Timeline for Why might a 40 year old single chip processor have failed?
Current License: CC BY-SA 4.0
6 events
| when toggle format | what | by | license | comment | |
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| Dec 23, 2021 at 16:46 | vote | accept | emrys57 | ||
| Dec 22, 2021 at 16:11 | comment | added | emrys57 | Christian B, great answer, thanks! Those papers are very relevant. And yes, I probably should have tried to dry the DMM out, perhaps for months, before powering it up: more fool me. Thanks for your help. | |
| Dec 22, 2021 at 16:09 | comment | added | emrys57 | parkside, water can get into plastic packages. eg semanticscholar.org/paper/… | |
| Dec 22, 2021 at 11:58 | comment | added | parkside | But is there really much of a moisture path in a DIP packaged chip? The resin thoroughly coats the wire frame, and the only path towards the silicon would be the tiny tunnels of the bond wires right? Sure with some differential thermal expansion in time there might be a slight path, but I'd think one could consider the silicon pretty much hermetically sealed? Or is the plastic itself porous/permeable? | |
| Dec 21, 2021 at 15:36 | comment | added | linuxfan says Reinstate Monica | This leads me to think: when a device is powered, the internal heat helps humidity to go away. May be 1 hour a day help in preserving electronic devices from humidity? | |
| Dec 21, 2021 at 15:31 | history | answered | Christian B. | CC BY-SA 4.0 |