Geun Ho Ahn

Thanks Yan for sharing our latest report! "From #Semiconductor to High Tech #Manufacturing to traditional manufacturing, Taiwan's businesses have been adept to leverage on technology to drive productivity and identify new product opportunities via #AI." Get your AI insights today ✅ https://lnkd.in/gJj663iA

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#Perovskites are the subject of intense research in the #solar energy field and represent one of the most researched topics in materials science. Recently, a #PolyU research team led by Prof. LOH Kian Ping, Chair Professor of Materials Physics and Chemistry and Global STEM Professor of the Department of Applied Physics, PolyU, Dr Kathy LENG, Assistant Professor of the same department, together with Dr Hwa Seob CHOI, Postdoctoral Research Fellow and the first author of the research paper, has created 2D all-organic perovskites, marking a breakthrough to a new field. The advantage of 2D all-organic perovskites is that they can be solution-processed in conjunction with advanced fabrication techniques to enhance the performance of 2D electronic devices, enabling cost-effective fabrication. These developments open up new possibilities for the creation of more efficient and versatile electronic systems. #PolyUResearch #MaterialsScience #Perovskite #2DAllOrganicPerovskites

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🌟Exciting News: Welcoming Prof. Jun Li as Our Company Advisor!🌟 We are thrilled to introduce Prof. Jun Li, a distinguished researcher from Tsinghua University and our esteemed advisor at SinoAfrica Shield. About Prof. Jun Li: Prof. Li graduated from the Department of Automation at Tsinghua University, earning his Bachelor's and Master's degrees in 1985 and 1988, respectively. In 1992, he pursued further studies in the United States and obtained his Ph.D. in Computer Science from the New Jersey Institute of Technology (NJIT) in 1997. Prof. Li's research and teaching focus primarily on network security, pattern recognition, and image processing. He has participated in numerous significant research projects both domestically and internationally, including CAFIS (China Automated Fingerprint Identification System), M-WIP (Multi-Wavelength Infrared 2D Temperature Measurement System), and 10Gbps UTM (10-Gigabit Unified Threat Management System). He led the development of a modular line-rate security gateway, resulting in a product that generated economic benefits in the global market and spurred the development of UTM security gateway products. He also spearheaded the 863 Program project “Integrated Network Data Deep Security Detection and Analysis Technology and System,” surpassing contractual requirements. His project on hierarchical, parallel, and intelligent network flow monitoring algorithms and technologies won the 2014 Science and Technology Award from the China Institute of Electronics. Throughout his career, Prof. Li has authored and translated three textbooks, published over 100 academic papers, and holds 5 U.S. patents and more than 20 Chinese invention patents. He has served as a sub-chair and TPC co-chair for IEEE and SPIE international conferences and is the current Vice Chairman of the China Institute of Electronics' Computer Engineering and Applications Division. Before studying in the U.S., Prof. Li was the Assistant Director of the Department of Automation at Tsinghua University. In the U.S., he served as President of the Tsinghua Alumni Association of Northern California and worked as a senior software engineer at EXAR and TeraLogic. In 1999, he co-founded ServGate in Silicon Valley. After returning to Tsinghua University in 2003, he held various leadership roles, including Dean of the Institute of Information Technology, Executive Vice Dean of the School of Information, and Executive Deputy Director of the Tsinghua National Laboratory for Information Science and Technology. He continues to serve on the boards and as an advisor to multiple companies worldwide. #CyberSecurity #NetworkSecurity #AI #Innovation #Leadership #TsinghuaUniversity #Research #Technology #SinoAfricaShield #TechAdvisor #CyberDefense #DigitalSecurity #Africa #China #Startup #InvestInTech #TechLeadership #FutureTech #NJIT #NewJerseyInstituteOfTechnology #Advisor #Africa #China #Sino #Security #Professor

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TSMC sets up factory in Germany to "revitalize European semiconductors", putting talent and salary to the test TSMC recently set up a factory in Germany to revitalize the European semiconductor industry, attracting attention from European companies and international media. While this move is seen as a positive development, challenges such as manpower shortage, wages, and labor unions are expected. The establishment of the new factory is seen as a milestone in the global technology ecosystem, with a focus on cooperation with European technology startups and attracting young talent from all over Europe. Concerns about manpower shortage are being addressed through internship programs and competitive salaries. The focus is also on understanding local labor ecology and culture when setting up overseas factories and joint ventures. With a combination of Europes strengths in green carbon reduction and Taiwans semiconductor design and manufacturing expertise, there is potential for producing green energy chips with lower energy consumption. #Semiconductors #Taiwan https://lnkd.in/gHmX6Wsc

鈣鈦礦材料具備極佳的光電性能，可以廣泛應用於太陽能電池、照明、催化等範疇。由應用物理學系的材料物理與化學講座教授兼傑出創科學人教授羅健平教授、助理教授冷凱博士領導的研究，聯同博士後研究員及該研究論文第一作者崔華燮博士成功研發出嶄新的全有機二維鈣鈦礦，為二維材料的領域帶來突破性的發展。 全有機鈣鈦礦比全無機鈣鈦礦更具優勢，因為有機鈣鈦礦可透過溶液加工處山理，製造技術亦具成本效益。這項發展為創建高效的電子系統開闢了全新的可能性，有關的研究結果已刊登於國際學術期刊《科學》（Science）。 了解更多：https://polyu.hk/bACOY Perovskite materials have excellent photoelectric properties that can be applied in wide-ranging fields such as solar cells, lighting and catalysis. PolyU Science research team led by Prof. Loh Kian Ping, Chair Professor of Materials Physics and Chemistry and Global STEM Professor, Dr Kathy Leng, Assistant Professor of the Department of Applied Physics, together with Dr Hwa Seob Choi, Postdoctoral Research Fellow and the first author of the research paper, have successfully synthesized a new class of 2D all-organic perovskites, signifying a breakthrough into a new field of 2D materials.   The 2D all-organic perovskites offer distinct advantages over their all-inorganic counterparts, as they are solution-processible and enable cost-effective fabrication. These developments opened up new possibilities for the creation of more efficient electronic systems and were published in the prestigious journal Science. Learn more: https://polyu.hk/Ydffg #香港理工大學 #理學院 #理大科研 #有機鈣鈦礦 #二維材料 #PolyU #PolyUResearch #PolyUScience #PolyUScience_Research #Perovskites #2Dmaterials 

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https://lnkd.in/gAgekpTH AMD working with TSMC on 3nm chips, says Lisa Su. #amd #tsmc #Semiconductorindustry #electronics #semiconductor #technology #innovation #business #supplychain #engineering #manufacturing #computerchips #semiconductors #chips #chipmaker #foundry credit: digitimes

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https://lnkd.in/gMKubMnW [#Gram Schmidt's orthonormalization method (3) QR decomposition? #Statistics] #Linear Algebra #Mathematics #Understanding Science #Tsurumaki Maki (3) By performing QR decomposition using Gram-Schmidt orthonormalization, complex calculations such as matrix diagonalization and determinant calculation become easier.   【#グラムシュミット の正規直交化法(3) QR分解? #統計学 】 #線形代数 #数学  #わかりみサイエンス  #ツルマキマキ グラムシュミットの正規直交化法を用いてQR分解することにより、行列の対角化や行列式の計算など、複雑な計算が簡単になります。

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In a paper published in Advanced Materials by #PKU Prof. Pan Feng's team, the essential role of Li content on the topological inhibition of oxygen loss in lithium-rich cathode materials and the relationship between the migration network of oxygen ions and the transition metal (TM) component are revealed. #PKUResearch

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Nvidia, Qualcomm, AMD, others are considering raising prices due to the tight supply of TSMC 3nm manufacturing technology for their AI chips, media report, adding 7 major chip designers in all (Intel, Apple, MediaTek, Google) are vying for TSMC’s 3nm capacity. The report says yield issues at Samsung have hampered its 3nm efforts, leaving customers with nowhere else to go but TSMC. It is also pointed out that the cost per wafer of 3nm is about 25% more expensive compared with 5nm. Many AI products will be launched in the consumer market in the H2 of the year. Among them, the top three mobile phone chip market players, Qualcomm Snapdragon 8 Gen 4, MediaTek Dimensity 9400, and Apple A18 and M4 series will all be built using TSMC's N3 family. In addition, Google's Tensor G5 will compete in the market. It is bound to be the same as AI GPU chips. Whoever has the production capacity will win the world. According to media reports citing supply chain rumors, due to the high production cost of TSMC's 3nm process, Qualcomm will increase the price of its flagship Snapdragon 8 Gen 4 chip to more than US$250 per unit, while the price of the Snapdragon 8 Gen 3 chip produced using the 5nm process last year was US$200. It is said that 3nm wafers are about 25% more expensive than 5nm wafers. Semiconductor/Drone Broker: YM Innovation Technology (Shenzhen) Co.,Ltd Tel: 86-159 1983 2063 (Wechat/Whatsapp) Email: semibroker@foxmail.com chipspotbroker@gmail.com https://lnkd.in/gAVEVNMU

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Welcome to #UPWARDS for the Future! The University of Washington is leading an international group in #semiconductor research and workforce development. Part of a landmark partnership announced last May at the G7 meeting in Japan, the effort brings together researchers and faculty from the U.S. and Japan to support the University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future project. Modern technology — including household appliances, automobiles, computers and defense systems — relies on semiconductors. The semiconductor was invented in the U.S., yet today the U.S. produces about only 10% of the world’s supply. As a response to 2022’s #CHIPSandScience Act, UPWARDS for the Future seeks to innovate the semiconductor industry while building a skilled U.S.-based workforce. “As Washington state’s leading educator of engineers and a leader in chip engineering and workforce development for the global innovation economy, it is an honor to work collaboratively with academic and industry partners Micron Technology and TOKYO ELECTRON LIMITED to drive advancements in this crucial scientific field.” - UW College of Engineering Dean Nancy Allbritton Learn more: https://lnkd.in/gzvh9JbN

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Share some useful #term and information for you!! 📃 News: 傳承光電COMPUTEX展出液冷機櫃解決方案 #傳承光電 #COMPUTEX #液冷機 https://lnkd.in/gUQU6Zxz #散热 #Heat Dissipation: Heat dissipation is a measure taken to keep electronic devices cool. Common methods of heat dissipation include the use of heat sinks, fans, and other devices to transfer heat out of the device. #浸没式 #Immersion Cooling: Immersion cooling is a method of completely submerging electronic devices in a liquid cooling medium to dissipate heat. This technique can more effectively absorb and transfer heat to keep the device's temperature within a safe range. #浸入式解决方案 Immersion Solutions: Immersion solutions may include various methods of submerging devices in liquid for purposes beyond heat dissipation, such as immersion sensors or displays. In the context of spectrometers, immersion solutions can contribute to maintaining stability and performance by effectively managing heat generated by optical components and electronic devices. If you have any new project need #spectrometers or #spectral #measurement #solutions, feel free to contact us. https://lnkd.in/e66aKWb9 joy.chien@otophotonics.com #OtOPhotonics #ImmersionSolutions #ImmersionCooling

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CPES Researchers win the 2023 IEEE EDS George E. Smith Award! Ming Xiao is lead author on the paper which won the George E. Smith Award - https://lnkd.in/gyvrTf8. “Robust Avalanche in 1.7 kV Vertical GaN Diodes with a Single-Implant Bevel Edge Termination” is available through IEEE - https://lnkd.in/egCR6k58. The article appeared in the October 2023 issue of Electron Device Letters (EDL) and was selected by the IEEE Electron Devices Society from almost 500 papers published in the journal in 2023. This prestigious award signifies a strong endorsement of the high quality of the research being reported. Co-authors are Yifan Wang, Ruizhe Zhang, Qihao Song, Matthew Porter, Eric Carlson, Kai Cheng, Khai Ngo and Yuhao Zhang. The award will be presented at the IEEE International Electron Devices Meeting (IEDM) in San Francisco, CA. Congratulations to all authors! #CPES #galliumnitride #GaN #semiconductordiodes #junctionterminationextension

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