Will placing a copper polygon/zone over multiple (same-net) surface-mount (SMT) pin-pads create any thermal issues with the solder, (for example, paste not sufficiently heating up)?

Solder mask will still keep individual pins separate, where there is sufficient pin-to-pin clearance (pin pitch).

For example, pins 48 and 49

Will placing a copper polygon/zone over multiple (same-net) surface-mount (SMT) pin-pads create any thermal issues with the solder (for example, paste not sufficiently heating up)?

The solder mask will still keep individual pins separate, where there is sufficient pin-to-pin clearance (pin pitch).

For example, pins 48 and 49:

Will placing a copper polygon/zone over multiple (same-net) surface-mount (SMT) pin-pads create any thermal issues with the solder, (for example, paste not sufficiently heating up)?

Solder mask will still keep individual pins separate, where there is sufficient pin-to-pin clearance (pin pitch).

Will placing a copper polygon/zone over multiple (same-net) surface-mount (SMT) pin-pads create any thermal issues with the solder, (for example, paste not sufficiently heating up)?

Solder mask will still keep individual pins separate, where there is sufficient pin-to-pin clearance (pin pitch).

For example, pins 48 and 49