2 Subcommittee: Microelectronic Devices | Eleanor Xavier (Vice-Chair) |
SRI International Sarnoff | |
| JC-13.4 Subcommittee: Radiation Hardness: Assurance and Characterization | Reed Lawrence | BAE Systems | |
| JC-13.5 Subcommittee: Hybrid, RF/Microwave, and MCM Technology | Granville "Bo" Rains | Micross Components | |
| JC-13.7 Subcommittee: New Electronic Device Technology | Craig Taylor | AMD | |
| JC-13.7 Subcommittee: New Electronic Device Technology | Jeff Jarvis (Vice-Chair) |
U.S. Army DEVCOM AvMC | |
| JC-14: Quality and Reliability of Solid State Products | Ife Hsu (Acting Chair) |
Intel Corporation | |
| JC-14: Quality and Reliability of Solid State Products | Ife Hsu (Vice-Chair) |
Intel Corporation | |
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices | Ife Hsu | Intel Corporation | |
| JC-14.1 Subcommittee: Reliability Test Methods for Packaged Devices | Gavin Hall (Vice-Chair) |
Infineon | |
| JC-14.2 Subcommittee: Wafer-Level Reliability | Giuseppe La Rosa | IBM Corporation | |
| JC-14.2 Subcommittee: Wafer-Level Reliability | Andreas Martin (Vice-Chair) |
Infineon | |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring | Maria Tanasescu |
Advanced Micro Devices | |
| JC-14.3 Subcommittee: Silicon Devices Reliability Qualification and Monitoring | Ron Eller (Vice-Chair) |
TI | |
| JC-14.4 Subcommittee: Quality Processes and Methods | Curtis Grosskopf | IBM | |
| JC-14.4 Subcommittee: Quality Processes and Methods | Chris Brigham (Vice-Chair) |
Evans Analytical Group | |
| JC-14.7 Subcommittee: Radio Frequency Reliability and Quality Standards | Purushothaman Srinivasan | Global Foundries | |
| JC-14.7 Subcommittee: Radio Frequency Reliability and Quality Standards | Gergana Drandova | Qorvo | |
| JC-15: Thermal Characterization Techniques for Semiconductor Packages | Robin Bornoff (Acting Chair) |
Siemens Industry Software Inc. | |
| JC-16: Interface Technology | Osamu Nagashima | Micron Technology | |
| JC-40: Digital Logic | Joe Quddus | Montage Technology Co. Ltd. | |
| JC-40: Digital Logic |
Bill Gervasi |
Wolley | |
| JC-40.1 Subcommittee: Digital Logic Families and Applications | Alejandro Gonzalez | Renesas Electronics Corporation | |
| JC-40.1 Subcommittee: Digital Logic Families and Applications |
Leonard Datus |
Montage Technology Co. Ltd. | |
| JC-40.4 Subcommittee: Registered & Fully Buffered Memory Support Logic | Michael Jiang | Montage Technology Co. Ltd. | |
| JC-40.4 Subcommittee: Registered & Fully Buffered Memory Support Logic | Alejandro Gonzalez (Vice-Chair) |
Renesas Electronics Corporation | |
| JC-40.5 Subcommittee: Logic Validation and Verification | Randy White | Keysight Technologies | |
| JC-40.5 Subcommittee: Logic Validation and Verification | Barbara Aichinger (Vice-Chair) |
FuturePlus Systems | |
| JC-40.7 Subcommittee: Memory Support Logic for CXL® | Jordan Chin | Dell | |
| JC-40.7 Subcommittee: Memory Support Logic for CXL® | Terry Grunzke (Co-Vice-Chair) |
Microsoft | |
| JC-40.7 Subcommittee: Memory Support Logic for CXL® | SJ Park (Co-Vice-Chair) |
Samsung Semiconductor | |
| JC-42 Solid State Memories | Christopher Cox |
Advanced Micro Devices | |
| JC-42 Solid State Memories | Belal Gharaibeh (Co-Vice Chair) |
HP Inc. | |
| JC-42 Solid State Memories | DY Lee (Co-Vice Chair) |
Samsung Semiconductor | |
| JC-42: Solid State Memories | Dr. William Shen (Co-Vice Chair) |
Nanya Technology Corporation | |
| JC-42.1 Subcommittee: Graphics RAMs (GDDRx) | Michael Litt | Advanced Micro Devices | |
| JC-42.1 Subcommittee: Graphics RAMs (GDDRx) | Eui Eun Noh (Vice-Chair) |
Samsung Semiconductor | |
| JC-42.2 Subcommittee: High Bandwidth Memory (HBM) | Barry Wagner | Nvidia Corporation | |
| JC-42.2 Subcommittee: High Bandwidth Memory (HBM) | Doug Trujillo (Vice-Chair) |
Micron Technology | |
| JC-42.3 Subcommittee: Dynamic RAMs (DDRx) | Taek Woon Kim | Samsung Semiconductor | |
| JC-42.3 Subcommittee: Dynamic RAMs (DDRx) | Yeongjun Kim (Vice-Chair) |
SK Hynix | |
| JC-42.4 Subcommittee: Non-Volatile Memory Devices | Cliff Zitlaw | Infineon | |
| JC-42.4 Subcommittee: Non-Volatile Memory Devices | Bill Gervasi (Vice-Chair) |
Wolley | |
| JC-42.5 Alternative Memory | Bill Gervasi | Wolley | |
| JC-42.5 Alternative Memory | Jeffrey Chung (Co-Vice Chair) |
Cadence Design Systems | |
| JC-42.5 Alternative Memory | Frank Ross (Co-Vice Chair) |
Micron Technology | |
| JC-42.6 Subcommittee: Low Power Memories | Hung Vuong | Qualcomm | |
| JC-42.6 Subcommittee: Low Power Memories | Osamu Nagashima (Co-Vice Chair) |
Micron Technology | |
| JC-42.6 Subcommittee: Low Power Memories | Jeffrey Chung (Co-Vice Chair) |
Cadence Designs Systems | |
| JC-42.9 Subcommittee: Automotive Steering | Jeffrey Chung |
Cadence Designs Systems | |
| JC-42.9 Subcommittee: Automotive Steering | Stephan Rosner (Co-Vice-Chair) |
Infineon | |
| JC-42.9 Subcommittee: Automotive Steering | Jinhwan Kim (Co-Vice-Chair) |
Samsung Semiconductor | |
| JC-45: DRAM Modules | Mian Quddus | Samsung Semiconductor | |
| JC-45: DRAM Modules | Bill Gervasi (Co-Vice Chair) |
Wolley | |
| JC-45: DRAM Modules | Belal Gharaibeh (Co-Vice Chair) |
HP | |
| JC-45: DRAM Modules | Frank Ross (Co-Vice Chair) |
Micron Technology | |
| JC-45.1 Subcommittee: Registered DRAM Modules | DY Lee | One Semiconductor | |
| JC-45.1 Subcommittee: Registered DRAM Modules | Scott Cyr (Vice-Chair) |
Micron Technology | |
| JC-45.1 Subcommittee: Registered DRAM Modules | Kelvin Marino (Vice-Chair) |
Smart Modular Technologies | |
| JC-45.3 Subcommittee: Unbuffered DRAM Modules | Kazuyoshi Tsukada | Memory Expert | |
| JC-45.3 Subcommittee: Unbuffered DRAM Modules | Hyunwoo Kwack (Vice-Chair) |
SK Hynix | |
| JC-45.4 Subcommittee: Fully Buffered DRAM Modules | YH Lee | Samsung Semiconductor | |
| JC-45.4 Subcommittee: Fully Buffered DRAM Modules | Joe Quddus (Vice-Chair) |
Montage Technology Co. Ltd. | |
| JC-45.5 Subcommittee: Module Interconnect | Zhineng Fan | Amphenol | |
| JC-45.5 Subcommittee: Hybrid Modules | Xiang Li (Vice-Chair) |
Intel Corporation | |
|
JC-45.7 Subcommittee: Memory Modules for CXL® |
Jonathan Hinkle | Micron Technology | |
| JC-45.7 Subcommittee: Memory Modules for CXL® | Kapil Sethi (Vice-Chair) |
Samsung Semiconductor | |
| JC-63: Multiple Chip Packages | Hung Vuong (Co-Chair) |
Qualcomm | |
| JC-63: Multiple Chip Packages | Osamu Nagashima (Co-Chair) |
Micron Technology | |
| JC-63: Multiple Chip Packages | Bo-Wei Hsieh (Vice-Chair) |
MediaTek | |
| JC-64: Embedded Memory Storage and Removable Memory Cards | Mian Quddus | Samsung Semiconductor | |
| JC-64: Embedded Memory Storage and Removable Memory Cards | Christian Gyllenskog (Co-Vice Chair) |
Micron Technology | |
| JC-64: Embedded Memory Storage and Removable Memory Cards | Rotem Sela (Co-Vice Chair) |
Western Digital Technologies | |
| JC-64: Embedded Memory Storage and Removable Memory Cards | Bruno Trematore (Co-Vice Chair) |
Kioxia Corporation | |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols | Hung Vuong (Co-Chair) |
Qualcomm | |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols | Bruno Trematore (Co-Chair) |
Kioxia Corporation | |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols | HeeChang Cho (Co-Vice Chair) |
Samsung Semiconductor | |
| JC-64.1 Subcommittee: Electrical Specifications and Command Protocols | Rotem Sela (Co-Vice Chair) |
Western Digital Technologies | |
| JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies | Mario Martinez | Netlist | |
| JC-64.2 Subcommittee: Form, Fit and Climatic/Environmental Methodologies | TBD (Vice-Chair) |
||
| JC-64.5 Subcommittee: UFS Measurement | Mohan Raj Veerasamy |
Samsung Semiconductor | |
| JC-64.7 Subcommittee: Ecosystem | HeeChang Cho |
Samsung Semiconductor | |
| JC-64.7 Subcommitee: Ecosystem | Bruno Trematore (Co-Vice Chair) |
Kioxia | |
| JC-64.7 Subcommittee: Ecoystem | Jerry Qin (Co-Vice Chair) |
Guangdong OPPO Mobile Telecommunications | |
| JC-64.7 Subcommittee: Ecoystem | Liang Yang (Co-Vice Chair) |
Vivo Mobile Communication Co. | |
| JC-64.8 Subcommittee: Solid State Drives (SSD) | David Landsman | Western Digital Technologies | |
| JC-64.8 Subcommittee: Solid State Drives (SSD) | John Maroney (Vice Chair) |
Micron Technology | |
| JC-70: Wide Bandgap Power Electronic Conv. Semiconductors | Tim McDonald | Infineon | |
| JC-70: Wide Bandgap Power Electronic Conv. Semiconductors | Laurent Guillot (Co-Vice-Chair) |
ST Micro | |
| JC-70: Wide Bandgap Power Electronic Conv. Semiconductors | Dr. Jaume Roig (Co-Vice-Chair) |
onsemi | |
| JC-70.1 Subcommittee: GaN Power Electronic Conv. Semiconductor Standards | Kurt Smith |
VisIC Technologies | |
| JC-70.1 Subcommittee: GaN Power Electronic Conv. Semiconductor Standards | Tim McDonald (Vice-Chair) |
Infineon | |
| JC-70.2 Subcommittee: SiC Power Electronic Conv. Semiconductor Standards | Dr. Jeffrey B. Casady | Wolfspeed | |
| JC-70.2 Subcommittee: SiC Power Electronic Conv. Semiconductor Standards | Dr. Peter Friedrichs (Vice-Chair) |
Infineon |