Samsung Semiconductor’s Post

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In our 9th generation V-NAND (#V9) memory, we’ve achieved a new breakthrough by using Through Cell Metal Contact (TCMC) technology, a structural innovation that allows different types of contacts to be performed in a single etching process. By improving the HARC etching process to uniformly form channel holes from top to bottom, we’ve achieved the industry’s maximum number of layers with the minimum mold thickness.  As a result, we've been able to increase storage density 1.5 times over our 8th generation V-NAND, implementing almost 1 trillion bits in a single chip while boosting operating at speeds up to 3.2Gbps. The result? V-NAND memory with 10% better power efficiency and up to 33% faster read/write speeds than the previous generation. Learn more. https://lnkd.in/g4X-76Qr

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