Together with Specim, Spectral Imaging Ltd. we work on comprehending the invisible. Specim cameras are integrated into our solutions enabling a comprehensive, non-destructive and fast industrial inspection through Hyperspectral imaging. Thank you!
🚀 Learn how DIVE imaging systems GmbH is setting new standards in wafer inspection by adopting hyperspectral imaging. DIVE combines hardware and software to create a fully integrated, comprehensive surface and layer analysis solution. By integrating #SpecimFX10 and #SpecimFX17 hyperspectral cameras, DIVE has achieved exceptional accuracy and speed in their wafer inspection processes. HSI provides several advantages in wafer inspection over traditional imaging methods: 🔬 Non-invasive measurement ✅ Complete area coverage with 100% Inspection 🔍 Reveals previously unknown quality-determining parameters. ⚡ Rapid scanning with increased throughput 📉 Enhanced reliability 🎯 Contributes Zero Defect Goal ♻️ Direct inspection of production wafers reduces costs and waste DIVE focuses on performance surfaces and thin film applications, ensuring meticulous quality control essential for semiconductor manufacturing and beyond. #HyperspectralImaging #WaferInspection #Semiconductors #MachineVision #Innovation