Onto Innovation

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The 2024 SPIE Optics and Photonics exhibition is just a few weeks away, and 4D Technology will be there as an exhibitor at the “leading multidisciplinary optical sciences and technology meeting.” At the exhibition, the 4D team will showcase a number of products, including the new AccuFiz Duo, a short and long coherence Fizeau interferometer. To learn more about the AccuFiz Duo, please visit: https://lnkd.in/eBJY_Gre.

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In just a few weeks, the 4D Technology team will be at the 2024 Space and Missile Defense Symposium in Huntsville, Alabama. Stop by Booth #N309 to learn about our 4D InSpec surface gauge, the first handheld precision instrument for non-contact surface defect measurement, and our line of PhaseCam interferometers, which are used for measuring the surface shape and transmitted wavefront quality of optical components, assemblies, systems and optical-grade mechanical surfaces. To learn more about the symposium, visit: https://smdsymposium.org/. For more on 4D Technology, go to: https://4dtechnology.com/.

SEMICON West 2024 is off to a good start in San Franciso, California, and the Onto Innovation team is there. Stop by Booth #633 to learn about our portfolio of integrated process and process control solutions and how they are being used to support our customers’ ramp of AI products. The Onto team is showcasing a selection of our technologies enabling advanced packaging, including lithography for next generation AI and chiplet designs employing cutting-edge panel-level production technologies (CCL and glass handling) and unique 3D metrology and inspection capabilities in support of next generation bump technologies. In addition, the team is ready to discuss metrology solutions for advanced node logic (CPU/GPU) and memory (HBM, DRAM and NAND) applications, and a range of technologies for the production of specialty devices, including those for GaN and SiC, powering the advanced automotive market and electric vehicles. To schedule a customer meeting, please contact Onto at info@ontoinnovation.com. To learn more about Onto, please visit: https://lnkd.in/eWuWEgq8.

🔴 Onto Innovation Further Strengthens Company’s Panel Portfolio with New Glass Suite 🔵 Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Onto Innovation Inc. today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling capabilities and the Firefly® G3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced IC substrates (AICS). The JetStep X500 and Firefly G3 systems offer customers a complete panel-level packaging solution supporting heterogeneous integration (HI) chiplet packages for AI, high performance compute and cloud computing. The AICS market is expected to increase at a compound annual growth rate of 10% from 2023 to 2028, according to Prismark. “The hybrid substrate handling capabilities of the JetStep X500 system demonstrate Onto Innovation’s commitment to continually improving our portfolio of panel-level products to meet cutting edge technological advances,” says Jason Robinson, vice president and general manager of Onto’s lithography business. “With the capability for sub-1.5µm l/s RDL resolution and the ability to expose panel areas of up to 250mm x 250mm in one shot, the JetStep series delivers an advanced packaging solution that meets the needs of today’s organic substrates and the glass substrates powering the next evolution in highly advanced HI packages.” In addition to evolving lithographic requirements, the production of glass substrates generates several significant process control challenges attributed to cracks and chips and as a result of handling, through glass via (TGV) formation and the Cu plating process. Customers require 3D metrology solutions focused on TGVs, such as the need to measure via-to-via distance and via diameter for top, waist and bottom. “The Firefly G3 system is capable of supporting a range of panels and substrate types with sensitivity below 1µm, making it an extremely versatile investment for our customers,” says Mayson Brooks, vice president and general manager of Onto’s inspection business. “That versatility has led to a broad range of customers selecting the Firefly G3 system, along with the JetStep X500, for their next expansions, further positioning Onto Innovation for continued growth in the advanced packaging panel-level packaging market.” To learn more about Onto’s glass panel suite, visit our booth #633 at SEMICON® West, contact us or reach out to your local sales team. To read the press release in full, please visit: https://lnkd.in/ebdR46Xg.

SEMICON West starts today in San Francisco, and attendees will find the Onto Innovation team at Booth 633 in the South Hall of Moscone Center. In addition, Onto software expert Prasad Bachiraju will present Achieving Zero Defect Manufacturing in Semiconductor Fabs on Wednesday, July 10, at 11 a.m. PT in Moscone South at the Smart Manufacturing Pavilion Stage. And Onto’s HC Chi will present Using Deep Learning ADC for Defect Classification for Automatic Defect Inspection on the TechTALKS stage, Thursday, July 11, at 2:35 p.m. PT in Moscone South, Exhibition Level, Room 7. Onto Innovation invites customers to our booth to learn about the Company’s latest portfolio of integrated process and process control solutions being used to support its customers’ ramp of AI products. To schedule a customer meeting, please contact Onto at info@ontoinnovation.com.