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For questions about what causes components to fail, how to prevent component failure, and component failure modes (e.g. fail open or fail short).

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Failures on underside layers of a chip in IGBT power modules

Does somebody know how I can detect a layer of IGBT modules in which a thermal failure, e.g., voids, cracks, delaminations of solder joints, has taken place? We know there is fatigue in both solder jo …
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