Does somebody know how I can detect a layer of IGBT modules in which a thermal failure, e.g., voids, cracks, delaminations of solder joints, has taken place? We know there is fatigue in both solder joints of wire-bond IGBT power modules, one joint is between chip and DBC and another joint is between DBC and baseplate. When operating IGBT module, how can I find which joint is degraded? Is there a specific technique to detect it in practice?
