In our 9th generation V-NAND (#V9) memory, we’ve achieved a new breakthrough by using Through Cell Metal Contact (TCMC) technology, a structural innovation that allows different types of contacts to be performed in a single etching process. By improving the HARC etching process to uniformly form channel holes from top to bottom, we’ve achieved the industry’s maximum number of layers with the minimum mold thickness. As a result, we've been able to increase storage density 1.5 times over our 8th generation V-NAND, implementing almost 1 trillion bits in a single chip while boosting operating at speeds up to 3.2Gbps. The result? V-NAND memory with 10% better power efficiency and up to 33% faster read/write speeds than the previous generation. Learn more. https://lnkd.in/g4X-76Qr
Samsung Semiconductor’s Post
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Join Tae Han & Nixon Mathew to learn how Analog Devices’ GaN power solutions simplify the design of robust, energy-efficient, smaller-sized power systems, solving the key challenges engineers face when considering the switch from silicon FETs.
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Why is GaN-on-Diamond material the future of chip technology? 🔥 Extreme Thermal Management: Significantly reduces device self-heating, 40-60% 🔌 Record DC Power Dissipation: Handles exceptionally high power levels (56 W/mm), ⚡ Preserved Electrical Properties: Maintains critical electrical performance after Diamond deposition 📈 New Limits: Enabling Continuous Wave (CW) rather than pulsed performance at ever higher frequencies and power levels If you want to dive into the details, read our technical study 👇 https://lnkd.in/g-ScX8JK
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The world is heading into the age of gate-all-around (GAA) or nanosheet transistors. The new device is opening the door to continuous device scaling. In this Electronic Design article, Julien Ryckaert (VP Logic Technologies at imec) helps you to better understand the case in favor of the nanosheet and its unique advantages.
The Transistor Enters the Nanosheet Era
electronicdesign.com
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How Optical Module Manufacturers Improve the Reliability of Gigabit Optical Transceivers and 10 Gigabit Optical Transceivers This article will discuss in depth how to improve the reliability of optical transceivers, including material selection, production process optimization, advanced testing technology and the application of stability monitoring systems, etc. https://lnkd.in/gh_3p6nT
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Mosfet vs transistor, High voltage transistor, Mosfet circuits, transistor circuits
IRFR024NTRPBF in Reel by Infineon | Mosfets | Future Electronics
futureelectronics.com
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Millimeter wave (#mmWave) frequencies are essential for transferring more data quickly, but they also require different packaging #technology to minimize loss and drift. That opens up a number of tradeoffs around Antenna in Package (AiP), Antenna on Package (AoP), flexible #circuits, and different substrates. This #techtalk by Curtis Zwenger, VP, of Engineering and Technical Marketing at Amkor Technology, Inc. discusses the many new challenges ranging from over-the-air testing and #crosstalk to impedance matching. Watch it here https://lnkd.in/ga2eskxj #advancedpackaging #5G #6G #crosstalk #semiconductor #wirelesscommunications #semiconductors #semiconductorindustry #antenna #antennas #AiP #engineering #packaging #wireless #5gtechnology #webinar #tech #electronicsengineering
Challenges In Packaging 5G And 6G
https://semiengineering.com
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GAAFET (Gate all-around field effect transistor) devices will soon enable new levels of standby performance for mobile devices, compared to FinFETs: “One very significant benefit is the power draw. A 2020 study found that when it is turned off, a nano sheet gate all around transistor draws 20-35% less power than a FinFET depending on the device’s dimensions.” https://lnkd.in/gb5--VXb
The Gate-All-Around Transistor is Coming
https://www.youtube.com/
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PhD Candidate (III-Nitride Wide Band-gap Devices(Opto/electronics) Design, Epitaxy and Fabrication) at The Ohio State University
Happy to share our recent work on a tunnel junction-based GaN micro-light emitting transistor (uLET) that offers a voltage/capacitive control scheme for GaN uLEDs with reduced switching charge. The monolithic integration of an n-channel GaN FET structure on top of a standard Ga-polar LED+TJ structure allows the FET channel charge to control the current into the LED active region. This three-terminal device enables direct optical modulation of the uLED through gate voltage control. The monolithic approach can be applied to standard GaN uLEDs of any wavelength, polychromatic structures, or any number of active region LEDs. While microLED displays benefit from this technology, Li-fi/VLC or on-chip communication systems can also leverage the increased switching speed of the devices. I extend my gratitude to my supervisor Siddharth Rajan, my labmates, and our collaborators for their support in this project. #microLED #display #uLET For more details on the device's performance, check out our published article:
Tunnel junction-enabled monolithically integrated GaN micro-light emitting transistor
pubs.aip.org
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Power mosfet, mosfet gate, Transistor switch, bjt transistor, Mosfet circuits
IRFR024NTRPBF in Reel by Infineon | Mosfets | Future Electronics
futureelectronics.com
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Opto coupler, High voltage optocoupler, transistor opto, high speed optocoupler
ILD207T in Reel by Vishay | Isolation Components / Optocouplers | Future Electronics
futureelectronics.com
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