I am designing a 2 board , thetwo boards. The bottom one is the power board that contains power switches on IMS (metal clad-clad board) , while the board on the top board is the logic board (4-layer FR4). boardBoard to board height is about 0.5".
theThe connection of signals from Toptop to bottom is through a 2.0mm0 mm dual row pin header.
- the number of headers is about 20pcs20 pcs of 2x2 arranged in 16mma 16 mm x 20mm20 mm grid.
- On the bottom board the only option is an SMD male Pin Headerpin header.
- On the logic board I have multiple options: TH on the bottom layer , or SMD on bottom layer or SMD on the top layer with holes (the female header is made for variable board heightheights).
Problem: Since there is a high number of connections I am worried about soldering tolerance which might cause the 2-boardtwo boards to not mate correctlyincorrectly.
Question1: Question 1: which of the 3three options offor female headers would be more suitable ( II am thinking SMD is better since it has less play during soldering).
Question2: Question 2: If no solution would give the required tolerance for all the headers to mate , should I consider reducing the number of headers ? (knowing that the layout and performance will be worse)?
Any reference or guidance to where such information can be learned is highly appreciated.