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ocrdu
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tolerance Tolerance of board to board-to-board headers

I am designing a 2 board , thetwo boards. The bottom one is the power board that contains power switches on IMS (metal clad-clad board)  , while the board on the top board is the logic board (4-layer FR4). boardBoard to board height is about 0.5".

theThe connection of signals from Toptop to bottom is through a 2.0mm0 mm dual row pin header.

  • the number of headers is about 20pcs20 pcs of 2x2 arranged in 16mma 16 mm x 20mm20 mm grid.
  • On the bottom board the only option is an SMD male Pin Headerpin header.
  • On the logic board I have multiple options: TH on the bottom layer  , or SMD on bottom layer or SMD on the top layer with holes (the female header is made for variable board heightheights).

Problem: Since there is a high number of connections I am worried about soldering tolerance which might cause the 2-boardtwo boards to not mate correctlyincorrectly.

Question1: Question 1: which of the 3three options offor female headers would be more suitable ( II am thinking SMD is better since it has less play during soldering).

Question2: Question 2: If no solution would give the required tolerance for all the headers to mate  , should I consider reducing the number of headers ? (knowing that the layout and performance will be worse)?

Any reference or guidance to where such information can be learned is highly appreciated.

tolerance of board to board headers

I am designing a 2 board , the bottom is power board that contains power switches on IMS (metal clad board)  , while the board on the top is logic board (4-layer FR4). board to board height is about 0.5".

the connection of signals from Top to bottom is through 2.0mm dual row pin header.

  • the number of headers is about 20pcs of 2x2 arranged in 16mm x 20mm grid.
  • On the bottom board the only option is SMD male Pin Header.
  • On logic board I have multiple options TH on bottom layer  , or SMD on bottom layer or SMD on top layer with holes (the female header made for variable board height)

Problem: Since there is a high number of connections I am worried about soldering tolerance which might cause the 2-board to not mate correctly.

Question1: which of the 3 options of female headers would be more suitable ( I am thinking SMD is better since it has less play during soldering).

Question2: If no solution would give the required tolerance for all the headers to mate  , should I consider reducing the number of headers ? (knowing that the layout and performance will be worse)

Any reference or guidance to where such information can be learned is highly appreciated.

Tolerance of board-to-board headers

I am designing two boards. The bottom one is the power board that contains power switches on IMS (metal-clad board), while the top board is the logic board (4-layer FR4). Board to board height is about 0.5".

The connection of signals from top to bottom is through a 2.0 mm dual row pin header.

  • the number of headers is about 20 pcs of 2x2 arranged in a 16 mm x 20 mm grid.
  • On the bottom board the only option is an SMD male pin header.
  • On the logic board I have multiple options: TH on the bottom layer, or SMD on bottom layer or SMD on the top layer with holes (the female header is made for variable board heights).

Since there is a high number of connections I am worried about soldering tolerance which might cause the two boards to mate incorrectly.

Question 1: which of the three options for female headers would be more suitable (I am thinking SMD is better since it has less play during soldering).

Question 2: If no solution would give the required tolerance for all the headers to mate, should I consider reducing the number of headers (knowing that the layout and performance will be worse)?

Any reference or guidance to where such information can be learned is highly appreciated.

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Eng Sam
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tolerance of board to board headers

I am designing a 2 board , the bottom is power board that contains power switches on IMS (metal clad board) , while the board on the top is logic board (4-layer FR4). board to board height is about 0.5".

the connection of signals from Top to bottom is through 2.0mm dual row pin header.

  • the number of headers is about 20pcs of 2x2 arranged in 16mm x 20mm grid.
  • On the bottom board the only option is SMD male Pin Header.
  • On logic board I have multiple options TH on bottom layer , or SMD on bottom layer or SMD on top layer with holes (the female header made for variable board height)

Problem: Since there is a high number of connections I am worried about soldering tolerance which might cause the 2-board to not mate correctly.

Question1: which of the 3 options of female headers would be more suitable ( I am thinking SMD is better since it has less play during soldering).

Question2: If no solution would give the required tolerance for all the headers to mate , should I consider reducing the number of headers ? (knowing that the layout and performance will be worse)

Any reference or guidance to where such information can be learned is highly appreciated.