Timeline for What shapes can IC dies be?
Current License: CC BY-SA 4.0
10 events
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| Nov 20, 2023 at 21:04 | comment | added | Hearth | @DanIsFiddlingByFirelight The last image is of such a device, though nowhere near as complex as the one you link. It's a full wafer being used as a single diode for extreme currents. | |
| Nov 20, 2023 at 19:19 | comment | added | Dan Is Fiddling By Firelight | Cerabras has made whole wafer size chips. anandtech.com/show/16626/… | |
| Nov 20, 2023 at 12:10 | vote | accept | Jacob Krall | ||
| Nov 20, 2023 at 0:55 | comment | added | Nayuki | Another example is that Canon made a 200 mm × 200 mm camera sensor, which is essentially a whole silicon wafer: dpreview.com/articles/7964414898/canonlargestsensor | |
| Nov 20, 2023 at 0:16 | comment | added | Hearth | @PeterCordes You theoretically could, but I have never heard of anyone doing so. It's rare enough that you'd have any reason to use non-rectangular dice in general, I can't imagine a situation where you'd want hexagonal and triangular dice. More likely you'd cut it like that and send the triangles back to the wafer plant to melt down into silicon for future wafers. That's what gets done with parts that come out bad, anyway. | |
| Nov 20, 2023 at 0:06 | comment | added | gnasher729 | I don't think anyone uses anything other than rectangular. Which also has the advantage that you can choose width and height independently. | |
| Nov 19, 2023 at 18:22 | comment | added | Peter Cordes | Interesting hex/triangle mix. Do people ever mix two different designs, one on the triangles and one on the hexes? I'd guess that's rare since the area ratios are fixed, but I guess one or the other shape could just have some unused space. It also means the production quantity ratios are fixed (modulo yield and ability to use part of a die with a defect), unless you also have a wafer of just triangles (which tiles the plane with straight cuts). Maybe P-core vs. E-core for stacked packaging? Or I/O + cache substrate vs. cores? Or just different chips to package separately. | |
| Nov 19, 2023 at 14:04 | history | edited | Hearth | CC BY-SA 4.0 |
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| Nov 19, 2023 at 3:10 | history | edited | Hearth | CC BY-SA 4.0 |
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| Nov 19, 2023 at 3:00 | history | answered | Hearth | CC BY-SA 4.0 |