MacDermid Alpha Electronics Solutions

Introducing a better way to stay connected with our new Life Pages! Our solutions can be found at every level of electronics manufacturing, from wafer fabrication to final device assembly and complemented by smart surface films and in-mold electronics solutions. That’s why we've created a seamless experience to showcase our latest technology advancements and industry trends. Stay up-to-date on news and connect with our experts in your preferred segment of electronics manufacturing: Circuitry Solutions: https://lnkd.in/eC6-gYwa Semiconductor Assembly: https://lnkd.in/e6VwA2Na Wafer Level Packaging: https://lnkd.in/e-FbbcWP Circuit Board Assembly: https://lnkd.in/eskBryX7 Film & Smart Surfaces: https://lnkd.in/eB5tk-qS Explore our Life Pages and discover how our comprehensive solutions are revolutionizing the #electronics manufacturing industry! #PCB #Circuitry #PCBassembly #WaferLevelPackaging #Semiconductor #Assembly #CircuitBoardAssembly #SmartSurfaces #InMoldElectronics #ElectronicsManufacturing

Enhancing reliability for high-density #circuitboard designs and ensuring the highest levels of PCB fabrication quality are key concerns for PCB manufacturers. Don’t miss our three technical papers covering #metallization, #finalfinishes and oxide replacements at the Thailand Electronics Circuit Asia expo from July 24-26 at the Bangkok International Trade & Exhibition Centre. Visit the main stage at 13:15 each day of the expo to listen to our expert presentations:    Carmichael Gugliotti, Product Manager for Primary Metallization, will present ‘A Comprehensive Study of the Interaction Between Direct Metallization and Electrolytic Copper’ on July 24, from 13:15 to 14:00.    Frank Xu, Ph.D., Global Product Manager – Final Finishes, will present ‘Achieving a Successful ENIG Finished PCB Under Revision A of IPC 4552’, on July 25, from 13:15 to 14:00.    Bruce Lee, Technology Manager – Electronics Packaging, will discuss the ‘Technology Road Map to Oxide replacement’ on July 26 from 13.15 to 14:00.    Connect with our experts to discover how our range of precise, reliable, and high-performance solutions as well as our superior technical expertise and support make MacDermid Alpha the solutions supplier of choice for #PCB manufacturers.    For more information and to register for the event please visit: https://lnkd.in/ecth98ZA    #thailandelectronicscircuitasia #printedcircuitboard #electronicsmanufacturing #directmetallization #finalfinishes 

The electronics vehicle manufacturing landscape, especially in semiconductor production, is fraught with increasing complexities. In turn, our product's innovative approach and commitment to science and advancement are poised to address challenges. “Argomax materials form high purity silver bonds (from diffusion sintering between particles and interfaces) that have a high melting point and enable elevated temperature performance of SiC devices in EV inverters. The small, uniformly distributed porosity is proven for mitigating the stress between layers and demonstrates an improvement ten to fifteen times within the area of thermo-mechanical and power cycling reliability, compared to other materials.” - Clark Dai, EV Technology Market Manager Discover what else Clark has to say about how MacDermid Alpha is redefining the possibilities for OEMs in this interview article here: https://lnkd.in/e8UfeUbH

We at MacDermid Alpha & our colleagues from MacDermid Enthone Industrial Solutions had the pleasure of hosting a meeting for the German Association of the Automotive Industry (VDA) e.V. in June. The "Materials Hardware Delta Qualification" project group, led by Thomas Zettner from Continental #Automotive Technologies GmbH, met in Langenfeld to discuss various VDA topics. Participants were representatives from various OEMs and Tier1s of the automotive and electronic supplier industry, as well as the representative of the VDA, Mr. Shrinag Shettigar. Our experts were able to provide the project group with impressive technical information on topics like #solder materials, #sintering technology for high-performance #electronics, #PCB technology, protective coatings, potting materials, thermal interface materials (TIMs), #metallization of connectors, and metallization for heat sinks. This was a great way for our experts to help shape and improve industry technology standards and make professional recommendations!

Manufacturing, particularly in semiconductor production, is rife with complexities that continue to intensify. Silver sintering aims to address this issue. We bring forward innovative technology that enhances EV performance and drives the expansion of eco-friendly and sustainable automotive solutions.    “The discussion and issue around ‘space’ for inverters center on the EV manufacturers need for multiple functions and components in one space to increase functional integration for the traction systems. Therefore, this one space needs structural stability, thermal design, and protection from electromagnetic interference (EMI).     So, it’s very complex, but this offers an opportunity for our technology as it addresses these challenges.  For example, as mentioned above, our Argomax enables more power, reduces heat and manages stress in the assembly process.”    -Clark Dai, EV technology market manager Discover what else Clark has to say about how MacDermid Alpha is redefining the possibilities for OEMs in this interview article here: https://lnkd.in/ePgQSU7j

There are two major trends having a direct impact on #PCB manufacturing. At the design stage: #miniaturization and enhanced device functionality place increasing demand on the materials used in their fabrication. Second, the supply chain is rapidly evolving as #electronics manufacturing continues to grow. Therefore, it is more important than ever for #PCBmanufacturers to work with trusted suppliers that can deliver solutions to meet both these design and supply chain challenges.    Connect with our experts at the Thailand Electronics Circuit Asia Expo to discover our advanced solutions for complex PCB designs including direct metallization and high-performance final finishes, as well as our unsurpassed global supply chain expertise and technical support.    Visit us at booth B20 from July 24-26 at the Bangkok International Trade & Exhibition Centre. Discuss with our experts how our range of precise, reliable, and high-performance solutions combined with our manufacturing capabilities and technical expertise make MacDermid Alpha the solutions supplier of choice for PCB manufacturers.    For more information on the event please visit: https://lnkd.in/ecth98ZA   #thailandelectronicscircuitasia #printedcircuitboard #electronicsmanufacturing #directmetallization #finalfinishes

It can be difficult for chip manufacturers source the right high purity materials in their supply chain to meet their performance goals. Introducing Kester Indium Thermal Interface Materials (TIMs) — Redefining Performance and Reliability in Chiplet Production. Explore the benefits of our cutting-edge thermal interface materials: ◼ High Purity Materials and Advanced Production Processes: Leveraging the latest technology to ensure top quality. ◼ Unmatched Final Yields and Reliability: Featuring innovative low-voiding capabilities and unique flux chemistries that guarantee exceptional performance. ◼ Versatile Preform Geometry and Packaging: Offering a wide range of configurations to meet diverse application needs with excellent flexibility. ◼ Superior Mechanical Strength and Wetting Abilities on various metallizations, including Gold (Au) and Silver (Ag). ◼ Broad Processing Adaptability: Compatible with a wide range of reflow profiles. Elevate your #thermalmanagement solutions in chiplet production with Kester Indium — where excellence has no limits. For more information on Kester Indium TIMs: https://lnkd.in/ed4xnSqt

Did you know that bottom-terminated components (BTCs) account for up to 20% of devices on assembly boards, representing a significant role in electronic manufacturing? Considering their substantial presence, addressing BTC voiding levels is crucial for optimal heat dissipation, system reliability, and the mechanical integrity of solder joints in electronic assemblies. Voiding impedes heat transfer from critical components and increases the risk of premature failure due to thermal cycling and mechanical stress. Therefore, reducing voiding levels is essential to ensuring long-term performance and reliability across various operating environments.     Our zero-halogen ALPHA® OM-362 solder paste and AccuFlux® BTC-578 preforms offer repeatable low void performance (to <10%). OM-362 features exceptional wetting down to 180µm apertures.  Moreover, AccuFlux preforms offer standard sizes down to 1.4mm square.     Learn more about how our integrated solutions can enhance your assembly process with our robust, low-void solder joints, enabling optimized performance.    ALPHA® OM-362 solder paste: https://lnkd.in/ePpvd2bK    AccuFlux® BTC-578 preforms: https://lnkd.in/e_aP2v3k

Hermetic packages and modules, housing cutting-edge microelectronics, can emit potentially harmful H2, H2O, CO2, and other substances over time. Our innovative technologies are here to safeguard against such risks, preserving device functionality and component integrity. Our STAYDRY® products are engineered to exceed the toughest industry standards and ensure hermetic package manufacturers achieve unparalleled security and peace of mind. Our solutions meet the stringent reliability benchmarks such as JEDEC, MIL STD 883, and even NASA's demanding outgassing requirements. Count on us to elevate your reliability standards to new heights, endorsed by JEDEC, MIL specifications, and Bellcore certifications! To learn more, visit: https://lnkd.in/eGR-9c6y

Changes within the #automotive world are set to redefine every facet of mobility. One area which has seen huge development is vehicle connectivity. This has the potential to deliver significant safety, efficiency, and convenience benefits. In her latest article Lenora Clark, Director of Autonomous Driving and Safety Technology, discusses the impact of this transformation of the entire #mobility ecosystem. For example, advanced intelligent technology has the potential to significantly reduce the number of road traffic incidents. For us to truly benefit from what vehicle safety systems can offer, we need components and materials that can accommodate the demands that advanced applications will place on them. As a technical expert, Lenora stresses the criticality of material fractures in vehicle safety hardware, and the potential impact of even a single material failure. Read Lenora’s latest article on the importance of selecting high-quality materials in vehicle safety hardware: https://lnkd.in/gX_NeyGA