Timeline for What shapes can IC dies be?
Current License: CC BY-SA 4.0
4 events
| when toggle format | what | by | license | comment | |
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| Nov 26, 2023 at 4:11 | comment | added | Hearth | Note that areas too close to the edge are unusable for test circuits due to edge effects; even product dice too close to the edge of the wafer are frequently discarded without testing, simply because the chance of them working is near zero. Your PCM (test circuits), when needed, should be mixed in with the product dice, in my experience typically replacing one or more product dice. | |
| S Nov 20, 2023 at 5:32 | history | suggested | nobody | CC BY-SA 4.0 |
Remove meta-commentary
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| Nov 20, 2023 at 1:18 | review | Suggested edits | |||
| S Nov 20, 2023 at 5:32 | |||||
| Nov 19, 2023 at 10:49 | history | answered | Chester Gillon | CC BY-SA 4.0 |