Chromasens GmbH’s Post

Surface Mount Technology (SMT) has revolutionized the electronics industry, becoming the backbone of modern electronic manufacturing. The ability to mount components directly onto the surface of a printed circuit board (PCB) allows for more efficient and streamlined designs. However, in an increasingly complex and demanding industry, traceability within the SMT process is crucial..#oppo #smt #techonology

Changing the printed circuit board (PCB) on your AT500 Wind Sensor, or B&G 213 Wind Sensor, is a simple process. Our new video shows exactly how to change your PCB: https://lnkd.in/e2cfJMyF #aandt #aandtinstruments #marineelectronics #marineindustry #marineequipment #marinetechnology #marinehardware #nauticalinstruments #windsensor

ENIG Impedance BGA TG180 project Automotive Industry Insight: High-level printed circuit boards play a critical role in modern vehicles, enabling advanced functionalities. Understanding their design and integration enhances vehicle performance and safety. #ENIGImpedance #holeboard #PCB #AutomotiveIndustry #electronics https://buff.ly/3sG59Cd

ENIG Impedance BGA TG180 project Automotive Industry Insight: High-level printed circuit boards play a critical role in modern vehicles, enabling advanced functionalities. Understanding their design and integration enhances vehicle performance and safety. #ENIGImpedance #holeboard #PCB #AutomotiveIndustry #electronics https://buff.ly/3sG59Cd

Microwave Technology designed and fabricated S-Band demodulator circuit is shown. The circuit employs an Analog devices demodulator device and has been realised on a multi-layer printed circuit board.   #rfengineering #microwaves #pcbdesign #multilayerpcb

Non galvanic PCB feeding method of cavity filters In mobile cellular communications, coaxial cavity filters are often the only choice due to the demanding performance requirements such as power handling capability and high Q-factors, but also due to the design freedom in terms of resonator shaping, impedance profile choice and implementation of transmission-zeros. Over the last decades, large effort has been invested into size reduction of air-filled cavity filters, but also towards improved integration of filters with the remainder of the transceiver circuitry: the PA is usually mounted on a Printed Circuit Board (PCB), whereas the coaxial cavity RF filter is made out of an aluminum block. 

💥 Flexible Printed Circuit Assembly (#FPCA) & Printed Circuit Board Assembly (#pcba) projects often have stringent requirements that can be challenging to achieve. 💥This is particularly true when incorporating surface mount components such as Ball Grid Array, Land Grid Array, Chip Scale Package, and MEMS devices like microphones for the mobile market. This is due to hidden solder pads located on the package substrate. ✔ Because PICA Manufacturing Solutions recognizes & welcomes challenges, we are fully prepared & equipped with "in-house" X-ray Inspection Capabilities! Checkout our new blog & discover how X-ray inspection can be an advantage for your next project! ▶ https://lnkd.in/dKabDBX9 #xrayinspection #pcb #pcbassembly #pcbmanufacturing #bga #lga #csp #mems #soldering #3dscanning #aoi #qualitycontrol #smt #failureanalysis #productivity

🌟 Surface Mount Technology (SMT) revolutionized the world of electronics by offering a cutting-edge method to affix electronic components directly onto the surface of printed circuit boards (PCBs). Superseding the conventional through-hole approach, SMT not only allows for greater component density but also paves the way for more streamlined and rapid electronic device assembly. ⚡ 🌐 This innovation is pivotal in crafting today's compact and high-performance gadgets. #smt #surfacemounttechnology #throughhole #pcb #electroniccomponents #soldering #electronicsevolved #moderncircuitry

#PCB Manufacturing In the fast-paced world of #electronics manufacturing, the quest to create #groundbreaking products hinges on the optimization of Printed Circuit Board Assembly (#PCBA) processes. https://lnkd.in/gP9tu_vn

Chip package refers to connecting the circuit pins on the silicon chip to external connectors with wires so as to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the pins of the package shell with wires through the contacts on the chip. These pins are connected to other devices through wires on the printed circuit board, so as to realize the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, packaged chips are also easier to install and transport. Since the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) connected to it, it is very important. #chip #ic #component #semiconductor #pakage