Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI and HPC.

MediaTek, a leader in consumer electronics and communications, is looking to establish itself as a key player in the smart car and Electric Vehicle (EV) ecosystem while deepening its deployment in automotive AI applications, according to Roy Chen, a staff aide to the company's co-COO.

Samsung Electronics is making significant strides with its next-generation mobile application processor, the Exynos 2500. Despite initial reports of low yield rates, recent industry updates suggest substantial progress. The success of this chip could be a turning point for Samsung's wafer foundry and System LSI businesses, particularly if it secures a place in the Galaxy S25 series smartphones.

Samsung Electronics is reportedly adjusting its investment pace and postponing the construction of the wafer foundry line at its Pyeongtaek Plant 4 (P4) due to difficulties in securing major foundry customers.

Singapore is preparing additional land and boosting amenities to draw more semiconductor wafer fabs.

As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing next-generation memory solutions, including vertically stacked 4F square structure DRAM and 3D DRAM, to meet these evolving needs.

As Taiwan-based suppliers hone in on opportunities in edge AI applications, power semiconductor manufacturer Force-MOS has eyed personalized AI computing on edge devices with its proactive planning for USB PD3.1 components, which are expected to contribute to revenue in 2025 as shipments begin.

MediaTek has issued a statement confirming that Huawei has filed a lawsuit against the company. This legal action may indicate a significant shift in Huawei's approach to patent licensing.

Glass processing service provider G-Tech Optoelectronics (GTOC) has reported strong sales growth for the second quarter of 2024, driven by automotive applications.

Mobile phone manufacturers are concerned about the increasing competition among chip vendors for advanced process capacity, despite the more optimistic demand forecasts.

C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies at its investor's conference on July 18. Wei also addressed the current shortage of CoWoS packaging, which is anticipated to be alleviated by the end of 2025.