Lapmaster Wolters GmbH

Achieving #Sustainability with Advanced Technology: Inner Diameter Saws for Diverse Workpieces Balancing technological #innovation and sustainability is a challenge in today's production landscape. Lapmaster Wolters' factory-overhauled Inner Diameter and Outer Diameter saws provide a sustainable solution by revitalizing over 30-year-old machines. Through meticulous disassembly, mechanical and electrical upgrades, and integrating user-friendly, high-automatic HMIs, we've created state-of-the-art equipment for the TS23, TS207, and TS121 models. These saws offer impressive flexibility, accommodating various workpiece sizes while maintaining the highest #precision and stability standards. They find homes in industries like #semiconductors, #optics, #magnets, #ceramics, and more! ➡ Curious to learn more? 💡 Connect with us to discover the advantages of Lapmaster Wolters' innovative solutions tailored to your needs. ________ #Sustainability #CuttingEdgeTech #PrecisionSlicing #HighPrecision #LapmasterWolters #InnovationLeaders #DiamondWireTechnology #Photovoltaic

In our next series we are looking at our slicing equipment. Join us to explore how we can support you: 🔬 Diamond Wire Slicing with Lapmaster Wolters 🔧 At Lapmaster Wolters, we've set the benchmark in the realm of slicing technologies for hard and brittle materials, achieving substantial material and cost savings. In #semiconductor, #optical, #photovoltaic, and other industries, a substantial growing list of applications uses environmentally friendly diamond wire technology. ✨ Diamond Wire Slicing: Our multi wire saws, equipped with a longer wire web and ultra-thin diamond wires enable increasing numbers of wafers to be sliced faster at top quality and with outstanding precision. 💡 Cutting Costs, Elevating Efficiency: Recognizing diamond wire's pivotal role in wafer manufacturing costs, our diamond wire slicing systems deliver innovative solutions that significantly reduce overall operating expenses. 🌐 Flexible DW288 & DW292 Platforms: The DW288 and DW292 platforms offer versatility for varying workpiece dimensions. The advantages of these machines, which are equipped with a workpiece rocking unit, the patented diamond wire management system, and other functions, include low-temperature dependency, stabilized slicing conditions, higher material yield, and reduced downstream process efforts. ➡ Interested? 💡 Contact us to learn how you too can benefit from solutions engineered by Lapmaster Wolters. #PrecisionSlicing #InnovationLeaders #LapmasterWolters #DiamondWireTechnology #Semiconductor #Optics #Photovoltaic

From boule to wafer – Flat finishing solutions from a single source.   In the last part of our mini-series „From boule to wafer“ we would like to take a look at what we discovered within the last weeks and sum up the advantages of having production chains out of one single source.   We started this mini-series with introducing Lapmaster Wolters wide machine portfolio and covering several steps of the silicon-carbide wafering production chain. Advanced technology like the rocking on our DW288 or the UPAC-system on the AC 1500 DMP and AC 1500 CMP are crucial increments that lead to significant advantages regarding wafering quality, throughout a Cost of Ownership. Especially with 8“ #SiC wafers it is necessary to provide highest quality standards for safe and cost-effective production.   Additionally to our machine portfolio, we showed our value-adding range of #consumables, which enable several dimensions of process scaling, either to push highest quality or to allow a rather throughout and Cost of Ownership focused production. Our already pre-selected machine and consumables combinations support customers with a faster tool integration and facilitate highest productivity.   Lapmaster Wolters solutions portfolio at a glance: 👉 Advanced slicing technology for highest quality at best-in-class yield 👉 Double-sided polishing tools for highest throughput for 6“ or 8“ SiC wafering 👉 UPAC-system for ideal polishing gaps and crash-protection solution 👉 Suitable consumables for every manufacturing target and scalability 👉 Global availability to offer customers fast and individual support   If you liked our mini-series or are interested in our solutions, please get in contact with us.   By the way, we have decades of experience with all kind of grinding, lapping, and polishing solutions. For any kind of support, reach out to us or comment under this post!     #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #silicon #siliconcarbide #consumables #slurry #polishing #wireslicin #CoO

From boule to wafer - flat finishing equipment from a single source   The next part of our mini-series "From boule to wafer" is all about our comprehensive #consumables portfolio for our double-sided product portfolio.   Consumables are a main driver to scale wafer manufacturing processes in a multi-dimensional direction. The selection of suitable consumables, such as pads and slurries for polishing processes enables operators to tune their processes regarding different production targets. Through this, operators can for example modify their processes up to the highest possible surface quality results by choosing an appropriate pad-slurry-combination but are alternatively able to change the selection to improve the total machine throughput to a maximum.   To support our customers, our #ProcessExperts are continuously working on the evaluation and qualification of improved consumables selections to be able to offer perfectly matching consumables to our sophisticated machine portfolio. We are driven to offer our customers a comprehensive solutions portfolio to support with:   👉 Process specific consumable pre-selections and recommendations 👉 Cost of Ownership optimized consumable combinations 👉 Scalable processes on the same machine base 👉 Comprehensive system solutions 👉 In-house process department for customizations and tests of individual process requirements   Would you like to learn more? Please feel free to contact us! ___ #LapmasterWolters #PeterWolters #innovation #semiconductor #consumables #wafer #silicon #siliconcarbide #SiC #polishing #pad #slurry #CoO

From boule to wafer - flat finishing equipment from a single source   The third part of our mini-series "From Boule to Wafer" is all about our new AC 1500 #CMP. Our latest machine in the portfolio is specially optimized for the chemical-mechanical polishing (CMP) of 8" SiC wafers and offers market-leading quality results in addition to optimized #CostofOwnership.   Thanks to the established AC 1200 CMP, we are well aware of the special requirements of our customers in the silicon carbide market. The enormous hardness of #SiC requires the use of aggressive process media for etching the surfaces, which brings with it special challenges in the area of material resistance of surfaces and seals. Carrying out risk analyses of directly and indirectly affected components helped us to identify potential weak points in the system during the design phase and eliminate them preventively.   Advantages of the AC 1500 CMP at a glance: - Best-in-class TTV and roughness results due to advanced process control - Highest throughput via batch polishing of 30 6" or 18 8" wafers - Integrated crash protection ability due to patented #UPAC technology - Optimized Cost of Ownership at highest surface finishing level - Comprehensive consumable solutions for all around process support   Would you like to learn more? Please feel free to contact us! ___ #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #siliconcarbide #cmp #polishing #CoO

From boule to wafer - flat finishing equipment from a single source   The third part of our mini-series "From Boule to Wafer" is all about our new AC 1500 #CMP. Our latest machine in the portfolio is specially optimized for the chemical-mechanical polishing (CMP) of 8" SiC wafers and offers market-leading quality results in addition to optimized #CostofOwnership.   Thanks to the established AC 1200 CMP, we are well aware of the special requirements of our customers in the silicon carbide market. The enormous hardness of #SiC requires the use of aggressive process media for etching the surfaces, which brings with it special challenges in the area of material resistance of surfaces and seals. Carrying out risk analyses of directly and indirectly affected components helped us to identify potential weak points in the system during the design phase and eliminate them preventively.   Advantages of the AC 1500 CMP at a glance: - Best-in-class TTV and roughness results due to advanced process control - Highest throughput via batch polishing of 30 6" or 18 8" wafers - Integrated crash protection ability due to patented #UPAC technology - Optimized Cost of Ownership at highest surface finishing level - Comprehensive consumable solutions for all around process support   Would you like to learn more? Please feel free to contact us! ___ #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #siliconcarbide #cmp #polishing #CoO

From boule to wafer - flat finishing equipment from a single source   The third part of our mini-series "From Boule to Wafer" is all about our new AC 1500 #CMP. Our latest machine in the portfolio is specially optimized for the chemical-mechanical polishing (CMP) of 8" SiC wafers and offers market-leading quality results in addition to optimized #CostofOwnership.   Thanks to the established AC 1200 CMP, we are well aware of the special requirements of our customers in the silicon carbide market. The enormous hardness of #SiC requires the use of aggressive process media for etching the surfaces, which brings with it special challenges in the area of material resistance of surfaces and seals. Carrying out risk analyses of directly and indirectly affected components helped us to identify potential weak points in the system during the design phase and eliminate them preventively.   Advantages of the AC 1500 CMP at a glance: - Best-in-class TTV and roughness results due to advanced process control - Highest throughput via batch polishing of 30 6" or 18 8" wafers - Integrated crash protection ability due to patented #UPAC technology - Optimized Cost of Ownership at highest surface finishing level - Comprehensive consumable solutions for all around process support   Would you like to learn more? Please feel free to contact us! ___ #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #siliconcarbide #cmp #polishing #CoO

From boule to wafer - flat finishing equipment from a single source   We are dedicating the second part of our mini-series "From boule to wafer" to the mechanical polishing (#DMP) of 8" SiC wafers. The AC 1500 DMP, specially optimized for 8" wafers, is the ideal tool for maximum throughput with minimum #CostofOwnership.   The AC 1200 DMP was our entry-level machine in the #SiC market, with which we were the first supplier to succeed in establishing a double-sided batch process. Thanks to its load volume of 35 4" and 14 6" wafers, customers were able to multiply their output of pre-polished wafers with just one machine. This path is now being continued with the AC 1500 DMP, which once again sets new standards in batch polishing with 30 6" and 18 8" wafers.   We are also aware that the high costs associated with SiC wafers mean that the highest demands are made on load safety and process stability, especially when processing several wafers in parallel. With our patented #UPAC system, which adaptively adjusts the geometry of the upper working wheel, we are able to actively maintain the polishing gap in perfect parallelism and thus protect valuable charges from costly crashes.   Interested? Contact us to find out more about our double-sided polishing processes and the new AC 1500 DMP! #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #siliconcarbide #dmp #polishing #CoO

Die Aus- aber auch Weiterbildung von #Talenten liegt uns seit Jahrzehnten am Herzen und wird aktiv gelebt. Dabei spielt auch der Austausch mit anderen Ausbildungsbetrieben, speziell gemeinsam Ausbildungsberufe noch attraktiver und abwechslungsreicher zu gestalten, eine große Rolle. Gerade in Zeiten des Fachkräftemangels sehen wir dies als unerlässlich. Unsere Azubis von heute sind unsere Fach- und Führungskräfte von morgen. Deshalb investieren wir in die #Ausbildung. Das bedeutet nicht nur das Durchlaufen sämtlicher Abteilungen, sondern auch die Teilnahme an speziellen Azubiprojekten und Planspielen. Darüber hinaus stehen unsere Türen immer für Schülerpraktikanten/-innen und Schüler/-innengruppen offen, um einen ersten Einblick zu bekommen. Bei Interesse freuen wir uns über eine E-Mail an jobs@lapmaster-wolters.de. #Rendsburg #LapmasterWolter #Fachkräfte #Zukunft #Praktikum

From boule to wafer - flat finishing equipment from a single source   We are dedicating the second part of our mini-series "From boule to wafer" to the mechanical polishing (#DMP) of 8" SiC wafers. The AC 1500 DMP, specially optimized for 8" wafers, is the ideal tool for maximum throughput with minimum #CostofOwnership.   The AC 1200 DMP was our entry-level machine in the #SiC market, with which we were the first supplier to succeed in establishing a double-sided batch process. Thanks to its load volume of 35 4" and 14 6" wafers, customers were able to multiply their output of pre-polished wafers with just one machine. This path is now being continued with the AC 1500 DMP, which once again sets new standards in batch polishing with 30 6" and 18 8" wafers.   We are also aware that the high costs associated with SiC wafers mean that the highest demands are made on load safety and process stability, especially when processing several wafers in parallel. With our patented #UPAC system, which adaptively adjusts the geometry of the upper working wheel, we are able to actively maintain the polishing gap in perfect parallelism and thus protect valuable charges from costly crashes.   Interested? Contact us to find out more about our double-sided polishing processes and the new AC 1500 DMP! #LapmasterWolters #PeterWolters #innovation #semiconductor #wafer #siliconcarbide #dmp #polishing #CoO